JEDEC JESD22-A113G-2015 Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing.pdf
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1、JEDEC STANDARD Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing JESD22-A113G (Revision of JESD22A113F, October 2008) OCTOBER 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION NOTICE JEDEC standards and publications contain material that has been prepared, reviewed, and a
2、pproved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability
3、 and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and publications are adopted without regard
4、 to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publications. The information included in JEDEC st
5、andards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be further processed and ultimately become an
6、ANSI standard. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC at the address below, or refer to www.j
7、edec.org under Standards and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2015 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC retains the copyright on this material.
8、 By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced without permission. For information, contac
9、t: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. JEDEC Standard No. 22-A113G -i- Test Method A113G (Revision of A113F) TEST METHOD A113G PRECONDITIONING OF NONHERMETI
10、C SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING Foreword This document provides an industry standard test method for preconditioning packaged devices that is representative of a typical industry multiple solder reflow operation. Introduction The typical use of surface mount devices (SMD) involv
11、es subjecting the SMDs to elevated temperatures during board assembly, which, by itself or combined with moisture in the package can induce internal package damage that could be a reliability concern. Preconditioning of SMD packages is used to simulate the effects of board assembly prior to reliabil
12、ity testing. This allows reliability testing at the packaged device level on as shippable products with a board assembly simulation. During preconditioning, test samples are subjected to temperature cycling (optional), dry bake, moisture soaking, solder reflow simulation, flux, rinse, dry, and elect
13、rical test before reliability testing. This test method references the reflow profiles stated in J-STD-020. If a packaged device is not able to withstand the full thermal profile as stated in J-STD-020, J-STD-075 should be used to evaluate and classify process sensitivities. JEDEC Standard No. 22-A1
14、13F Test Method A113F -ii- (Revision of A113E) JEDEC Standard No. 22-A113G Page 1 Test Method A113G (Revision of A113F) TEST METHOD A113G PRECONDITIONING OF NONHERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING (From JEDEC Board ballot JCB-15-32, formulated under the cognizance of the JC-14
15、.1 Subcommittee on Reliability Test Methods for Packaged Devices.) 1 Scope This Test Method establishes an industry standard preconditioning flow for nonhermetic solid state SMDs that is representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appr
16、opriate preconditioning sequence of this document by the manufacturer prior to being submitted to specific in-house reliability testing (qualification and reliability monitoring) to evaluate long term reliability (which might be impacted by solder reflow). NOTE For good correlation of results betwee
17、n moisture/reflow-induced stress sensitivity testing (per J-STD-020 and JESD22-A113) and actual reflow conditions used, identical temperature measurements by both the SMD manufacturer and the board assembler are necessary. Therefore, it is recommended that the package temperature at the top center o
18、f the package be determined during assembly board reflow profile setup, to ensure that it does not exceed the evaluation temperature based on package thickness and volume as stated in J-STD-020. 2 Normative reference IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Sol
19、id State Surface Mount Devices IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices ECIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes JESD22-A104, Temperature Cycling JESD625, Requirements for Handli
20、ng Electrostatic Discharge Sensitive (ESD) Devices JESD47, Stress-Test-Driven Qualification of Integrated Circuits JESD94, Application Specific Qualification Using Knowledge Based Test Methodology JEDEC Standard No. 22-A113G Page 2 Test Method A113G (Revision of A113F) 3 Apparatus This test method r
21、equires use of the following equipment. 3.1 Temperature and humidity chamber Moisture chamber(s) capable of operating at 85 C/85% RH, 85 C/60% RH, and 30 C/60% RH. Within the chamber working area, temperature tolerance must be 2 C and the RH tolerance must be 3% RH. A chamber with 60 C/60% RH capabi
22、lity is optional for accelerated soak conditions (See J-STD-020). 3.2 Solder reflow equipment a) (Preferred) - Full Convection reflow system capable of maintaining the reflow profiles required by this standard. b) Infrared (IR)/Convection solder reflow equipment capable of maintaining the reflow pro
23、files required by this standard. It is required that this equipment use IR to heat only the air and not directly impinge upon the SMD packages under test. NOTE The moisture/reflow and process sensitivity classification test results are dependent upon the package body temperature (rather than the ref
24、low carrier and/or package terminal temperature). 3.3 Optical microscope Optical Microscope (40x for external visual exam). 3.4 Electrical test equipment Electrical test equipment capable of performing room temperature dc and functional tests. 3.5 Bake oven Bake oven capable of operating at 125 +5/-
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