GOST R 55492-2013 Electronics assembly technology Part 3 Selection guidance of environmental and endurance test methods for solder joints《电子组装技术 第3部分 焊接点的环境和耐久性试验方法选择指南》.pdf

《GOST R 55492-2013 Electronics assembly technology Part 3 Selection guidance of environmental and endurance test methods for solder joints《电子组装技术 第3部分 焊接点的环境和耐久性试验方法选择指南》.pdf》由会员分享，可在线阅读，更多相关《GOST R 55492-2013 Electronics assembly technology Part 3 Selection guidance of environmental and endurance test methods for solder joints《电子组装技术 第3部分 焊接点的环境和耐久性试验方法选择指南》.pdf（43页珍藏版）》请在麦多课文档分享上搜索。

1、 554922013/IEC/PAS62137-3:2008 3 IEC/PAS 62137-3:2008Electronics assembly technology Part 3: Selection guidance of environmentaland endurance test methods for solder joints(IDT) 1 - (-) / 91 , 42 420 , , , 3 3 28 2013 . 375-4 I/S 62137-3:2008 - . 3. (IEC/PAS 62137- 3:2008 Electronics assembly techno

2、logy Part 3:Selection guidance of environmental and endurance test methods for solder joints). - - , 5 1.02012 ( 8). ( 1 ) , -. () . , - - (gost.ru). , 2014 , - - II 554922013/IEC/PAS 62137-3:20081 12 .13 24 .35 55.1 .55.2 , 75.2.1 .75.2.2 , .96 .106.1 .106.2 116.2.1 116.2.2 .116.2.3 .126.3 146.3.1

3、( ) 146.3.2 ( Bi58Sn42) .146.3.3 ( ) ( Sn91Zn9 Sn89Zn8Bi3) .146.4 .147 .157.1 . . . 157.1.1 157.1.2 .157.1.3 167.1.4 167.1.5 .177.2 177.3 197.4 .207.4.1 .207.4.2 217.5 , 217.5.1 , .217.5.2 , 22 () .23 () .25 () 26 D () 29 () 31 F () .33 G () 34 H () , 36 () 38 39III 554922013/IEC/PAS 62137-3:2008 (I

4、EC) 62137-3 91: - . IEC/PAS 62137-3, 2008 , . , , :- ;- ;- , . IEC 62137 web- .IV 554922013/IEC/PAS 62137-3:2008 3 Electronics assembly technology. Part 3. Selection guidance of environmental and endurance test methodsfor solder joints 201312011 1) - , - (SMD), , , .2 . . - ( ). 60194 . , . (Printed

5、 board design, manufacture and assembly Terms and definitions) 61188-5 ( ) . - (Printed boards and printed board assemblies Design and use) 61249-2-7 . 2-7. . , ( ), - (Materials for printed boards and other interconnecting structures Part 2-7: Reinforcedbase materials clad and unclad Epoxide woven

6、E-glass laminated sheet of defined flammability (verticalburning test), copper-clad 62137-1-1:2007 . - . 1-1. - (Surface mounting technology Environmental and endurance test methods forsurface mount solder joint Part 1-1: Pull strength test) 62137-1-2:2007 . - . 1-2. - (Surface mounting technology E

7、nvironmental and endurance test methods forsurface mount solder joint Part 1-2: Shear strength test)1) , .1 554922013/IEC/PAS 62137-3:2008 62137-1-3:2008 . - . 1-3. -(Surface mounting technology Environmental and endurance test methodsfor surface mount solder joint Part 1-3: Cyclic drop test) 62137-

8、1-4:2009 . - . 1-4. -(Surface mounting technology Environmental and endurance test methods forsurface mount solder joint Part 1-4: Cyclic bending test) 62137-1-5:2009 . - . 1-5. - (Surface mounting technology Environmental andendurance test methods for surface mount solder joints Part 1-5: Mechanica

9、l shear fatigue test)3 60194, - :3.1 (pull strength for SMD): - , , 45 .IEC 62137-1-1:2007, 3.2 (shear strength forSMD): , , , .IEC 62137-1-1:2007, 3.3 - (torque shear strength for SMD): , , - / - .3.4 , (monotonic bending strength for SMD): - , , , - , , .3.5 (cyclicbending strength for SMD): , , /

10、 - , .IEC 62137-1-4:2009, 3.6 (mechanical shear fatigue strength for SMD): , ( ), , , - , , 2 554922013/IEC/PAS 62137-3:2008 , - .3.7 (cyclicdrop test for SMD): - -, .3.8 (cyclic steel balldrop strength for SMD): , - .3.9 , (pullstrength for lead insertion type device): , - , , , .3.10 , - (creep strength for lead insertion type device): , - , , .3.11 , (fillet lifting phenomenon for lead insertion type device): , ().3.12 (daisy chain): , (. .2). - .4 , , 1.