GEIA-HB-0005-1-2006 Program Management Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics《管理过渡到无铅电子产品项目管理 系统工程指引》.pdf

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1、GEIA ENGINEERING BULLETIN Program Management/Systems Engineering Guidelines For Managing The Transition To Lead-Free Electronics GEIA-HB-0005-1 June 2006 GOVERNMENT ELECTRONICS AND INFORMATION TECHNOLOGY ASSOCIATION A Sector of the Electronic Industries Allianc Copyright Government Electronics 2002/

2、95/EC Restriction of Hazardous Substances (RoHS) and 2002/96/EC Waste Electrical and Electronic Equipment (WEEE) that restrict or eliminate the use of various substances in a variety of products that are produced after July 2006. One of the key materials restricted is lead (Pb), which is widely used

3、 in electronic solder and electronic piece part terminations. While these regulations may appear to only affect products for sale in the EU, due to the reduced market share of the aerospace and high performance industry in electronics, many of the lower tier suppliers will change their products beca

4、use their primary market is consumer electronics. Additionally, several U.S. states have enacted similar “green” laws and many Asian electronics manufacturers have recently announced completely green product lines. Since the aerospace industry is one of the few major industrial sectors that still re

5、pair Circuit Card Assemblies (CCAs) and since Pb-free materials and processes are relatively immature and poorly understood, an aerospace-wide approach to the transition was deemed to be highly valuable . 111 Copyright Government Electronics examples include circuit card assemblies and wire harnesse

6、s. COTS is defined as “commercial off the shelf. It can apply to a piece part, assembly, or unit. Critical item or function, if defective, will result in the systems inability to retain operational capability, meet primary objective, or affect safety. Customer refers to an entity or organization tha

7、t (a) integrates a piece part, soldered assembly, unit, or system into a higher level system, (b) operates the higher level system, or (c) certifies the system for use. For example, this may include end item users, integrators, regulatory agencies, operators, original equipment manufacturers (OEMs),

8、 and subcontractors. High Performance System or Product requires continued performance or performance on demand, or equipment down time cannot be tolerated, or end-use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems L

9、ead-free is defined as less than O. 1% by weight of lead in accordance with Waste Electrical and Electronic Equipment (WEEE) guidelines Lead-free Control Plan (LFCP) refers to an aerospace or military system suppliers document that defines the processes that assure the plan owners, their customers,

10、and all other stakeholders that aerospace and high performance high-reliability electronics systems containing Pb-free solder will continue to be reliable, safe, producible, affordable, and supportable. An acceptable LFCP, per GEIA-STD-0005-1, will fulfill all intentions of the standard. ANSUASQC Q9

11、000 documentation may provide a strong basis for the control plan. Technical guidance on evaluating an adequate LFCP can be found in GEIA-HB-0005-2. May indicates a course of action that is permissible within the limits of this handbook, but not required. Pb-free Tin is defined to be pure tin or any

12、 tin alloy with pend3x B). 6.2 Additional Prime Contractor Requirements Additional prime contractor requirements need to be re-assessed with regard to a possible Pb- free transition. 6.3 Change Control The program manager should determine if any change from SnPb to Pb-free constitutes a change for w

13、hich customer approval is needed. The purpose is to assure that configuration control, traceability, and marking are properly controlled. 7 Use Environment(s) 7.1 Impact on Use Environment(s) The use environment(s) is defined by the program requirements. The program manager needs assurance from the

14、supplier that the transition from SnPb to Pb-free solder will not impact reliability of the product in the use environment. The consideration here is whether or not Pb- free solder will behave differently than SnPb solder in the use environment. 7.2 Impact on Storage and Transport The program manage

15、r or a designee should evaluate the storage and transport requirements with respect to any Pb-free implementation. The impact of SnPb versus Pb-free solder on long-term storage or transport environment could be significant and needs to be evaluated as part of the risk management plan. 8 Decision Cri

16、teria 8.1 Program Decision Concerning Pb-free The program manager must choose whether or not any Pb-free will be accepted. This decision should be based on customer feedback, risk analyses, system engineering analyses, and supplier 9 Copyright Government Electronics determine if this changes the sco

17、pe of any contracts. Assess impact on reliability of the piece part, assembly, unit and the system. Assess safety issues. Review maintainability requirements and determine the impact on frequency of maintenance. Assess impact on the components of the system that interface with the delivered product.

18、 Assess impacts on test equipment and/or test facilities. Determine any required changes in support equipment. Identification of the hardware, piece parts, and shipping containers. Determine any changes to the drawing requirements, solder callouts, process specifications and conformal coatings. Supp

19、lier Management Issues o Determine the availability of alternative suppliers. o Determine the feasibility of a lifetime buy of the old part. o Controls are in place for screeningheceiving Pb-free finishes piece parts. o Evaluate suppliers internal delivery schedule for any new parts. o Assess relati

20、onships of supplier to vendor: o Is suppliers vendor new or existing? o If new, can former vendor continue delivering the old part? o Evaluate risks due to changes of suppliers and vendors o Schedule o cost o Technical o Assess any opportunities for schedule or cost savings. Schedule Issues o Evalua

21、te impact on the following: o Critical path o Activities on the near-critical paths 17 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-GEIA-HB-0005-1 o Del

22、iveries to test and evaluation activities o Assess schedule impact due to any additional required tests or equipment. o Determine and evaluate risks due to any change in schedule. Cost Issues o Determine if any cost savings will be shared by the supplier. o Assess cost impact due to any schedule or

23、technical requirements changes: o Supplier costs o Internal labor costs o Costs of additional testing/qualification (facility, labor, equipment) Configuration Management o Ensure new part is included in CM documentation. o Alert other programs within the organization that use the same part. o Ensure

24、 processes are in place to handle field returns and rework or repair of field returns. 18 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-GEIA-HB-0005-1 Ap

25、pendix D - General Manufacturing Process Assessment Checklist For Assessing Supplier Compliance to GEIA-STD-0005-1 This tool may be used for assessing a suppliers compliance to the requirements of GEIA-STD- 0005-1. However, it may also be used to assess a suppliers compliance to the intent of GEIA-

26、STD-0005- 1, if the supplier is not familiar with the standard. GEIA-STD-0005-1 VERIFICATION CHECKLIST (A) Documentation: 1. 2. 3. 4. 5. 6. 7. Does the facility recognize GEIA-STD-0005-1 for mitigating the risks associated with Pb-free products, processes, and piece parts? If yes, what revision? If

27、not, what is the status of document recognition? Does the facility recognize GEIA-STD-0005-2 for mitigating the effects of tin finishes on piece parts? If yes, what revision? If not, what is the status of document recognition? Does the facility have a Lead-Free Control Plan based on the requirements

28、 of GEIA-STD-0005-I? If not, does the facility have a Pb-free soldering performance plan? Does the documentation that travels with the product during fabrication delineate all uses of Pb-free in the product(s) and processes? Are work instructions adequate so that identified personnel can recognize w

29、here Pb-free piece parts and/or processes are introduced? Record which processes the manufacturing facility considers key or critical to Pb-free risk mitigation? yEs- NO - N/A O00 o o o o o o o o o o o o o o o o o 19 Copyright Government Electronics & Information Technology Association Provided by I

30、HS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-GEIA-HB-0005-1 nun 8. Does the supplier have procedures that ensure that Pb-free processes meet the drawing requirements? Describe the method(s) that the supplier uses. 9. Are certifications

31、/records available indicating that solderability and piece part finishes have been tested? non IO. Are the piece parts tested by lot date code? Record the frequency and sampling plan. 11. Do procedures require that defects on Pb-free-finished piece parts be specifically documented prior to any rewor

32、k or repair action? non 12. Do maintenance instructions identify critical areas/surfaces that need to be maintained on critical Pb-free process equipment, such as the following: a) Hot air solder leveler, if applicable? b) Wave solder unit? c) Convection, Infra-red (IR), or convection IR reflow unit

33、? d) Rework or repair equipment? e) Other? no no no no nu 13. non 14. 20 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-GEIA-HB-0005-1 (B) Materials: (BI)

34、 - Material - Piece parts: yEs- NO - NIA Is there established acceptance criteria for piece parts used by the supplier? List the reference document(s). What are the finishes of the piece parts used by the supplier: SnIPb? Approximate % of production piece parts = Tin? Approximate % of production pie

35、ce parts = nun nnn nnn nnn nnn Gold? Approximate % of production piece parts = Pb-free (no specific Pb-free callout) or RoHS-compliant? Approximate % of production piece parts? Other? Approximate % of production piece parts = Explain how piece parts with Pb-free finishes are controlled in storage: S

36、nIPb? Pb-free tin? Gold? Pb-free (no specific Pb-free callout) or RoHS-compliant? Other? Explain how piece parts with Pb-free finishes are controlled on the manufacturing floor (.e. kitting, soldering processes, assembly): SnIPb? Pb-free tin? Gold? Pb-free (no specific Pb-free callout) or RoHS compl

37、iant? Other? Does the supplier reidentify the piece part piece part finish if Pb-free? nnn nun nnn nnn nnn nnn nun nnn nun nnn nn 21 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted wit

38、hout license from IHS-,-,-GEIA-HB-0005-1 (B2) Material - Printed Wiring Boards (PWBs): 6. Is there an established acceptance criteria for printed wiring boards used by the supplier? List the reference document(s). 7 What are the finishes of the printed wiring boards used by the supplier: Fused Sn/Pb

39、? Approximate % of production PWBs = Hot Air Solder Leveling? Approximate % of production PWBs = Immersion Pb-free tin? Approximate % of production PWBs = Immersion silver? Approximate % of production PWBs = Electroless Nickel/Gold (ENIG)? Approximate % of production PWBs = f) Organic solderability

40、preservative (OSP)? Approximate % of production PWBs =- Other? Approximate % of production PWBs = Explain how PWBs with Pb-free finishes are controlled in storage: Fused Sn/Pb? Hot Air Solder Leveling? Immersion Pb-free tin? I m me rs ion si Ive r? Electroless Nickel/Gold (ENIG)? Organic solderability preservative (OSP)? Other? nu nn nn nn nn nn nn nun nnn nnn nnn nnn nun nnn 22 Copyright Government Electronics & Information Technology Association Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-