FORD WSF-M11A44-A3-2012 SOLDER PASTE (62 Tin 36 Lead 2 Silver RMA Flux No-Clean Stencil Printable) HIGH VISCOSITY TO BE USED WITH FORD WSS-M99P1111-A (Shown on FORD WSF-M11A44-A2.pdf
《FORD WSF-M11A44-A3-2012 SOLDER PASTE (62 Tin 36 Lead 2 Silver RMA Flux No-Clean Stencil Printable) HIGH VISCOSITY TO BE USED WITH FORD WSS-M99P1111-A (Shown on FORD WSF-M11A44-A2.pdf》由会员分享,可在线阅读,更多相关《FORD WSF-M11A44-A3-2012 SOLDER PASTE (62 Tin 36 Lead 2 Silver RMA Flux No-Clean Stencil Printable) HIGH VISCOSITY TO BE USED WITH FORD WSS-M99P1111-A (Shown on FORD WSF-M11A44-A2.pdf(4页珍藏版)》请在麦多课文档分享上搜索。
1、 ENGINEERING MATERIAL SPECIFICATION Date Action Revisions 2012 07 25 N-Status No replacement A. Wedepohl, NA 2005 02 08 Revised Inserted 3.0; Deleted 3.1, 3.2, 3.7, 3.8, 4 1992 11 23 Released Released A2. Released A3 and A4 on 1993 03 31 L. Rumao Controlled document at www.MATS Copyright 2012, Ford
2、Global Technologies, LLC Page 1 of 4 SOLDER PASTE (62 Tin/36 Lead/2 Silver, RMA Flux, NOT FOR NEW DESIGN WSF-M11A44-A2 No-Clean, Stencil Printable) SOLDER PASTE (62 Tin/36 Lead/2 Silver, RMA Flux, NOT FOR NEW DESIGN WSF-M11A44-A3 No-Clean, Stencil Printable), HIGH VISCOSITY SOLDER PASTE (62 Tin/36 L
3、ead/2 Silver, RMA Flux, NOT FOR NEW DESIGN WSF-M11A44-A4 No-Clean, Screen Printable) 1. SCOPE The materials defined by these specifications are RMA 62 Sn/36 Pb/2 Ag solder pastes. These solder pastes are a homogeneous suspension of a prealloyed solder powder in a specially formulated screening and f
4、luxing vehicle system. 2. APPLICATION These specifications were released for conductive material used as a printable solder for surface mount connections and other applications where the use of a corrosive flux must be avoided. Post reflow cleaning may not be required. This solder paste was designed
5、 to be stencil or screen printed on circuit boards and reflowed using either convection or infrared soldering. 3. REQUIREMENTS This solder paste is a homogeneous suspension of a prealloyed solder powder in a specially formulated fluxing vehicle. All qualification testing shall be done at 25 +/- 2 C
6、and 50 +/- 3% relative humidity, unless otherwise specified. 3.0 STANDARD REQUIREMENTS FOR PRODUCTION MATERIALS Material suppliers and part producers must conform to the Companys Standard Requirements For Production Materials (WSS-M99P1111-A). 3.3 COMPOSITION (IPC-SP-819, Section 4.4, 50 gram sample
7、 required) A2 A3 A4 Solder Metal, weight % 87.5 - 88.5 90.5 - 91.5 89.5 - 90.5 Vehicle Balance Balance Balance ENGINEERING MATERIAL SPECIFICATION WSF-M11A44-A2/A3/A4 Copyright 2012, Ford Global Technologies, LLC Page 2 of 4 3.3.1 Solder Metal Composition, Atomic Percent Tin 61.5 - 62.5 Silver 1.8 -
8、2.2 Zinc 0.003 max Antimony 0.30 max Bismuth 0.25 max Copper 0.08 max Iron 0.03 max Aluminum 0.005 max Other Elements 0.08 max Cadmium 0.005 max Lead Remainder 3.3.2 Vehicle Composition, weight percent (IPC-SP-819, Section 4.4, 50 gram sample required) Bake reflowed solder bead at 160 C for 5 hr and
9、 calculate flux percent using the following equation: Wp - Wc - Wb - x 100 = Wf % Wp - Wc Wp = Weight of paste before reflow Wc = Weight of cleaned solder bead Wb = Weight of baked solder bead Wf % = Weight percent of flux A2 A3 A4 Flux, % 66.7 62.5 57.0 Solvent Balance Balance Balance 3.4 INDIVIDUA
10、L COMPONENT PROPERTIES 3.4.1 SOLDER POWDER (Powder sample prior to mixing) 3.4.1.1 Particle Size (IPC-SP-819, Section 4.2.3) WSF-M11A44-A2 75 microns or less WSF-M11A44-A3 10 - 53 microns WSF-M11A44-A4 10 - 44 microns 3.4.1.2 Particle Shape Spherical; (IPC-SP-819, Section 4.2.3) Ratio = 1 - 1.5 ENGI
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