FORD FLTM BI 152-1-2001 RESISTANCE OF PAINT FILMS TO SOLVENTS (Replaces FLTM EU-BI 052-01).pdf

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1、 FORD LABORATORY TEST METHOD BI 152-01 Date Action Revisions 2001 03 20 Revised Editorial no technical change A. Cockman 1990 05 14 Printed copies are uncontrolled Page 1 of 2 Copyright 2001, Ford Global Technologies, Inc. RESISTANCE OF PAINT FILMS TO SOLVENTS Application This method is used to dete

2、rmine the resistance of paint films to solvents. Apparatus Required Burette 50 mL Wedge Wood, angle 30 +/- 2, dimensions approximately 250 mm length by 100 mm wide. Materials Required Test Solvent Xylene (WSK-M14J239-A/M14J245) unless otherwise specified. Caution: Low flash point. Refer to Industria

3、l Hygiene for health and safety comments. Test Panel Refer to applicable Engineering Materials Specification. Conditioning and Test Conditions All test values indicated herein are based on material conditioned in a controlled atmosphere of 23 +/- 2 C and 50 +/- 5 % relative humidity for not less tha

4、n 24 h prior to testing and tested under the same conditions unless otherwise specified. FORD LABORATORY TEST METHOD BI 152-01 Page 2 of 2 Copyright 2001, Ford Global Technologies, Inc. Procedure 1. The test panel (approximately 80 mm x 250 mm) is prepared as required by the applicable Engineering M

5、aterials Specification. Age the test panel for 7 days at 23 +/- 2 C for air drying paint or 3 days at 23 +/- 2 C for baking enamel. 2. The test panel is laid on the wedge with the painted side “up“. Using the burette allow the test solvent to drop (1 dropper 2 - 3 s) onto the upper part of the panel

6、 near the center line for 10 minutes at 23 +/- 2 C. 3. Suspend test panel at 23 +/- 2 C under draft free conditions and examine after 1 h. Evaluation Examine test panel for evidence of failure as required by the applicable Engineering Materials Specification. Chemicals, materials, parts, and equipment referenced in this document must be used and handled properly. Each party is responsible for determining proper use and handling in its facilities.