EN IEC 61190-1-3-2018 en Attachment materials for electronic assembly - Part 1-3 Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electron.pdf

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1、BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06Attachment materials for electronic assemblyPart 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)BS EN IEC 61190-1-3:

2、2018EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN IEC 61190-1-3 March 2018 ICS 31.190 Supersedes EN 61190-1-3:2007 English Version Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic sol

3、dering applications (IEC 61190-1-3:2017) Matriaux de fixation pour les assemblages lectroniques - Partie 1-3: Exigences relatives aux alliages braser de catgorie lectronique et brasure solide fluxe et non-fluxe pour les applications de brasage lectronique (IEC 61190-1-3:2017) Verbindungsmaterialien

4、fr Baugruppen der Elektronik - Teil 1-3: Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel fr das Lten von Elektronikprodukten (IEC 61190-1-3:2017) This European Standard was approved by CENELEC on 2018-01-17. CENELEC members are bound to comply with the CEN/CENELEC Inter

5、nal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any

6、CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the offi

7、cial versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg,

8、Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung C

9、EN-CENELEC Management Centre: Rue de la Science 23, B-1040 Brussels 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 61190-1-3:2018 E National forewordThis British Standard is the UK implementation of EN IEC 6119013:2018. It

10、 is identical to IEC 6119013:2017. It supersedes BS EN 6119013:2007+A1:2010, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained on request to its

11、 secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2018 Published by BSI Standards Limited 2018ISBN 978 0 580 89238 7ICS 31.190Compliance with a British Standard cann

12、ot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 March 2018.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN IEC 6119013:2018EUROPEAN STANDARD NORME EUROPENNE EU

13、ROPISCHE NORM EN IEC 61190-1-3 March 2018 ICS 31.190 Supersedes EN 61190-1-3:2007 English Version Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)

14、 Matriaux de fixation pour les assemblages lectroniques - Partie 1-3: Exigences relatives aux alliages braser de catgorie lectronique et brasure solide fluxe et non-fluxe pour les applications de brasage lectronique (IEC 61190-1-3:2017) Verbindungsmaterialien fr Baugruppen der Elektronik - Teil 1-3:

15、 Anforderungen an Elektroniklote und an Festformlote mit oder ohne Flussmittel fr das Lten von Elektronikprodukten (IEC 61190-1-3:2017) This European Standard was approved by CENELEC on 2018-01-17. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the cond

16、itions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard e

17、xists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CENELEC members are the n

18、ational electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland,

19、Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Rue de la

20、Science 23, B-1040 Brussels 2018 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN IEC 61190-1-3:2018 E BS EN IEC 6119013:2018EN IEC 61190-1-3:2018 (E) 2 European foreword The text of document 91/1468/FDIS, future edition 3 of IEC 611

21、90-1-3, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN IEC 61190-1-3:2018. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical nat

22、ional standard or by endorsement (dop) 2018-10-17 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2021-01-17 This document supersedes EN 61190-1-3:2017 and EN 61190-1-3:2017/A1:2010. Attention is drawn to the possibility that some of the elements

23、of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61190-1-3:2017 was approved by CENELEC as a European Standard without any modification. In the offi

24、cial version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61189-5 (series) NOTE Harmonized as EN 61189-5 (series). IEC 61189-6 NOTE Harmonized as EN 61189-6 ISO 9453 NOTE Harmonized as EN ISO 9453. ISO 9454-1 NOTE Harmonized as EN ISO 9454-1. ISO 9454-2 NO

25、TE Harmonized as EN ISO 9454-2. BS EN IEC 6119013:2018EN IEC 61190-1-3:2018 (E) 3 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents are referred to in the text in such a way that some or all of their content

26、 constitutes requirements of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 Where an International Publication has been modified by common modifications, indicated b

27、y (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60194 2015 Printed board design, manufacture and assembly - Terms and definitions - - IEC

28、61189-5-2 2015 Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux EN 61189-5-2 2015 IEC 61189-5-3 2015 Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test

29、 methods for printed board assemblies: Soldering paste EN 61189-5-3 2015 IEC 61189-5-4 2015 Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire EN 61189-5-4 2015 IEC

30、 61190-1-1 2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly EN 61190-1-1 2002 IEC 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-q

31、uality interconnects in electronics assembly EN 61190-1-2 - BS EN IEC 6119013:2018This page deliberately left blank 2 IEC 61190-1-3:2017 IEC 2017 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms and definitions 8 4 Classification . 11 4.1 General . 11 4.2 Alloy compo

32、sition 11 4.3 Solder form . 12 4.4 Flux type . 12 4.5 Flux percentage and metal content . 13 4.6 Other characteristics . 14 5 Requirements 14 5.1 Materials . 14 5.2 Alloys 14 5.2.1 General . 14 5.2.2 Variation D alloys 14 5.3 Solder forms . 15 5.3.1 General . 15 5.3.2 Bar solder 15 5.3.3 Wire solder

33、 15 5.3.4 Ribbon solder 15 5.3.5 Solder powder . 15 5.3.6 Special solder 16 5.4 Flux type and form 16 5.4.1 General . 16 5.4.2 Flux percentage . 16 5.4.3 Solder cores 17 5.4.4 Solder coatings 17 5.5 Flux residue dryness . 17 5.6 Spitting . 17 5.7 Solder pool . 17 5.8 Labelling for product identifica

34、tion. 17 5.9 Workmanship 18 6 Quality assurance provisions . 18 6.1 Responsibility for inspection and compliance 18 6.1.1 General . 18 6.1.2 Quality assurance programme . 18 6.1.3 Test equipment and inspection facilities . 18 6.1.4 Inspection conditions . 18 6.2 Classification of inspections 18 6.3

35、Inspection of materials 23 6.4 Qualification inspections . 23 6.4.1 General . 23 6.4.2 Sample size . 23 6.4.3 Inspection routine 23 2 IEC 61190-1-3:2017 IEC 2017 CONTENTS FOREWORD . 5 INTRODUCTION . 7 1 Scope 8 2 Normative references 8 3 Terms and definitions 8 4 Classification . 11 4.1 General . 11

36、 4.2 Alloy composition 11 4.3 Solder form . 12 4.4 Flux type . 12 4.5 Flux percentage and metal content . 13 4.6 Other characteristics . 14 5 Requirements 14 5.1 Materials . 14 5.2 Alloys 14 5.2.1 General . 14 5.2.2 Variation D alloys 14 5.3 Solder forms . 15 5.3.1 General . 15 5.3.2 Bar solder 15 5

37、.3.3 Wire solder 15 5.3.4 Ribbon solder 15 5.3.5 Solder powder . 15 5.3.6 Special solder 16 5.4 Flux type and form 16 5.4.1 General . 16 5.4.2 Flux percentage . 16 5.4.3 Solder cores 17 5.4.4 Solder coatings 17 5.5 Flux residue dryness . 17 5.6 Spitting . 17 5.7 Solder pool . 17 5.8 Labelling for pr

38、oduct identification. 17 5.9 Workmanship 18 6 Quality assurance provisions . 18 6.1 Responsibility for inspection and compliance 18 6.1.1 General . 18 6.1.2 Quality assurance programme . 18 6.1.3 Test equipment and inspection facilities . 18 6.1.4 Inspection conditions . 18 6.2 Classification of ins

39、pections 18 6.3 Inspection of materials 23 6.4 Qualification inspections . 23 6.4.1 General . 23 6.4.2 Sample size . 23 6.4.3 Inspection routine 23 BS EN IEC 6119013:2018IEC 61190-1-3:2017 IEC 2017 3 6.5 Quality conformance . 24 6.5.1 General . 24 6.5.2 Inspection routine 24 6.5.3 Sampling plan 24 6

40、.5.4 Rejected lots . 24 6.6 Preparation of solder alloy for test 24 6.6.1 General . 24 6.6.2 Wire solder up to approximately 6 mm diameter. 24 6.6.3 Ribbon solder and wire solder larger than approximately 6 mm diameter . 24 7 Preparation for delivery Preservation, packing and packaging 24 Annex A (i

41、nformative) Selection of various alloys and fluxes for use in electronic soldering General information concerning IEC 61190-1-3 . 25 A.1 Overview. 25 A.2 Intended use . 25 A.2.1 General . 25 A.2.2 Alloys 25 A.3 Acquisition requirements . 26 A.4 Standard solder product packages 27 A.4.1 General . 27

42、A.4.2 Wire and ribbon solders . 27 A.4.3 Bar solders 27 A.4.4 Solder powder . 27 A.5 Protocol for establishing short names for IEC 61190-1-3 alloys . 28 A.5.1 Lead containing solder alloys and specialty alloy . 28 A.5.2 Lead-free solder alloys 28 A.6 Standard description of solid solder products 29

43、Annex B (normative) Lead-free solder alloys 30 Annex C (informative) Marking method of solder designation for mounted board, used in electronic equipment 41 C.1 General . 41 C.2 Marking . 41 C.2.1 Recommendation for marking 41 C.2.2 Marking for solder designation . 41 C.2.3 Marking unit and location

44、 . 42 Bibliography 43 Figure 1 Report form for solder alloy tests . 19 Figure 2 Report form for solder powder tests . 20 Figure 3 Report form for non-fluxed solder tests 21 Figure 4 Report form for fluxed wire/ribbon solder tests . 22 Figure C.1 Example of the marking for assembled board . 42 Table

45、1 Solder materials 12 Table 2 Flux types and designating symbols 13 Table 3 Flux percentage 14 Table 4 Standard solder powders . 16 Table 5 Solder inspections . 23 BS EN IEC 6119013:2018 4 IEC 61190-1-3:2017 IEC 2017 Table B.1 The composition and temperature characteristics of lead-free solder alloy

46、s . 30 Table B.2 The composition and temperature characteristics of common tin-lead alloys 33 Table B.3 The composition and temperature characteristics for specialty (non-tin/lead) alloys 36 Table B.4 the cross-reference from solidus and liquidus temperatures to alloy names by temperature . 37 Table

47、 B.5 The cross-reference from ISO 9453 alloy numbers and designations to IEC 61190-1-3 alloy names . 39 BS EN IEC 6119013:2018IEC 61190-1-3:2017 IEC 2017 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY Part 13: Requirements for electronic grade solder alloy

48、s and fluxed and non-fluxed solid solder for electronic soldering applications FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promot

49、e international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in t