EN 61760-2-2007 en Surface mounting technology - Part 2 Transportation and storage conditions of surface mounting devices (SMD) - Application guide《表面安装技术 第2部分 表面安装器件(SMD)的运输和存储条件 .pdf
《EN 61760-2-2007 en Surface mounting technology - Part 2 Transportation and storage conditions of surface mounting devices (SMD) - Application guide《表面安装技术 第2部分 表面安装器件(SMD)的运输和存储条件 .pdf》由会员分享,可在线阅读,更多相关《EN 61760-2-2007 en Surface mounting technology - Part 2 Transportation and storage conditions of surface mounting devices (SMD) - Application guide《表面安装技术 第2部分 表面安装器件(SMD)的运输和存储条件 .pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、BRITISH STANDARDBS EN 61760-2:2007Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) Application guideThe European Standard EN 61760-2:2007 has the status of a British StandardICS 31.020g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37
2、g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61760-2:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2007ISBN 978 0 5
3、80 56232 7National forewordThis British Standard is the UK implementation of EN 61760-2:2007. It is identical to IEC 61760-2:2007. It supersedes BS EN 61760-2:1998 which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.
4、A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from
5、legal obligations.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61760-2 NORME EUROPENNE EUROPISCHE NORM June 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische N
6、ormung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61760-2:2007 E ICS 31.020 Supersedes EN 61760-2:1998English version Surface mounting technology - Part 2: Trans
7、portation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2007) Technique du montage en surface - Partie 2: Transport et stockage des composants pour montage en surface (CSM) - Guide dapplication (CEI 61760-2:2007) Oberflchenmontagetechnik - Teil 2: Transpor
8、t- und Lagerungsbedingungen von oberflchenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden (IEC 61760-2:2007) This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving thi
9、s European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official version
10、s (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Au
11、stria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.
12、 Foreword The text of document 91/569/CDV, future edition 2 of IEC 61760-2, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel Unique Acceptance Procedure and was approved by CENELEC as EN 61760-2 on 2007-05-01. This European Standard supersedes EN 6176
13、0-2:1998. The main changes with regard to EN 61760-2:1998 concern: EN 61760-2:2007 was updated and editorially revised. Specific reference is made to: EN 61340-5-1: Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements EN 61340-5-2: Electrostatic
14、s Part 5-2: Protection of electronic devices from electrostatic phenomena User guide For convenience of the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from EN 60721-3-1 and EN 60721-3-
15、2). The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-02-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-05-01 Annex
16、ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61760-2:2007 was approved by CENELEC as a European Standard without any modification. _ 2 EN 61760-2:2007SURFACE MOUNTING TECHNOLOGY Part 2: Transportation and storage conditions of surface mounting devices
17、 (SMD) Application guide 1 Scope and object This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed
18、boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration
19、 and result in assembly problems such as poor solderability, delamination and ”popcorning”. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest editi
20、on of the referenced document (including any amendments) applies. IEC 60286-3: Packaging of components for automatic handling Part 3: Packaging of leadless components on continuous tapes IEC 60286-4: Packaging of components for automatic handling Part 4: Stick magazines for electronic components enc
21、apsulated in packages of form E and G IEC 60286-5: Packaging of components for automatic handling Part 5: Matrix trays IEC 60286-6: Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components IEC 60721-3-1: Classification of environmental conditions Par
22、t 3: Classification of groups of environmental parameters and their severities Section 1: Storage IEC 60721-3-2: Classification of environmental conditions Part 3: Classification of groups of environmental parameters and their severities Section 2: Transportation IEC 60749 (all parts), Semiconductor
23、 devices Mechanical and climatic test methods IEC/TS 61340-5-1: Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements IEC/TS 61340-5-2: Electrostatics Part 5-2: Protection of electronic devices from electrostatic phenomena User guide 3 EN 61760-2
24、:20073 General conditions Surface mounting devices shall be packed in such a way that products are protected during transportation and storage without loss of their properties arising from mechanical, environmental and electrical influences. Packing requirements as defined in various IEC publication
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