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    EN 61760-2-2007 en Surface mounting technology - Part 2 Transportation and storage conditions of surface mounting devices (SMD) - Application guide《表面安装技术 第2部分 表面安装器件(SMD)的运输和存储条件 .pdf

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    EN 61760-2-2007 en Surface mounting technology - Part 2 Transportation and storage conditions of surface mounting devices (SMD) - Application guide《表面安装技术 第2部分 表面安装器件(SMD)的运输和存储条件 .pdf

    1、BRITISH STANDARDBS EN 61760-2:2007Surface mounting technology Part 2: Transportation and storage conditions of surface mounting devices (SMD) Application guideThe European Standard EN 61760-2:2007 has the status of a British StandardICS 31.020g49g50g3g38g50g51g60g44g49g42g3g58g44g55g43g50g56g55g3g37

    2、g54g44g3g51g40g53g48g44g54g54g44g50g49g3g40g59g38g40g51g55g3g36g54g3g51g40g53g48g44g55g55g40g39g3g37g60g3g38g50g51g60g53g44g42g43g55g3g47g36g58BS EN 61760-2:2007This British Standard was published under the authority of the Standards Policy and Strategy Committee on 31 July 2007 BSI 2007ISBN 978 0 5

    3、80 56232 7National forewordThis British Standard is the UK implementation of EN 61760-2:2007. It is identical to IEC 61760-2:2007. It supersedes BS EN 61760-2:1998 which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology.

    4、A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application.Compliance with a British Standard cannot confer immunity from

    5、legal obligations.Amendments issued since publicationAmd. No. Date CommentsEUROPEAN STANDARD EN 61760-2 NORME EUROPENNE EUROPISCHE NORM June 2007 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische N

    6、ormung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2007 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61760-2:2007 E ICS 31.020 Supersedes EN 61760-2:1998English version Surface mounting technology - Part 2: Trans

    7、portation and storage conditions of surface mounting devices (SMD) - Application guide (IEC 61760-2:2007) Technique du montage en surface - Partie 2: Transport et stockage des composants pour montage en surface (CSM) - Guide dapplication (CEI 61760-2:2007) Oberflchenmontagetechnik - Teil 2: Transpor

    8、t- und Lagerungsbedingungen von oberflchenmontierbaren Bauelementen (SMD) - Anwendungsleitfaden (IEC 61760-2:2007) This European Standard was approved by CENELEC on 2007-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving thi

    9、s European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official version

    10、s (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Au

    11、stria, Belgium, Bulgaria, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom.

    12、 Foreword The text of document 91/569/CDV, future edition 2 of IEC 61760-2, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel Unique Acceptance Procedure and was approved by CENELEC as EN 61760-2 on 2007-05-01. This European Standard supersedes EN 6176

    13、0-2:1998. The main changes with regard to EN 61760-2:1998 concern: EN 61760-2:2007 was updated and editorially revised. Specific reference is made to: EN 61340-5-1: Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements EN 61340-5-2: Electrostatic

    14、s Part 5-2: Protection of electronic devices from electrostatic phenomena User guide For convenience of the reader, an informative Annex A was added, which contains information about the climatic and mechanical conditions during transportation and storage (extracted from EN 60721-3-1 and EN 60721-3-

    15、2). The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2008-02-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2010-05-01 Annex

    16、ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 61760-2:2007 was approved by CENELEC as a European Standard without any modification. _ 2 EN 61760-2:2007SURFACE MOUNTING TECHNOLOGY Part 2: Transportation and storage conditions of surface mounting devices

    17、 (SMD) Application guide 1 Scope and object This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed

    18、boards are not taken into consideration.) The object of this standard is to ensure that users of SMDs receive and store products that can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration

    19、 and result in assembly problems such as poor solderability, delamination and ”popcorning”. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest editi

    20、on of the referenced document (including any amendments) applies. IEC 60286-3: Packaging of components for automatic handling Part 3: Packaging of leadless components on continuous tapes IEC 60286-4: Packaging of components for automatic handling Part 4: Stick magazines for electronic components enc

    21、apsulated in packages of form E and G IEC 60286-5: Packaging of components for automatic handling Part 5: Matrix trays IEC 60286-6: Packaging of components for automatic handling Part 6: Bulk case packaging for surface mounting components IEC 60721-3-1: Classification of environmental conditions Par

    22、t 3: Classification of groups of environmental parameters and their severities Section 1: Storage IEC 60721-3-2: Classification of environmental conditions Part 3: Classification of groups of environmental parameters and their severities Section 2: Transportation IEC 60749 (all parts), Semiconductor

    23、 devices Mechanical and climatic test methods IEC/TS 61340-5-1: Electrostatics Part 5-1: Protection of electronic devices from electrostatic phenomena General requirements IEC/TS 61340-5-2: Electrostatics Part 5-2: Protection of electronic devices from electrostatic phenomena User guide 3 EN 61760-2

    24、:20073 General conditions Surface mounting devices shall be packed in such a way that products are protected during transportation and storage without loss of their properties arising from mechanical, environmental and electrical influences. Packing requirements as defined in various IEC publication

    25、s, such as IEC 60286-3, IEC 60286-4, IEC 60286-5, IEC 60286-6, may contribute to the protection of components during transportation and storage. Usually, transportation conditions are less controlled than storage conditions. Nevertheless, conditions shall be controlled and deviations from the advise

    26、d conditions in this standard should be reduced to as little time as possible. 4 Transportation conditions 4.1 General transportation conditions During transportation, the SMDs, including their chosen style of tapes or stick magazines, etc., shall be protected against extreme temperature, humidity a

    27、nd mechanical forces. Unless otherwise specified by the component supplier, the following environmental conditions shall be met: Climatic condition according to IEC 60721-3-2, class 2K2, except low air temperature: 40 C, change of temperature air/air: 40 C / +30 C, low air pressure: 30 kPa, change o

    28、f air pressure: 6 kPa/min. Mechanical condition according to IEC 60721-3-2, class 2M1. Transportation shall be managed in such a way that boxes are not deformed and forces are not directly passed on to the inner packaging. Total transportation time shall be as short as possible, but preferably not e

    29、xceed 10 days. (Total transportation time is time when products are not within controlled storage conditions.) 4.2 Specific transportation conditions Depending on the sensitivity of the products to be transported, a choice shall be made between air transport where conditions during flight are well c

    30、ontrolled, or less controlled conditions, e.g. during rail or road transportation. 4.2.1 Category 1 (advised for all products) Air transport (conditions during flights with conditioned cargo room). Climatic conditions according to IEC 60721-3-2, class 2K1. It should be realised that waiting time and

    31、 loading operations at the airport are under less controlled conditions. These shall at least fulfil the general transportation conditions stated in 4.1. 4 EN 61760-2:20074.2.2 Category 2 Rail, road, and unconditioned air transportation. Only allowed for products and packaging systems that are not s

    32、ensitive to the general transportation conditions stated in 4.1. Minimum air pressure: corresponding to an altitude of 12 km (about 19,3 kPa). 5 Storage conditions Well controlled storage conditions are a major factor in problem prevention. Do not store where the soldering properties can be deterior

    33、ated by harmful gases. Conditions that may expose products to detrimental electrical field strengths should be avoided. Exposure of the products to direct solar radiation should be avoided. The following conditions are advised: Climatic conditions according to IEC 60721-3-1, class 1K2, except: low r

    34、elative humidity 10 %; high relative humidity 75 %. The storage time as given by the manufacturer specification shall not be exceeded. It is however recommended that the total storage time should not exceed two years (manufacturer and customer) but should be limited to one year after receipt of the

    35、products by the customer. In specific cases, the exact storage time- and the re-qualification rules, if the time is exceeded, are given in the component specification. As a minimum at least the solderability of the components has to be re-qualified. If longer storage times are needed, the manufactur

    36、er should be consulted to conclude arrangements for suitable storage and packaging conditions. During storage the original smallest packaging unit (SPU) shall not be opened, the SPU should preferably remain in the original packaging. Even though products are stored for a shorter period of time, it i

    37、s advised to apply the above-mentioned temperature and humidity conditions. For “last call” components, the storage conditions to conserve the components properties shall be agreed between the manufacturer and the user. 6 Related issues If the products in standard packaging do not fulfil the require

    38、d quality and reliability goals under the shipment and storage conditions as described above, special actions shall be considered as described in IEC 60749, IEC/TS 61340-5-1 and IEC/TS 61340-5-2. 5 EN 61760-2:2007Annex A (informative) Transportation climatic conditions For easy and rapid reference,

    39、this annex shows the content of the quoted conditions of IEC 60721-3-1 and IEC 60721-3-2. NOTE The footnote references can be found on the last page. Table A.1 Transportation climatic conditions according to IEC 60721-3-2 Class Environmental parameter Unit 2K1 2K2 Conditions used in this standard in

    40、stead of 2K2 a) Low air temperature C +5 -25 -40 b) High air temperature, air in unventilated enclosures 1)C No +60 c) High air temperature, air in ventilated enclosures or outdoor air 2)C +40 +40 d) Change of temperature, air/air 3)C No -25/+25 -40/+30 e) Change of temperature, air/water 3)C No No

    41、f) Relative humidity, not combined with rapid temperature changes % C 75 +30 75 +30 g) Relative humidity, combined with rapid temperature changes: air/air at high relative humidity 3)% C No No h) Absolute humidity, combined with rapid temperature changes: air/air at high water content 4)g/m3 CNo No

    42、i) Low air pressure kPa 70 70 30 j) Change of air pressure kPa/min No No 6 k) Movement of surrounding medium, air m/s No No l) Precipitation, rain mm/min No No m) Radiation, solar W/m2700 700 n) Radiation, heat W/m2No No o) Water from sources other than rain 5)m/s No No p) Wetness None No No 1)The h

    43、igh temperature of the surface of a product may be influenced by both the surrounding air temperature given here and the solar radiation through a window or other opening. 2)The high temperature of the surface of a product is influenced by the surrounding air temperature given here and the solar rad

    44、iation defined below. 3)A direct transfer of the product between the two temperatures given is presumed. 4)The product is assumed to be subject to a rapid decrease of temperature only (no rapid increase). The figures of water content apply to temperatures down to the dew-point; at lower temperatures

    45、 the relative humidity is assumed to be approximately 100 %. 5)The figure indicates the velocity of water and not the height of water accumulated. 6 EN 61760-2:2007Table A.2 Transportation mechanical conditions according to IEC 60721-3-2 Class Environmental parameter Unit 2M1 a) Stationary vibration

    46、, sinusoidal 1): displacement amplitude acceleration amplitude frequency range mm m/s2Hz3,5 - - - 10 15 2-9 9-200 200-500 b) Stationary vibration, random 1)acceleration spectral density frequency range m2/s2Hz1 0,3 10-200 200-2 000 c) Non-stationary vibration including shock 2): shock response spect

    47、rum type I, peak acceleration shock response spectrum type II, peak acceleration m/s2 m/s2100 No d) Free fall: Mass less than 20 kg Mass 20 kg to 100 kg Mass more than 100 kg m m m 0,25 0,25 0,1 e) Toppling: Mass less than 20 kg Mass 20 kg to 100 kg Mass more than 100 kg None None None Toppling arou

    48、nd any of the edges No No f) Rolling, pitching: Angle 3)Period Degree s No No g) Steady-state acceleration m/s220 h) Static load kPa 5 1) The frequency range may be limited to 200 Hz for transportation on parts of the vehicle with high internal damping. 2) See Figure 1 in 60721-3-2. 3) An angle of 3

    49、5 only occurs temporarily, but angles up to 22,5 can be reached for long periods of time. 7 EN 61760-2:2007Table A.3 Storage conditions according to IEC 60721-3-1 Class Environmental parameter Unit 1K2 Conditions used in this standard instead of 1K2 a) Low air temperature C +5b) High air temperatureC +40c) Low relative humidity 1)% 5 10 d) High relative humidity 1)% 85 75 e) Low absolute humidity 1)g/m31 f) High


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