EN 61191-3-2017 en Printed board assemblies - Part 3 Sectional specification - Requirements for through-hole mount soldered assemblies.pdf

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1、Printed board assembliesPart 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017)BS EN 61191-3:2017BSI Standards PublicationWB11885_BSI_StandardCovs_2013_AW.indd 1 15/05/2013 15:06EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 61191-3 Septembe

2、r 2017 ICS 31.240 Supersedes EN 61191-3:1998 English Version Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017) Ensembles de cartes imprimes - Partie 3: Spcification intermdiaire - Exigences relatives lassemblage pa

3、r brasage de trous traversants (IEC 61191-3:2017) Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an geltete Baugruppen in Durchsteckmontage (IEC 61191-3:2017) This European Standard was approved by CENELEC on 2017-07-04. CENELEC members are bound to comply with t

4、he CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Manageme

5、nt Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the sam

6、e status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lit

7、huania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektro

8、technische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61191-3:2017 E National forewordThis British Standard is the UK implementation of EN 61191-3:20

9、17. It is identical to IEC 61191-3:2017. It supersedes BS EN 61191-3:1999, which is withdrawn.The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic Assembly Technology.A list of organizations represented on this committee can be obtained on request to its s

10、ecretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Institution 2017 Published by BSI Standards Limited 2017ISBN 978 0 580 91722 6ICS 31.240; 31.180Compliance with a British Standar

11、d cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 September 2017.Amendments/corrigenda issued since publicationDate Text affectedBRITISH STANDARDBS EN 611913:2017EUROPEAN STANDARD NORME EUROPEN

12、NE EUROPISCHE NORM EN 61191-3 September 2017 ICS 31.240 Supersedes EN 61191-3:1998 English Version Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017) Ensembles de cartes imprimes - Partie 3: Spcification intermdiair

13、e - Exigences relatives lassemblage par brasage de trous traversants (IEC 61191-3:2017) Elektronikaufbauten auf Leiterplatten - Teil 3: Rahmenspezifikation - Anforderungen an geltete Baugruppen in Durchsteckmontage (IEC 61191-3:2017) This European Standard was approved by CENELEC on 2017-07-04. CENE

14、LEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on a

15、pplication to the CEN-CENELEC Management Centre or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN

16、-CENELEC Management Centre has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary

17、, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Serbia, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrote

18、chnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2017 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC Members. Ref. No. EN 61191-3:2017 E BS EN 611913:2017EN 61191-3:2017 European

19、foreword The text of document 91/1375/CDV, future edition 2 of IEC 61191-3, prepared by IEC/TC 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61191-3:2017. The following dates are fixed: latest date by which the document has to be im

20、plemented at national level by publication of an identical national standard or by endorsement (dop) 2018-04-04 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-07-04 This document supersedes EN 61191-3:1998. Attention is drawn to the possibil

21、ity that some of the elements of this document may be the subject of patent rights. CENELEC shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61191-3:2017 was approved by CENELEC as a European Standard without a

22、ny modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58. IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1. IEC 61188-5-2 NOTE Harmonized

23、 as EN 61188-5-2. IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3. IEC 61188-5-4 NOTE Harmonized as EN 61188-5-4. IEC 61188-5-6 NOTE Harmonized as EN 61188-5-5. IEC 61188-7 NOTE Harmonized as EN 61188-7. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 6119

24、3-1 NOTE Harmonized as EN 61193-1. IEC 61193-3 NOTE Harmonized as EN 61193-3. IEC 62326-1 NOTE Harmonized as EN 62326-1. IEC 62326-4 NOTE Harmonized as EN 62326-4. BS EN 611913:2017EN 61191-3:2017 European foreword The text of document 91/1375/CDV, future edition 2 of IEC 61191-3, prepared by IEC/TC

25、 91 “Electronics assembly technology“ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61191-3:2017. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement

26、 (dop) 2018-04-04 latest date by which the national standards conflicting with the document have to be withdrawn (dow) 2020-07-04 This document supersedes EN 61191-3:1998. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights. CENELEC sh

27、all not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61191-3:2017 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be add

28、ed for the standards indicated: IEC 60068-2-20 NOTE Harmonized as EN 60068-2-20. IEC 60068-2-58 NOTE Harmonized as EN 60068-2-58. IEC 61188-5-1 NOTE Harmonized as EN 61188-5-1. IEC 61188-5-2 NOTE Harmonized as EN 61188-5-2. IEC 61188-5-3 NOTE Harmonized as EN 61188-5-3. IEC 61188-5-4 NOTE Harmonized

29、 as EN 61188-5-4. IEC 61188-5-6 NOTE Harmonized as EN 61188-5-5. IEC 61188-7 NOTE Harmonized as EN 61188-7. IEC 61189-2 NOTE Harmonized as EN 61189-2. IEC 61190-1-2 NOTE Harmonized as EN 61190-1-2. IEC 61193-1 NOTE Harmonized as EN 61193-1. IEC 61193-3 NOTE Harmonized as EN 61193-3. IEC 62326-1 NOTE

30、 Harmonized as EN 62326-1. IEC 62326-4 NOTE Harmonized as EN 62326-4. EN 61191-3:2017 3 IEC 62326-4-1 NOTE Harmonized as EN 62326-4-1. ISO 9001 NOTE Harmonized as EN ISO 9001. BS EN 611913:2017EN 61191-3:2017 Annex ZA (normative) Normative references to international publications with their correspo

31、nding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any

32、amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication

33、Year Title EN/HD Year IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions - - IEC 61191-1 2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologie

34、s EN 61191-1 2013 IPC-A-610 - Acceptability of Electronics Assemblies - - 2 IEC 61191-3:2017 IEC 2017 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4 General requirements 6 5 Through-hole mounting of components 7 5.1 General . 7 5.2 Placement accuracy 7 5.3 Throu

35、gh-hole component requirements . 7 5.3.1 Lead preforming 7 5.3.2 Tempered leads . 7 5.3.3 Lead forming requirements 7 5.3.4 Stress relief requirements 8 5.3.5 Lead termination requirements 8 6 Acceptance requirements 10 6.1 General . 10 6.2 Control and corrective actions . 10 6.2.1 General . 10 6.2.

36、2 Interfacial connections (vias) . 10 6.3 Through-hole component lead soldering . 11 6.3.1 General . 11 6.3.2 Clinched leads . 12 6.3.3 Exposed basis metal 13 7 Rework of unsatisfactory solder connections . 13 (normative) Placement requirements for through-hole mount devices . 14 Annex AA.1 General

37、. 14 A.2 Horizontal mounting, free-standing 14 A.3 Axial lead components 14 A.4 Radial lead components 14 A.5 Perpendicular mounting, free-standing 14 A.5.1 General . 14 A.5.2 Mounting of components 14 A.5.3 Radial lead components 15 A.6 Side- and end-mounting 15 A.7 Supported component mounting 16

38、A.7.1 General . 16 A.7.2 Stand-off positioning 16 A.7.3 Non-resilient footed stand-offs . 17 A.8 Stress relief lead configuration 17 A.9 Flat pack lead configuration 17 Bibliography 19 Figure 1 Lead bends 8 Figure 2 Hole obstruction . 10 Figure 3 Through-hole component lead soldering . 11 BS EN 6119

39、13:2017EN 61191-3:2017 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, onl

40、y the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE 1 When an International Publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. NOTE 2 Up-to-date information on

41、the latest versions of the European Standards listed in this annex is available here: www.cenelec.eu. Publication Year Title EN/HD Year IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions - - IEC 61191-1 2013 Printed board assemblies - Part 1: Generic specification - R

42、equirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies EN 61191-1 2013 IPC-A-610 - Acceptability of Electronics Assemblies - - 2 IEC 61191-3:2017 IEC 2017 CONTENTS FOREWORD . 4 1 Scope 6 2 Normative references 6 3 Terms and definitions 6 4

43、 General requirements 6 5 Through-hole mounting of components 7 5.1 General . 7 5.2 Placement accuracy 7 5.3 Through-hole component requirements . 7 5.3.1 Lead preforming 7 5.3.2 Tempered leads . 7 5.3.3 Lead forming requirements 7 5.3.4 Stress relief requirements 8 5.3.5 Lead termination requiremen

44、ts 8 6 Acceptance requirements 10 6.1 General . 10 6.2 Control and corrective actions . 10 6.2.1 General . 10 6.2.2 Interfacial connections (vias) . 10 6.3 Through-hole component lead soldering . 11 6.3.1 General . 11 6.3.2 Clinched leads . 12 6.3.3 Exposed basis metal 13 7 Rework of unsatisfactory

45、solder connections . 13 (normative) Placement requirements for through-hole mount devices . 14 Annex AA.1 General . 14 A.2 Horizontal mounting, free-standing 14 A.3 Axial lead components 14 A.4 Radial lead components 14 A.5 Perpendicular mounting, free-standing 14 A.5.1 General . 14 A.5.2 Mounting o

46、f components 14 A.5.3 Radial lead components 15 A.6 Side- and end-mounting 15 A.7 Supported component mounting 16 A.7.1 General . 16 A.7.2 Stand-off positioning 16 A.7.3 Non-resilient footed stand-offs . 17 A.8 Stress relief lead configuration 17 A.9 Flat pack lead configuration 17 Bibliography 19 F

47、igure 1 Lead bends 8 Figure 2 Hole obstruction . 10 Figure 3 Through-hole component lead soldering . 11 BS EN 611913:2017IEC 61191-3:2017 IEC 2017 3 Figure 4 Lead-to-land fillet requirements for clinched leads and wires in non-plated through-holes 11 Figure 5 Lead-to-land fillet requirements for cli

48、nched leads and wires in plated through-holes 12 Figure A.1 Mounting of free-standing components . 14 Figure A.2 Typical configuration of components with dual non-axial leads 15 Figure A.3 Mounting of components with dual non-axial leads 15 Figure A.4 Side mounting . 15 Figure A.5 End mounting 16 Fi

49、gure A.6 Mounting with footed stand-offs 16 Figure A.7 Non-resilient footed stand-offs 17 Figure A.8 Acceptable lead configurations . 17 Figure A.9 Configuration of ribbon leads for through-hole mounting . 18 Table 1 Plated through-holes with component leads, minimum acceptable conditions1). 12 Table 2 Through-hole solder joint defects 13 BS EN 611913:2017IEC 61191-3:2017 IEC 2017 3 Figure 4 Lead-to-land fillet requirements for clinched leads and wires in non-plated