EN 61191-2-2013 en Printed board assemblies - Part 2 Sectional specification - Requirements for surface mount soldered assemblies.pdf
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1、BSI Standards PublicationPrinted board assembliesPart 2: Sectional specification Requirements for surface mount soldered assembliesBS EN 61191-2:2013National forewordThis British Standard is the UK implementation of EN 61191-2:2013. It isidentical to IEC 61191-2:2013. It supersedes BS EN 61191-2:199
2、9 which iswithdrawn.The UK participation in its preparation was entrusted to TechnicalCommittee EPL/501, Electronic assembly technology 31.240Compliance with a British Standard cannot confer immunity fromlegal obligations.This British Standard was published under the authority of theStandards Policy
3、 and Strategy Committee on 31 October 2013.Amendments issued since publicationAmd. No. Date Text affectedBRITISH STANDARDBS EN 61191-2:2013EUROPEAN STANDARD EN 61191-2 NORME EUROPENNE EUROPISCHE NORM October 2013 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normal
4、isation Electrotechnique Europisches Komitee fr Elektrotechnische Normung CEN-CENELEC Management Centre: Avenue Marnix 17, B - 1000 Brussels 2013 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61191-2:2013 E ICS 31.190; 31.240 Su
5、persedes EN 61191-2:1998 English version Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2013) Ensembles de cartes imprimes - Partie 2: Spcification intermdiaire - Exigences relatives lassemblage par brasage pour montage en
6、 surface (CEI 61191-2:2013) Elektronikaufbauten auf Leiterplatten - Teil 2: Rahmenspezifikation - Anforderungen an geltete Baugruppen in Oberflchenmontage (IEC 61191-2:2013) This European Standard was approved by CENELEC on 2013-07-10. CENELEC members are bound to comply with the CEN/CENELEC Interna
7、l Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CE
8、NELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the offici
9、al versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Ma
10、lta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland, Turkey and the United Kingdom. BS EN 61191-2:2013EN 61191-2:2013 - 2 - Foreword The text of document 91/1091/FDIS, future edition 2 of IEC 61191-2, prepared by IEC/TC 91 “Electronics assembly tec
11、hnology “ was submitted to the IEC-CENELEC parallel vote and approved by CENELEC as EN 61191-2:2013. The following dates are fixed: latest date by which the document has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2014-04-10 latest dat
12、e by which the national standards conflicting with the document have to be withdrawn (dow) 2016-07-10 This document supersedes EN 61191-2:1998. EN 61191-2:2013 includes the following significant technical changes with respect to EN 61191-2:1998: IPC-A-610 on workmanship has been included as a normat
13、ive reference; some of the terminology used in the document has been updated; references to EN standards have been corrected; the use of lead-free solder paste and plating are addressed. Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rig
14、hts. CENELEC and/or CEN shall not be held responsible for identifying any or all such patent rights. Endorsement notice The text of the International Standard IEC 61191-2:2013 was approved by CENELEC as a European Standard without any modification. BS EN 61191-2:2013- 3 - EN 61191-2:2013 Annex ZA (n
15、ormative) Normative references to international publications with their corresponding European publications The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated references, only the edition cited applies. For u
16、ndated references, the latest edition of the referenced document (including any amendments) applies. NOTE When an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 61191-1 2013 Printed board asse
17、mblies Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies EN 61191-1 2013 IPC-A-610E 2010 Acceptability of Electronic Assemblies - - BS EN 61191-2:2013 2 61191-2 IEC:2013 CONTENTS 1 Scope . 6 2 Normativ
18、e references . 6 3 Conventions . 6 4 General requirements . 6 5 Classification 6 6 Surface mounting of components 7 6.1 General . 7 6.2 Alignment requirements . 7 6.3 Process control . 7 6.4 Surface mounted component requirements 7 6.5 Flatpack lead forming 7 6.5.1 General . 7 6.5.2 Surface mounted
19、device lead bends 8 6.5.3 Surface mounted device lead deformation . 8 6.5.4 Flattened leads 8 6.5.5 Dual-in-line packages (DIPs) . 8 6.5.6 Parts not configured for surface mounting . 9 6.6 Small devices with two terminations 9 6.6.1 General . 9 6.6.2 Stack mounting 9 6.6.3 Devices with external depo
20、sited elements . 9 6.7 Lead component body positioning . 9 6.7.1 General . 9 6.7.2 Axial-leaded components . 9 6.7.3 Other components . 9 6.8 Parts configured for butt lead mounting . 9 6.9 Non-conductive adhesive coverage limits 10 7 Acceptance requirements . 10 7.1 General . 10 7.2 Control and cor
21、rective actions . 10 7.3 Surface soldering of leads and terminations 10 7.3.1 General . 10 7.3.2 Solder fillet height and heel fillets 10 7.3.3 Flat ribbon L and gull-wing leads . 13 7.3.4 Round or flattened (coined) leads 13 7.3.5 J leads. 15 7.3.6 Rectangular or square end components . 16 7.3.7 Cy
22、lindrical end cap terminations 17 7.3.8 Bottom only terminations . 18 7.3.9 Leadless chip carriers with castellated terminations . 19 7.3.10 Butt joints 20 7.3.11 Inward L-shaped ribbon leads 21 7.3.12 Flat lug leads . 22 7.4 General post-soldering requirements applicable to all surface-mounted asse
23、mblies 23 BS EN 61191-2:201361191-2 IEC:2013 3 7.4.1 Dewetting 23 7.4.2 Leaching 23 7.4.3 Pits, voids, blowholes, and cavities 23 7.4.4 Solder wicking . 23 7.4.5 Solder webs and skins . 23 7.4.6 Bridging . 23 7.4.7 Degradation of marking . 23 7.4.8 Solder spikes . 23 7.4.9 Disturbed joint . 23 7.4.1
24、0 Component damage 24 7.4.11 Open circuit, non-wetting . 24 7.4.12 Component tilting 24 7.4.13 Non-conducting adhesive encroachment 24 7.4.14 Open circuit, no solder available (skip) 24 7.4.15 Component on edge 24 8 Rework and repair 24 Annex A (normative) Placement requirements for surface mounted
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