EN 60603-12-1998 en Connectors for Frequencies Below 3 MHz for Use with Printed Boards Part 12 Detail Specification for Dimensions General Requirements and Tests for a Range of Soc.pdf

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1、STD.BSI BS EN bOb03-12-ENGL L778 Lb24bb 0700007 5TL BS EN 60603-12 1998 lEC 60603-12 : 1992 BRITISH STANDARD Connectors for frequencies below 3 MHz for use with printed boards Part 12. Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with in

2、tegrated circuits The European Standard EN 6060312 : 1998 has the status of a British Standard ICs 31.220.10 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BS EN 60603-12 : 1998 Amd.No. National foreword Date Text affected This British Standard is the English language version

3、 of EN 6060312 : 1998. It is identical with IEC 60603-12 : 1992. The UK participation in its preparation was entrusted by Technical Committee EPU4.8, Electromechanical components for electronic equipment, to Subcommittee EPL/48/2, Connectors for electronic equipment, which has the responsibility to:

4、 - aid enquirers to understand the tea, - present to the responsible internationalEuropean committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; - monitor related international and European developments and promulgate them in the UK. A list of or

5、ganizations represented on this subcommittee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering

6、 system to the other, publications may contain identifiers from both systems. Cross-references Attention is drawn to the fact that CEN and CENELEC Standards normally include an annex which lists normative references to international publications with their corresponding European publications. The Br

7、itish Standards which implement these international or European publications may be found in the BSI Standards Catalogue under the section entitled ?International Standards Correspondence Index?, or by using the ?Find? facility of the BSI standards Electronic Catalogue. A British Standard does not p

8、urport to include all the necessary provisions of a contsact. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. This British Standard, having been prepared under the direction of the

9、 Electrotechnicai Sector Board, was published under the authority of the Standards Board and comes into effect on 15 May 1998 O BSI 1998 ISBN O 680 29294 O * m * EUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60603-12 February 1998 ICs 31.220.10 Descriptors: Electronic components, electric con

10、nectors, printed-circuit cards, detail specifications, dimensions, general conditions, tests, integrated circuits English version Connectors for frequencies below 3 MHz for use with printed boards Part 1 2: Detail specification for dimensions, general requirements and tests for a range of sockets de

11、signed for use with integrated circuits (IEC 60603-1 2:1992) Connecteurs pour frquences infrieures 3 MHz pour utilisation avec cartes imprimes Partie 1 2: Spcification particulire pour les dimensions, les prescriptions gnrales et les essais pour une gamme de socles concus pour emploi avec circuits i

12、ntgrs (CE1 60603-1 2:1992) Steckverbinder fr gedruckte Schaltungen fr Frequenzen unter 3 MHz Teil 12: Bauartspezifikation fr Mae, allgemeine Anforderungen und Prfungen fr eine Reihe von Fassungen zur Aufnahme von integrierten Schaltungen (IEC 60603-1 21992) This European Standard was approved by CEN

13、ELEC on 1998-01 -01. CENELEC members are bound to comply with the CENKENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standa

14、rds may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notif

15、ied to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden,

16、 Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stascart 35. B - 1050 Brussels - 1998 CENELEC - All rights of exploitation in

17、any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60603-121998 E STD-BSI BS EN bOb03-12-ENGL 1978 LbZLIbbS 0700012 07b Page 2 EN 60603-12 : 1998 Foreword The text of the International Standard IEC 60603-1 2:1992, prepared by SC 48B, Connectors, of IEC TC 48, Electromechan

18、ical components and mechanical structures for electronic equipment, was submitted to the formal vote and was approved by CENELEC as EN 60603-1 2 on 1998-01-01 without any modification. The following dates were fixed: - latest date by which the EN has to be implemented at national level by publicatio

19、n of an identical national standard or by endorsement (dop) 1998-1 2-01 - latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 1998-1 2-01 Annexes designated “normative“ are part of the body of the standard. In this standard, annex ZA is normative. Annexes Z

20、A has been added by CENELEC. Endorsement notice The text of the International Standard IEC 60603-1 2:1992 was approved by CENELEC as a European Standard without any modification. U U m - STD.BSI BS EN bOb03-12-ENGL 1778 lb24bb9 07000L3 T22 Page 3 EN 60603-12 : 1998 CONTENTS Ciause pea0 1 2 .3 4 5 6

21、7 8 9 10 11 12 13 Scope . . . . . . . . . . . . . . . . . . . . . . . . . 4 Normative references 4 IEC type designation 6 Common features 7 Dimensions 7 Characteristics . 8 Test schedule 11 Dual-in-line sockets with solder termination for through-board insertion (standard type) 19 Dual-in-line socke

22、ts with solderless wire wrapping terminations for through-board insertion (standard type) . 20 Dual-in-line sockets wfih solder terminations for through-board insertion (low-profile type) 21 Dual-in-line sockets with solderless wire wrapping terminations for through-board insertion (low-profile type

23、) 22 Individual contact retention force gauge 23 Socket gauges . 24 Annex ZA (normative) Normative references to international publications with their corresponding European publications . . . . . . . . 26 O BSI 1998 STDmBSI BS EN bOb03-LZ-ENGL 1778 Lb24bb7 0700014 7b9 H Page 4 EN 60603-12 : 1998 CO

24、NNECTORS FOR FREQUENCIES BELOW 3 MHz FOR USE WITH PRINTED BOARDS Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits 1 Scope This part of IEC 603 covers dimensions, general requirements and tests for a range of

25、 sockets designed for use with integrated circuits in dual-in-line format (see IEC 191-2 specified outlines, e.g. A-50). Sockets include standard type (see figures 6 and 7) and low-profile type (see figures 8 and 9). Sockets with terminations for through-board insertion are intended for use with pri

26、nted boards using a basic grid of 2,54 mm (0,l in) as laid down in IEC 97. Low-profile type sockets can be mounted side-by-side and end-to-end on a grid of 2,54 mm (0,l in). This detail specification does not cover teWbrn-in sockets. 2 Normative references The following normative documents contain p

27、rovisions which, through reference in this text, constitute provisions of this part of IEC 603. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agree- ments based on this part of IEC 603 are encouraged to investigate the

28、possibility .of applying the most recent editions of the normative documents indicated below. Members of IEC and IS0 maintain registers of currently valid International Standards. IEC 97: 1991, Grid systems for printed circuits. IEC 191 -2: 1966, Mechanical standardization of semiconductor devices -

29、 Part 2: Dimensions. IEC 51 2-2: 1985, Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 2: General examination, electrical continuity and contact resistance tests, insulation tests and voltage stress tests. STD.BS1 BS EN bOb03-LZ-ENGL 1998

30、lb2Ybb 07OOOL5 BT5 Page 5 EN 60603-12 : 1998 IEC 51 2-3: 1976, Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 3: Current-carrying capacity tests. IEC 51 2-4: 1976, Electromechanical components for electronic equipment; basic testing proce

31、dures and measuring methods - Part 4: Dynamic stress tests. I EC 51 2-5: 1977, Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests. I E

32、C 5 1 2-6: 1984, Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 6: Climatic tests and soldering tests. I EC 51 2-7: 1988, Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mech

33、anical operating tests and sealing tests. IS0 468: 1982, Surface roughness - Parameters, their values and general rules for specifying requirements. STD.BS1 BS EN bOb03-12-ENGL 1998 m 1b2ibbS 07000Lb 731 m 603 -12 IEC LNNN L Page 6 EN 60603-12 : 1998 -L N N 3 IEC type designation 3 Sockets according

34、 to this part shall be designated by the following system: PL3 Letter denoting 1 2 3 4 Number of contacts Gold gold-alloy Silver silver-alloy Tin tin-alloy Palladium palladium-alloy 006 008 010 014 016 -018 020 022 024 028 032 036 040 042 048 064 - c Letter denoting the distance between the two cont

35、act rows A 7.62 mm (0.3 in) B 10.16 mm (0,4 in) I Letter denoting basic type of termination Solder S Wrap W i _I 1 NOTE - La stands for letter; N stands for number. L I. I Number denoting I perform -level PL I 1 I PL1 1 2 I PL2 15,24 mm (O$ in) 22,86 mm (0,s in) Page 7 EN 60603-12 1998 Number of con

36、tacts Current-carrying capacity Minimum creepage and clearance distance 4 Common features 4.1 Isometric view 06/08/1 QI1 411 611 8/2Q/22/24/28/32/36/4Q/42/48164 See 6.2.3 Between contacts and chassis See 6.2.1 Between adjacent contacts See 6.2.1 Reference notch Reference corner indicating contact in

37、dicating contact position - 1 (note) position - 1 (note) NOTE - Either notch or corner may be omitted. Figure 1 4.2 Survey of types Table 1 1 I I I 5 Dimenslons 5.1 General Dimensions are given in millimeters with inch equivalents. Dimensions in inches are original. Drawings are third angle projecti

38、on. The shape of the connectors may deviate from that shown in the drawings so long as the specified dimensions are not influenced. STD.BSI BS EN bOb03-LZ-ENGL 1978 Lb24bb 0700018 509 Performance Temperature Category range level PL1 55/100/56 - 55 “C to + 100 “C PL2 55iOOI2 1 - 55 oc to + 100 “C PL3

39、 4010as121 - 40 “C to + 85 C Page 8 EN 60603-12 : 1998 Damp heat, steady state 56 days 21 days 21 days In cases where the tolerance is unspecified, f 0.3 mm (0,012 in) is the tolerance required for millimeter dimensions stated to one decimal place and f 0,13 mm (0,005 in) is the toler- ance required

40、 for millimeter dimensions stated to two decimal places. 5.2 Dual-in-line sockets 5.2.1 Solder termination Construction and dimensions should be in accordance with figures 6 and 8. 5.2.2 Wrap post Construction and dimensions should be in accordance with figures 7 and 9. 5.2.3 Contact retention force

41、 gauge Construction and dimensions should be in accordance with figure 1 O. 5.2.4 Insertion force, withdrawal force and contact resistance gauges Construction and dimensions should be in accordance with figure 11. 6 Characteristics 6.1 Climatic category Climatic categories are shown in table 2. Tabl

42、e 2 6.2 Electrical 6.2.1 Clearance and creepage distances The permissible operating voltages depend on the application and on the applicable or specified safety requirements. Therefore the clearance and creepage distances are given as operating characteristics. The minimum clearance and creepage dis

43、tance should be in accordance with table 3. Page 9 EN 60603-12 : 1998 Between contacts and chassis Table 3 Creepage 0,5 mm (0,02 in) Clearance 0,5 mm (0,02 in) Creepage Clearance I Between adjacent contacts I 0,5 mm (0,02 in) 0,5 mm (0,02 in) 6.2.2 Voltage proof Conditions: IEC 512-2, test 4a, metho

44、d 6. Standard atmospheric conditions. Contacticontact: 500 V r.m.s. The values are the same for performance levels PL1 , PL2 and PL3. 6.2.3 Current-carrying capacity Conditions: IEC 512-3, test 5a. Current-carrying capacity: 0,5 A Temperature rise At not to exceed 30 OC. 6.2.4 initiai contact resist

45、ance Conditions: IEC 512-2. test 2a. Standard atmospheric conditions. Connection points: according to 7.1.1. Performance levels PL1 and PL2: Performance level PL3: 20 mR maximum. 30 mil maximum. 6.2.5 initiai insulation resistance Conditions: IEC 512-2, test 3a, method B. Standard atmospheric condit

46、ions. Test voltage: 500 V f 50 V d.c. All performance levels: 1 O00 Mn minimum. Page 10 EN 60603-12 : 1998 6.3 Mechanical 6.3.1 Insertion and withdrawal forces Conditions: IEC 512-7. test 13b. Mating counterpart: The maximum insertion and withdrawal force should be in accordance with table 4. Gauge

47、as per figure 11. Table 4 PL1 and PL2 13.2 17,6 22.0 30.8 35,2 39,6 44,O 48.4 52.8 61 6 70,4 79,2 88,O 92,4 105.6 140.8 Number of contacts p13 19,8 26,4 33,0 46,2 52.8 59.4 66,0 72,6 79.2 92.4 105.6 118.8 132.0 138.6 158,4 211,2 06 08 10 14 16 18 20 22 24 28 32 36 40 42 48 64 6.3.2 Mechanical endura

48、nce Conditions: IEC 512-5, test 9d. Mating counterpart: Number of operations: 5 cycles. 6.3.3 Vibration Conditions: IEC 512-4, test 6d. Test conditions should be in accordance with table 5. Sizing gauge as per figure 10. Table 5 Performance level 1 PL1 P L2 P L3 Severity 10 Hr to 2 O00 Hr 1.5 mm (0.

49、06 in) or 147 mls* (15 9). 3 x 4 h 10 Hr to 500 Hz 035 mm (0,014 in) or 49 m/s* (5 g). 3 x 2 h 10 Hz to 55 Hz 1.5 mm (0.06 in) 3x2h Page 11 EN 60603-12 : 1998 Performance level PL1 and PL2 The measurements of contact resistance should be carried out in accordance with figure 2. Severity 100 g Applicable dual-in-line , A device mated with socket Socket, secured to Eki- shock or vibration fixture Test points, L to establish series circuits Figure 2 6.3.4 Shock Conditions: IEC 512-4, test 6c. Test conditions should be in accordanc