ECA EIA-704-A-2013 Mechanically-Interlocked Component Packaging for Automatic Handling.pdf
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1、 EIA STANDARD Mechanically-Interlocked Component Packaging for Automatic Handling EIA-704-A (Revision of EIA-704) August 2013 EIA-704-ANOTICE EIA Engineering Standards and Publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purchaser
2、s, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards and Publications shall not in any respect preclude any member or nonmember of ECIA from ma
3、nufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than ECIA members, whether the standard is to be used either domestically or internationally. Standards and Public
4、ations are adopted by ECIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, ECIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the Standard or Publication. This EIA Standard is consi
5、dered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC document can be made. This Standard does not purport to address all safety problems associ
6、ated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulatory limitations before its use. (From Standards Proposal No. 5264, formulated under the
7、 cognizance of the Automated Component Handling Committee on EIA Standards). Published by Electronic Components Industry Association 2013 Engineering Department 2214 Rock Hill Road, Suite 170 Herndon, VA 20170 PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by the ECIA and may not be repr
8、oduced without permission. Organizations may obtain permission to reproduce a limited number of copies through entering into a license agreement. For information, contact: IHS 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-877-413-5184), International (303-397-7956) i MECHA
9、NICALLY-INTERLOCKED COMPONENT PACKAGING FOR AUTOMATIC HANDLING CONTENTS Page 1 SCOPE 1 2 INTRODUCTION 1 3 APPLICABLE DOCUMENTS 1 4 REQUIREMENTS 1 Figures Figure 1 Mechanically-interlocked embossed carrier configuration 5 Figure 3 Mechanically-interlocked flat carrier configuration 6 Figure 3 Reel di
10、mensions 8 Figure 4 Sprocket hole detail, tape bending radius, and bar code label area 10 Figure 5 Tape leader and embossed carrier with precision formed pockets. 3 Applicable Documents Unless otherwise specified the following documents form a part of this standard to the extent specified herein. Th
11、ese procedures contain provisions that, through reference in the text, constitute normative references of these procedures. All standards are subject to revision, and parties to agreements based on these procedures are encouraged to investigate the possibility of applying the most recent editions of
12、 this document and those listed here. EIA-383 “Preparation for the Delivery of Electrical and Electronic Components” EIA-541 “Packaging Material Standards for ESD Sensitive Items” EIA-556 “Electronic Industries Association Outer Shipping Container Bar Code Label Standard” EIA-583 “Packaging Material
13、 Standards for Moisture Sensitive Items” EIA-481 “8 mm Through 200 mm Embossed Carrier Taping and 8 mm & 12 mm Punched Carrier Taping of Surface Mount Components for Automatic Handling” EIA-624 “Product Package Bar Code Label Standard for Non-Retail Applications” JEP95 “JEDEC Registered and Standard
14、 Outlines for Solid State and Related Products” 4 Requirements 4.1 Carrier tapes, cover tapes, reels, and taped components must meet the requirements defined in the Figures and Tables presented herein. EIA-704-A Page 2 4.2 The package design may utilize a carrier tape and cover tape which mechanical
15、ly interlock across the carrier tape width at predetermined locations between each component row to secure, orient and accurately position components on the carrier tape. For flat carrier tape, this design may also include an antistatic foam interleave tape. 4.3 Procurement documents and quotation r
16、equests shall include the following information: (a) Reference to this Standard by Title and Number. (b) Taping quality requirements including maximum number of missing components. (c) Container and reel marking requirements (including bar code labeling if required), and reel diameter (refer to 4.12
17、 and Figure 4). (d) Shipping conditions, storage conditions and storage time. (e) Weight of the reel containing components. NOTE: A heavy reel may not work on all feeders. Also, a reel containing components attached to a feeder may exceed regulatory or corporate weight limits for lifting by workers.
18、 4.4 Components are to be prevented from falling out of the cavity of the carrier tape, and shall remain in position for automatic handling after removal of the cover tape (see Note 1, Table 1). 4.5 The packaging method shall not obstruct any part of the sprocket holes. 4.6 The carrier tape and/or t
19、he packaging method in adjacent layers shall not stick together when unwinding from the carrier reel. 4.7 The packaging, materials and processes shall not adversely affect the mechanical and electrical characteristics or marking of the components. For intermediate and final packaging, refer to EIA-3
20、83 “Preparation for the Delivery of Electrical and Electronic Components,” EIA-541 “Packaging Material Standards for ESD Sensitive Items,” and EIA-583 “Packaging Material Standards for Moisture Sensitive Items,” and EIA-624 “Product Package Bar Code Label Standard for Non-Retail Applications.“ 4.8 T
21、he packaging method shall be suitable to withstand storage of the packaged components without danger of migration of contaminants onto the terminations, or the emission of vapors which would make soldering difficult or deteriorate the component properties or terminations by chemical action. In addit
22、ion, the packaging method shall not become detached, such that the components do not remain in position after storage (see Subclause 4.3(d). 4.9 Components may be removed from the packaging (virtual) boundary by incising the cavity at or below the depth midpoint (K0/2) for embossed tape (Figure 1) o
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