DLA SMD-5962-96775 REV B-2010 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT INCIDENT-WAVE SWITCHING BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SI.pdf
《DLA SMD-5962-96775 REV B-2010 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT INCIDENT-WAVE SWITCHING BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SI.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-96775 REV B-2010 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT INCIDENT-WAVE SWITCHING BUS TRANSCEIVER WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SI.pdf(23页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. - LTG 03-02-04 Thomas M. Hess B Update boilerplate paragraphs to current requirements of MIL-PRF-38535 MAA 10-04-19 Thomas M. Hess REV SHET REV B B B B B B B B SHEET
2、15 16 17 18 19 20 21 22 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Bernard J. Miesse DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles F. Saffle, Jr. T
3、HIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT INCIDENT-WAVE SWITCHING BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROV
4、AL DATE 96-04-11 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-96775 SHEET 1 OF 22 DSCC FORM 2233 APR 97 5962-E268-10 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96775 DEFENSE SUPPLY CENTER COLUM
5、BUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are a
6、vailable and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96775 01 Q X A Federal stock class designator RHA designator (see 1.2.1) De
7、vice type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RH
8、A marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABTE
9、16245 16-bit incident-wave switching bus transceiver with three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certific
10、ation to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter De
11、scriptive designator Terminals Package style X GDFP1-F48 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
12、rom IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96775 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN)(except I/O ports)
13、-0.5 V dc to +7.0 V dc 4/ DC output voltage range applied to any output in the high state or power-off state (VOUT) -0.5 V dc to +5.5 V dc 4/ DC output current (IOL) (per output) . +128 mA DC input clamp current (IIK) (VIN 0.0 V ) -18 mA DC output clamp current (IOK) (VOUT 0.0 V) . -50 mA Maximum po
14、wer dissipation at TA= +55C (in still air) (PD) . 827 mW 5/ Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. 2/ 3/ 6/ Supp
15、ly voltage range (VCC) +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH): OE +2.0 V Except OE +1.6 V Maximum low level input voltage (VIL): OE +0.8 V Except OE +1.4 V Input voltage range (VIN) +0.0 V dc to VCCMaximum high level output current (IOH): B bus -12 mA A bus -24 mA Maximum low
16、level output current (IOL): B bus +12 mA A bus +64 mA Maximum input transition rise or fall rate (t/V) (outputs enabled) 10 ns/V Operating case temperature range (TC) . -55C to +125C 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the max
17、imum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative volt
18、age ratings may be exceeded provided that the input and output clamp current ratings are observed. 5/ Power dissipation values are derived using the formula PD= VCCICC+ nVOLIOL, where VCCand IOLare as specified in 1.4 above, ICCand VOLare as specified in table I herein, and n represents the total nu
19、mber of outputs. 6/ Unused or floating pins (input or A-bus I/O) must be held high or low. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96775 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISI
20、ON LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are tho
21、se cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Ou
22、tlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue
23、, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specifi
24、c exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan
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