DLA SMD-5962-93218 REV C-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf
《DLA SMD-5962-93218 REV C-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-93218 REV C-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf(20页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes IAW NOR 5962-R287-94 - jak 94-11-23 Monica L. Poelking B Update boilerplate to MIL-PRF-38535. Editorial changes throughout jak 00-11-21 Thomas M. Hess C Correct test condition for high level output voltage (VOH) and low level output volta
2、ge (VOL) in the table I. Update the boilerplate paragraphs to current requirements of MIL-PRF-38535 MAA 09-04-14 Thomas M. Hess REV SHEET REV C C C C C SHEET 15 16 17 18 19 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Joseph A. Kerb
3、y STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-04-27 MICR
4、OCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL TRANSPARENT D-TYPE LATCH WITH THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-93218 SHEET 1 OF 19 DSCC FORM 2233 APR 97 5962-E219-09 Provided by IHSNot for ResaleNo reproduction or ne
5、tworking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93218 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high rel
6、iability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The P
7、IN is as shown in the following example: 5962 - 93218 01 Q R A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA ma
8、rked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Devi
9、ce type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT373 Octal transparent D-type latch with 3-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the pr
10、oduct assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 C
11、ase outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead f
12、inish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93218 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS
13、, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +5.5 V dc 4/ DC input clamp current (IIK) (VI
14、N 0.0 V). -18 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA DC output current (IOL) (per output). +96 mA Storage temperature range (TSTG). -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175
15、C Maximum power dissipation (PD) . 500 mW 1.4 Recommended operating conditions. 2/ 3/ 5/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCC Maximum low level input voltage (VIL) +0.8 V Minimum high level input vol
16、tage (VIH). +2.0 V Case operating temperature range (TC). -55C to +125C Maximum input rise and fall rate (t/V) 5 ns/V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) +48 mA _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device.
17、 Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The
18、input and output negative voltage ratings may be exceeded provided that the input and output clamp current ratings are observed. 5/ Unused inputs must be held high or low to prevent them from floating. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-
19、STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93218 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of
20、 this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS M
21、IL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs). MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available onl
22、ine at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing
23、 takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specifie
24、d herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN cla
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