DLA SMD-5962-93199 REV C-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUFFER DRIVER WITH INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

《DLA SMD-5962-93199 REV C-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUFFER DRIVER WITH INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-93199 REV C-2009 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS 16-BIT BUFFER DRIVER WITH INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf（18页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes IAW 5962R208- 94-06-08 Monica L. Poelking B Changes ICC and ground bounce. Editorial changes throughout. - jak 99-01-21 Monica L. Poelking C Correct test condition for high level output voltage (VOH) and low level output voltage (VOL) in

2、the table I. Update the boilerplate paragraphs to current requirements of MIL-PRF-38535. - MAA 09-03-24 Thomas M. Hess REV SHEET REV C C C SHEET 15 16 17 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen STANDARD MICROCIR

3、CUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY Monica L. Poelking MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, 16-BIT BUFFER/DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, THIS DRAWING IS AVAILAB

4、LE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-11-24 MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-93199 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E218-09 Provided by IHSNot for ResaleNo reproduction or networking permitted

5、without license from IHS-,-,-SIZE A 5962-93199 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device cl

6、asses Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in t

7、he following example: 5962 - 93199 01 M X A Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet t

8、he MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The dev

9、ice type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ABT16240A 16-bit buffer/driver with inverting three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assura

10、nce level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(

11、s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X GDFP1-F48 48 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device clas

12、s M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-93199 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply

13、 voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to +7.0 V dc 4/ DC output voltage range (VOUT) . -0.5 V dc to +5.5 V dc 4/ DC input clamp current (IIK) (VIN 0.0) -18 mA DC output clamp current (IOK) (VOUT 0.0) -50 mA DC output current (IOL) (per output) +96 mA VCCc

14、urrent (IVCC) . 514 mA Ground current (IGND) . 1056 mA Storage temperature range (TSTG) . -65C to +150C Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C Maximum power dissipation (PD) . 598 mW 5/ 1.4 Recommen

15、ded operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Input voltage range (VIN) +0.0 V dc to VCCOutput voltage range (VOUT). +0.0 V dc to VCCMinimum High level input voltage (VIH) +2.0 V Maximum Low level input voltage (VIL). +0.8 V Case operating temperature range( TC) .

16、 -55C to +125C Maximum input transition rise or fall rate (t / V) (outputs enabled). 10 ns/V Maximum High level output current (IOH) -24 mA Maximum Low level output current (IOL). +48 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

17、 maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input and output negative-

18、voltage ratings may be exceeded provided that the input and output clamp-current ratings are observed. 5/ Power dissipation values are derived using the formula PD= VCCICC+ nVOLIOL, where VCCand IOLare as specified in 1.4 above, ICCand VOLare as specified in table I herein, and “n“ represents the to

19、tal number of outputs. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-93199 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1

20、 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPEC

21、IFICATION MIL-PRF-38535 - Integrated Circuits Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Stand

22、ard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence.

23、 In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements.

24、 The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The

25、 individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-3853

26、5 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth tabl

27、e shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Ground bounce load circuit and waveforms. The ground bounce load circuit and waveforms shall be as specified on figure 4. 3.2.6 Switching waveforms and test circuit. The switching wav

28、eforms and test circuit shall be as specified on figure 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SIZE A 5962-93199 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 5 DSCC FORM 223

29、4 APR 97 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4

30、 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked.

31、 For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in acc

32、ordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a

33、 “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of

34、 compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product

35、 meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M

36、 in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any ch

37、ange that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at th

38、e option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 126 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,

39、-SIZE A 5962-93199 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test conditions 2/ -55C TC +125C +4.5 V VCC +

40、5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit VOH1For all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOH= -3 mA 4.5 V 2.5 VOH2For all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOH= -3 mA 5.0 V 3.0 High level output voltage 3006 VOH3For all in

41、puts affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOH= -24 mA 4.5 V 1, 2, 3 2.0 V Low level output voltage 3007 VOLFor all inputs affecting output under test, VIH= 2.0 V or VIL= 0.8 V IOL= +48 mA 4.5 V 1, 2, 3 0.55 V Negative input clamp Voltage 3022 VIC-For input under test, IIN= -18 mA 4.

42、5 V 1, 2, 3 -1.2 V Three-state output leakage current high 3021 IOZH4/ For control inputs affecting output under test, VIN= VIH= 2.0 V or VIL= 0.8 V VOUT= 2.7 V 5.5 V 1, 2, 3 10.0 A Three-state output leakage current low 3020 IOZL4/ For control inputs affecting output under test, VIN= VIH= 2.0 V or

43、VIL= 0.8 V VOUT= 0.5 V 5.5 V 1, 2, 3 -10.0 A Off-state leakage current IOFFFor input or output under test, VINor VOUT= 4.5 V All other pins at 0.0 V 0.0 V 1 100 A High-state leakage current ICEXFor output under test, VOUT= 5.5 V Outputs at high logic state 5.5 V 1, 2, 3 50 A Input current high 3010

44、IIHFor input under test, VIN= VCC5.5 V 1, 2, 3 +1.0 A Input current low 3009 IILFor input under test, VIN= GND 5.5 V 1, 2, 3 -1.0 A Output current 3011 IO 5/ VOUT= 2.5 V 5.5 V 1, 2, 3 -50.0 -180.0 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted

45、without license from IHS-,-,-SIZE A 5962-93199 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Limits 3/ Test and MIL-STD-883 test method 1/ Symbol Test

46、conditions 2/ -55C TC +125C +4.5 V VCC +5.5 V unless otherwise specified VCCGroup A subgroups Min Max Unit 1 1.0 For inputs under test, VIN= 3.4V For all other inputs VIN= VCC or GND Data inputs, outputs enabled 5.5 V 2, 3 1.5 1 0.05 For inputs under test, VIN= 3.4V For all other inputs VIN= VCC or

47、GND Data inputs, outputs disabled 5.5 V 2, 3 1.0 Quiescent supply current delta, TTL input level 3005 ICC 6/ For inputs under test, VIN= 3.4V For all other inputs VIN= VCC or GND Control inputs 5.5 V 1, 2, 3 1.5 mA Quiescent supply current, Outputs high 3005 ICCHVIN= VCC or GND IOUT= -0.0 A 5.5 V 1,

48、 2, 3 3.0 mA Quiescent supply current, outputs low 3005 ICCLVIN= VCC or GND IOUT= -0.0 A 5.5 V 1, 2, 3 34.0 mA Quiescent supply current outputs disabled 3005 ICCZVIN= VCC or GND IOUT= -0.0 A 5.5 V 1, 2, 3 3.0 mA Input capacitance 3012 CINTC= +25C See 4.4.1c 5.0 V 4 14.5 pF Output capacitance 3012 COUTTC= +25C See 4.4.1c 5.0 V 4 14.5 pF VOLP 7/ 5.0 V 4 700 mV Low level ground bounce noise VOLV 7/ VIH= 3.0 V or VIL= 0.0 V TA= +25C See figure 4 5.0 V 4 -1300 mV VOHP 7/ 5.0 V 4 1300 mV High level VCCbounce noise VOHV 7/ VIH= 3.0