DLA SMD-5962-93188 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL BUFFER DRIVER WITH INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON《单片硅TTL兼容输入 .pdf
《DLA SMD-5962-93188 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL BUFFER DRIVER WITH INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON《单片硅TTL兼容输入 .pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-93188 REV C-2008 MICROCIRCUIT DIGITAL ADVANCED BIPOLAR CMOS OCTAL BUFFER DRIVER WITH INVERTING THREE-STATE OUTPUTS TTL COMPATIBLE INPUTS MONOLITHIC SILICON《单片硅TTL兼容输入 .pdf(18页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R144-94 tvn. 94/05/02 Monica L. Poelking B Changes in accordance with NOR 5962-R009-96 tvn. 95/11/22 Monica L. Poelking C Redrawn with changes. Update the boilerplate to the current requirements of MIL-PRF-3853
2、5. - jak. 08-08-01 Thomas M. Hess REV SHET REV C C C SHEET 15 16 17 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO
3、43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 94-02-04 MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL BUFFER/DRIVER WITH INVERTING THREE-STATE OUTPUTS, TTL COM
4、PATIBLE INPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-93188 SHEET 1 OF 17 DSCC FORM 2233 APR 97 5962-E440-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93188 DEFENSE SU
5、PPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and le
6、ad finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 93188 01 M R A Federal stock class designator RHA designat
7、or (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator.
8、 Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit
9、function 01 54ABT240 Octal buffer/driver with inverting three-state outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certificat
10、ion to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Desc
11、riptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, and V or MIL-PRF-38535, appendix A for devic
12、e class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93188 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ 3/
13、Supply voltage range (VCC) . -0.5 V dc to +7.0 V dc DC input voltage range (VIN) . -0.5 V dc to 7.0 V dc 4/ DC output voltage range (VOUT) -0.5 V dc to 5.5 V dc 4/ DC input clamp current (IIK) (VIN= 0.0 V). -18 mA DC output clamp current (IOK) (VOUT 0.0 V). -50 mA DC output current (IOL) (per output
14、). +96 mA Storage temperature range (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) . +175C Maximum power dissipation (PD) . 500 mW 1.4 Recommended operating conditions. 2/ 3/ Supply voltage rang
15、e (VCC) . +4.5 V dc to +5.5 V dc Input voltage range (VIN) . +0.0 V dc to VCCOutput voltage range (VOUT) +0.0 V dc to VCCMaximum low level input voltage (VIL ) 0.8 V Minimum high level input voltage (VIH ) . 2.0 V Case operating temperature range (TC) -55C to +125C Minimum input edge rate (V/t) . 5
16、ns/V Maximum high level output current (IOH) -24 mA Maximum low level output current (IOL) . +48 mA 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise not
17、ed, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. 4/ The input negative and output voltage rating mat be exceeded provided that the input and output clamp current rating
18、is observed. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-93188 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Governmen
19、t specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION
20、MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Micro
21、circuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the e
22、vent of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The indi
23、vidual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individu
24、al item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and her
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