DLA SMD-5962-93156 REV B-2000 MICROCIRCUIT HYBRID MEMORY DIGITAL STATIC RANDOM ACCESS MEMORY CMOS 128K X 8-BIT《128K X 8位静态随机存取存储器 氧化物半导体记忆混合微型电路》.pdf
《DLA SMD-5962-93156 REV B-2000 MICROCIRCUIT HYBRID MEMORY DIGITAL STATIC RANDOM ACCESS MEMORY CMOS 128K X 8-BIT《128K X 8位静态随机存取存储器 氧化物半导体记忆混合微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-93156 REV B-2000 MICROCIRCUIT HYBRID MEMORY DIGITAL STATIC RANDOM ACCESS MEMORY CMOS 128K X 8-BIT《128K X 8位静态随机存取存储器 氧化物半导体记忆混合微型电路》.pdf(19页珍藏版)》请在麦多课文档分享上搜索。
1、REVISIONSLTR DESCRIPTION DATE (YR -MO -DA) APPROVEDA Added Case outline Y. Changes to table I. 96-04-19 K. A. CottongimB Added note to paragraph 1.2.2 and table I to regarding the 4 transistordesign. Added thermal resistance ratings for all case outlines toparagraph 1.3. Editorial changes throughout
2、. -sld00-07-10 Raymond MonninREVSHEETREV B B BSHEET 15 16 17REV STATUS REV B B B B B B B B B B B B B BOF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14PMIC N/A PREPARED BY Steve L. Duncan DEFENSE SUPPLY CENTER COLUMBUSSTANDARDMICROCIRCUIT DRAWINGCHECKED BYMichael C. JonesPOST OFFICE BOX 3990COLUMBUS,
3、 OHIO 43216-5000THIS DRAWING ISAVAILABLEFOR USE BY ALLDEPARTMENTSAPPROVED BYKendall A. Cottongim MICROCIRCUIT, HYBRID, MEMORY, DIGITAL,STATIC RANDOM ACCESS MEMORY, CMOS,128K x 8-BITAND AGENCIES OF THEDEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 93-04-01AMSC N/A REVISION LEVELBSIZEACAGE CODE67268 5962
4、-93156SHEET 1 OF 17DSCC FORM 2233APR 97 5962 -E281 -00DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-93156DEFENSE SUPPLY CENTER
5、COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET2DSCC FORM 2234APR 971. SCOPE1.1 Scope . This drawing documents five product assurance classes, class D (lowest reliability), class E, (exceptions), class G(lowered high reliability), class H (high reliability), and class K, (highest reliability)
6、and a choice of case outlines and lead finishes areavailable and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levelsare reflected in the PIN.1.2 PIN . The PIN shall be as shown in the following example:5962 - 93156 01 H X X Federal R
7、HA Device Device Case Leadstock class designator type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number1.2.1 Radiation hardness assurance (RHA) designator . RHA marked devices shall meet the MIL-PRF-38534 specified RHAlevels and s
8、hall be marked with the appropriate RHA designator. A dash ( -) indicates a non -RHA device.1.2.2 Device type(s) . The device type(s) shall identify the circuit function as follows:Device type 1 / Generic number Circuit function Access time01 WS-128K8-120CQ SRAM, 128K x 8-bit 120 ns02 WS-128K8-100CQ
9、 SRAM, 128K x 8-bit 10 0 ns03 WS-128K8-85CQ SRAM, 128K x 8-bit 85 ns04 WS-128K8-70CQ SRAM, 128K x 8-bit 70 ns05 WS-128K8-55CQ SRAM, 128K x 8-bit 55 ns06 WS-128K8-45CQ SRAM, 128K x 8-bit 45 ns07 WS-128K8-35CQ SRAM, 128K x 8-bit 35 ns08 WS-128K8-25CQ SRAM, 128K x 8-bit 25 ns1.2.3 Device class designat
10、or . This device class designator shall be a single letter identifying the product assurance level asfollows:Device class Device performance documentationD, E, G, H, or K Certification and qualification to M IL -PRF -385341.2.4 Case outline(s) . The case outline(s) shall be as designated in MIL -STD
11、-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX 2 / See figure 1 32 Dual-in -line, dual cavityY See figure 1 32 Dual-in-line, single cavity1.2.5 Lead finish . The lead finish shall be as specified in MIL-PRF-38534.1 / Due to the nature of the 4 transistor design o
12、f the die in these device types, topologi cally pure testing is important,particularly for high reliability applications. The device manufacturer should be consulted concerning their testingmethods and algorithms.2 / The case outline X is no longer available.Provided by IHSNot for ResaleNo reproduct
13、ion or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-93156DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET3DSCC FORM 2234APR 971.3 Absolute maximum ratings . 1 /Supply voltage range (V CC ) -0.5 V dc to +7.0 V dcSignal voltage ran
14、ge (any pin) -0.5 V dc to +7.0 V dcPower dissipation (P D ) 1 WThermal resistance, junction- to case ( JC ):Case outline X . 6.40 C/WCase outline Y . 7.57 C/WStorage temperature range -65 C to +150 CLead temperature (soldering, 10 seconds) +300 C1.4 Recommended operating conditions .Supply voltage r
15、ange (V CC ) +4.5 V dc to +5.5 V dcInput low voltage range (V IL ) -0.5 V dc to +0.8 V dcInput high voltage range (V IH ) +2.2 V dc to V CC +0.3 V dcOutput low voltage, maximum (V OL ) . +0.4 V dcOutput high voltage, minimum (V OH ) +2.4 V dcCase operating temperature range (T C ) -55 C to +125 C2.
16、APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks . The following specification, standards, and handbooks form a part ofthis drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issueof the Department of De
17、fense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation.SPECIFICATIONDEPARTMENT OF DEFENSEMIL -PRF -38534 - Hybrid Microcircuits, General Specification for.STANDARDSDEPARTMENT OF DEFENSEMIL -STD -883 - Test Method Standard Microcircuits.MIL-STD-1835 - I
18、nterface Standard For Microcircuit Case Outlines.HANDBOOKSDEPARTMENT OF DEFENSEMIL -HDBK -103 - List of Standard Microcircuit Drawings (SMD s).MIL -HDBK -780 - Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Sta
19、ndardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)2.2 Order of precedence . In the event of a conflict between the text of this drawing and the references cited herein, the text ofthis drawing takes precedence. Nothing in this document, however, supersede
20、s applicable laws and regulations unless a specificexemption has been obtained.1 / Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.Provided by IHSNot for ResaleNo reproduction
21、or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGSIZEA 5962-93156DEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216-5000REVISION LEVELBSHEET4DSCC FORM 2234APR 973. REQUIREMENTS3.1 Item requirements . The individual item performance requirements for device classes D, E
22、, G, H, and K shall be inaccordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or asdesignated in the device manufacturers Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein
23、 may not be performed for the applicable device class (see MIL-PRF-38534). Furthermore, the manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not performthem. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the appli
24、cable device class.3.2 Design, construction, and physical dimensions . The design, construction, and physical dimensions shall be as specified inMIL-PRF-38534 and herein.3.2.1 Case outline(s) . The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.3.2.2 Terminal connections . The
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