DLA SMD-5962-92338 REV A-2012 MICROCIRCUIT MEMORY DIGITAL BICMOS ONE TIME PROGRAMMABLE PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated to current boilerplate requirements. lhl 12-09-14 Charles F. Saffle REV SHEET REV A A SHEET 15 16 REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice DLA LAND AND M
2、ARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Rajesh Pithadia APPROVED BY Michael Frye MICROCIRCUIT, MEMORY, DIGITAL, BICMOS, ONE TIME PROGRAM
3、MABLE, PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON DRAWING APPROVAL DATE 93-02-12 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-92338 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E456-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD
4、MICROCIRCUIT DRAWING SIZE A 5962-92338 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device clas
5、s V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 92338 01 M R A Feder
6、al stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are mar
7、ked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as foll
8、ows: Device type Generic number Circuit function Access time 01, 05 16L8 16-input 8-output AND-OR invert logic array 10, 7 ns 02, 06 16R8 16-input 8-output registered AND-OR invert logic array 10, 7 ns 03, 07 16R6 16-input 6-output registered AND-OR invert logic array 10, 7 ns 04, 08 16R4 16-input 4
9、-output registered AND-OR invert logic array 10, 7 ns 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compl
10、iant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R
11、GDIP1-T20 or CDIP2-T20 20 Dual-in line S GDFP2-F20 or CDFP3-F20 20 Flat pack X CQCC2-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo rep
12、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92338 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range to ground potential (VCC) -0.5 V dc to +
13、7.0 V dc DC voltage applied to the outputs in the high Z state . -0.5 V dc to VCC +0.5 V DC input voltage . -1.2 V dc to VCC +0.5 V DC input current . -30 mA to +5 mA Maximum power dissipation . 1.0 W 2/ Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, junction-to-case (JC) . See
14、 MIL-STD-1835 Junction temperature (TJ) . +175C Storage temperature range -65C to +150C Temperature under bias . -55C to +125C 1.4 Recommended operating conditions. Supply voltage VCC) +4.5 V dc minimum to +5.5 V dc maximum Ground voltage (GND) . 0 V dc Input high voltage (VIH) . 2.0 V dc minimum In
15、put low voltage (VIL) . 0.8 V dc maximum Case operating temperature range (TC) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless othe
16、rwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD
17、-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Stand
18、ardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of the documents are the issues of the documen
19、ts cited in the solicitation. JEDEC INTERNATIONAL (JEDEC) JEDEC Standard No. 78 - IC Latch-Up Test. (Copies of this document are available online at www.jedec.org/ or from JEDEC Solid State Technology Association, 3103 North 10th Street, Suite 240-S, Arlington, VA 22201). 2.3 Order of precedence. In
20、 the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum
21、rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PD due to short circuit test (e.g., ISC). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IH
22、S-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-92338 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specifi
23、ed herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN c
24、lass level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outli
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