DLA SMD-5962-91534 REV B-2010 MICROCIRCUIT LINEAR LOW POWER 70 MHZ BUFFER AMPLIFIER MONOLITHIC SILICON.pdf

《DLA SMD-5962-91534 REV B-2010 MICROCIRCUIT LINEAR LOW POWER 70 MHZ BUFFER AMPLIFIER MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-91534 REV B-2010 MICROCIRCUIT LINEAR LOW POWER 70 MHZ BUFFER AMPLIFIER MONOLITHIC SILICON.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make changes to the input resistance test. Delete the group A subgroup 1 min limit of “3 M” and substitute “1 M”. Delete the group A subgroup s 2 and 3 min limit of “1 M” and substitute “0.5 M”. Changes in accordance with NOR 5962-R031-95. 94-12-

2、02 M. A. FRYE B Update boilerplate paragraphs to current MIL-PRF-38535 requirements. Redrawn. - ro 10-04-05 C. SAFFLE THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY RICK C. OFF

3、ICER DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, LOW POWER,7

4、0 MHz BUFFER AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 91-05-23 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-91534 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E246-10 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU

5、IT DRAWING SIZE A 5962-91534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device cla

6、ss V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 91534 01 M P A Fede

7、ral stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2)Device class designatorCase outline (see 1.2.4) Leadfinish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marke

8、d with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follow

9、s: Device type Generic number Circuit function 01 EL2001A Low power, 70 MHz buffer amplifier 02 EL2001 Low power, 70 MHz buffer amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows: Device class Device requirements

10、 documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1

11、835 and as follows: Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device c

12、lass M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply vo

13、ltage (VS) . 18 V dc or 36 V dc Input voltage (VIN) 15 V 2/ Input current (IIN) 50 mA 2/ Output short circuit duration 50 mA max 3/ Junction temperature (TJ) . 175C Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) 300C Thermal resistance, junction-to-case (JC) . See

14、 MIL-STD-1835 4/ Thermal resistance, junction-to-ambient (JA) : 4/ Case P . 125C/W Case 2 . 100C/W 1.4 Recommended operating conditions. Supply voltage (VS) . 15 V Series resistance (RS) 50 Load resistance (RL) . 100 Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.

15、1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPE

16、CIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Sta

17、ndard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of preceden

18、ce. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute ma

19、ximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ If the input exceeds the ratings shown (or the supplies) or if the input to the output voltage exceeds 7.5 V then input current must be limited to 50 mA.

20、 3/ A heat sink is required to keep the junction temperature below the absolute maximum when the output is short circuited. 4/ The maximum power dissipation depends on package type, ambient temperature and heat sinking. Provided by IHSNot for ResaleNo reproduction or networking permitted without lic

21、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL

22、-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535,

23、appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device c

24、lass M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the ele

25、ctrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical test

26、s for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the optio

27、n of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification

28、/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compli

29、ance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.

30、2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-P

31、RF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of cha

32、nge for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the ac

33、quiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing s

34、hall be in microcircuit group number 49 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5

35、 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA+125C Group A subgroups Device type Limits Unit VS= 15 V, RS= 50 unless otherwise specified Min Max Input offset voltage VIOVIN= 0 V, RL= Infinity 1 01 -10 +10 mV 2,3 -15 +15 1 02 -30 +30 2,3 -40 +4

36、0 Input current IINVIN= 0 V, RL= Infinity 1 01 -3 +3 A 2,3 -6 +61 02 -5 +52,3 -10 +10 Input resistance RINVIN= 12 V, RL= 100 1 01 1 M 2,3 0.5Voltage gain AV1VIN= 12 V, RL= infinity 1 01 .990 V/V 2,3 .985AV2VIN= 10 V, RL= 100 1 .83 2,3 .80 AV3VIN= 3 V, RL= 100 , 1 .82 VS= 5 V 2,3 .79 Output voltage s

37、wing VOVIN= 12 V, RL= 100 1 01 -10 +10 V 2,3 -9.5 +9.5 Output resistance ROUTVIN= 2 V, RL= 100 1 01 15 2,3 18 Output current +IOUTVIN= +12 V, VO= +10 V 1 01 +100 mA 2,3 +95 -IOUTVIN= -12 V, VO= -10 V 1 -100 2,3 -95 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networ

38、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions -55C TA+125C Group A s

39、ubgroups Device type Limits Unit VS= 15 V, RS= 50 unless otherwise specified Min Max Supply current ISVIN= 0 V, RL= infinity 1 01 2.0 mA 2,3 2.5Power supply rejection ratio PSRR VIN= 0 V, RL= infinity 1/ 1 01 60 dB 2,3 50Slew rate SR VIN= 10 V, 2/ 3/ 4 01 1200 V/s RL= 100 , AV= +1 5,6 800 -3 dB band

40、width 2/ 4 01 70 MHz 5,6 50Rise time tRVIN= 5 V, RL= 100 , 2/ TA= +25C 9 01 6.0 ns Propagation delay tDVIN= 5 V, RL= 100 , 2/ TA= +25C 9 01 4.0 ns 1/ VIOis measured at +VS= +4.5 V, -VS= - 4.5 V, and at +VS= +18 V, -VS= -18 V. Both supplies are changed simultaneously. 2/ If not tested, shall be guara

41、nteed to the limits specified in table I herein. 3/ Slew rate is measured between VOUT= +5 V and -5 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218

42、-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines P 2 Terminal number Terminal symbol 1 +VSNC 2 INPUT+VS3 NC NC4 -VSNC 5 NC NC6 NC NC 7 OUTPUT NC 8 NC NC9 - NC 10 - INPUT 11 - NC 12 - -VS13 - NC 14 - NC 15 - NC 16 - NC 17 - NC 18 - NC 19 - NC 20 - OUTPUT NC = No conne

43、ction FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-91534 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 4. VERIFICAT

44、ION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described

45、herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformanc

46、e inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, or C.

47、 The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the in

48、tent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level contro