DLA SMD-5962-90747 REV B-1995 MICROCIRCUIT DIGITAL BIPOLAR CMOS TTL COMPATIBLE OCTAL D-TYPE EDGE TRIGGERED FLIP-FLOP MONOLITHIC SILICON《硅单块 八进制D型边沿触发的触发器 晶体管-晶体管逻辑电路兼容 双极互补金属氧化物半导体.pdf

《DLA SMD-5962-90747 REV B-1995 MICROCIRCUIT DIGITAL BIPOLAR CMOS TTL COMPATIBLE OCTAL D-TYPE EDGE TRIGGERED FLIP-FLOP MONOLITHIC SILICON《硅单块 八进制D型边沿触发的触发器 晶体管-晶体管逻辑电路兼容 双极互补金属氧化物半导体.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90747 REV B-1995 MICROCIRCUIT DIGITAL BIPOLAR CMOS TTL COMPATIBLE OCTAL D-TYPE EDGE TRIGGERED FLIP-FLOP MONOLITHIC SILICON《硅单块 八进制D型边沿触发的触发器 晶体管-晶体管逻辑电路兼容 双极互补金属氧化物半导体.pdf（20页珍藏版）》请在麦多课文档分享上搜索。

1、999999b 00b7288 890 DEFENSE LOGISTICS AGENCY DEFENSE ELECTRONICS SUPPLY CENTER 1507 WILMINGTON PIKE DAYTON, OH 45444-5765 SEP O 5 ISS5 IN REPLY REFER TO: DESC-ELDS (Mr.Kerby/(DSN)986-6023/5 13-296-6023hjj) SUBJECT: Notice of Revision (NOR) 5962-R184-95 for Standard Microcircuit Drawing (SMD) 5962-90

2、747 Military/Industry Distribution The enclosed NOR is approved for use effective as of the date of the NOR. In accordance with MIL-STD-100 SMD holders should, as a minimum, handwrite those changes described in the NOR to sheet 1 of the subject SMD. After completion, the NOR should be attached to th

3、e subject SMD for future reference. Those companies who were listed as approved sources of supply prior to this action have agreed to actions taken on devices for which they had previously provided DESC a certificate of compliance. This is evidenced by an existing active current certificate of compl

4、iance on file at DESC with a DESC record of verbal coordination. The certificate of compliance for these devices is considered concurrence with the new revision unless DESC is otherwise notified. If you have comments or questions, please contact Joe Kerby at (DSN)986-6023/(5 13)296-6023. 1 Encl MONI

5、CA L. POELKING Microelectronics Branch Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-= 9999996 0067289 727 . a. CURRENT MICROCIRCUIT, DIGITAL, BIPOLAR CMOS, TTL COMPATIBLE, OCTAL D-TYPE EDGE TRIGGERED FLIP-FLOP, MONOLITHIC SILICON A Form Approved 1

6、. DATE OMB NO. 0704-0188 NOTICE OF REVISION (NOR) 95 -08- 18 This revision described below has been authorized for the document listed. 2. PROCURING ACTIVITY NO. N/A b. NEU B 3. DODAAC I a. (X one) b. ADDRESS (Street, City, State, Zip Code) 6. NOR NO. 5962-R184-95 7. CAGE CODE 8. DOCUMENT NO. 4. ORI

7、GINATOR Defense Electronics Supply Center 1507 Uilmington Pike Dayton, OH 45444-5765 a. TYPED NAME (First, Middle Initial, Last) 5962-90747 X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this chang

8、e. (3) Custodian of master docwent shall make above revision and furnish revised document. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT DESC-ELDC Sheet 1: Revisions ltr column; add iIBii. Revisions description colum; add “Changes in accordance with NOR 5962-R184-95I1. Revisions date colum

9、; add 1195-08-181i. Revision level block; change from llA1l to I1Ba1. Rev status of sheets; for sheets 1 and 3, change from l1Al1 to liBl1. c. TYPED NAME (First, Middle Initial, Last) Monica L. Poelking Sheet 3: 1.4 Revision level block; change from llA1l to 18Ba1. Recmended operating conditions. Mi

10、nimum pulse duration (tw), CLK low; change from “7.0 nsil to lI8.0 ns“. d. TITLE Chief, Custom Microelectronics 15a. ACTIVITY ACCOMPLISHING REVISION DESC-ELDC e. SIGNATURE f. DATE SIGNED ( YYMMDD ) Thomas M. Hess 95- 08- 18 c. DATE SIGNED b. REVISION COMPLETED (Signature) (YYMMDD) Joseph A. Kerby 95

11、 -08- 18 DD Form 1695, APR 92 Previous editions are obsolete Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-m 9999996 0067290 qq9 DATE (W) NOTICE OP REVISION (NOR) (See MIL-STO-480 for instructions) 92-09-08 This revision described below has been au

12、thorized for the document listed. Form Approved OMB NO. 0704-0188 1. ORIGINATOR “E AND AWRESS Defense Electronics Supply Center Dayton, Ohio 45444-5277 2. CAGECODE 3. Nat No. 67268 I 5962-R283-92 I 4. CAGECODE 67268 5. D0cU)nNTNo. 5962-90747 6. TITLE OF i“T Hirrociraiits, Digital. Bipolar WS, Mal D-

13、type edge triggered Flip-Flops, mnolithic silicon DESC-ECC I I 7. REVISION LElER 92-09-08 8. ECPWO. I no registered users 9. MWFI6RATIN ITM (OR SvSrm) TO WHICH ECP APPLIES 10. DESCRIPTION OF REVISION Sheet 1: Revisions ltr column: add “A“. Revisions description column; add “Changes in accordance wit

14、h Revisions date column: add “92-09-08“. Revision level block; add A“. Rev status of sheets: For sheets 3 and 7 add “A“. Sheet 3: 1.3 absolute maxim ratings, power dissipation, change “y“ to “g“. Sheet 3: 1.5 logic testing for device class Q and V, change “2J“ to “y“. Sheet 7: Output enable time, ch

15、ange test description from E or NOR 5962-R283-92“. to Y“ to “E to 11. MIS SECTION FOR GWERWKKT USE ONLY a. CHECK ONE XIEXISTING DOCUMENT SUPPLEMENTED REVISED DOCUMENT MUST BE CUSTODIAN OF MASTER DOCUMENT BY THIS NOR MAY BE USED IN RECEIVED BEFORE MANUFACTURER SHALL MAKE ABOVE REVISION AND MANUFACTUR

16、E. MAY INCORPORATE THIS CHANGE. FURNISH REVISED DOCUMENT TO: b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT 92-09-08 12. ACTIVITY ACCOHPLISHING RNISIM I REVISION COMPLETED (Signature) I DATE (YYMMDD) Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I

17、HS-,-,-999999b ClOb7291 385 DISTRIBUTION STATEMENT A. Approved lor public release; distribution is unlimiied. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- W b 0067292 211 D SIZE 5962-90747 A i 2 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS S

18、UPPLY CENTER REVISION LEVU SHEET DAYION, OHIO 45444 I I 1. SCOPE 1.1 SCO e. This drawing forms a part of a one part - one part number documentation system (see 6.6 herd Two product assurance classes consisting of military high reliability (device classes 6, Q, and M) ana space application (device cl

19、asses S and VI, and a choice of case outlines and lead finishes are available and are reflected in the complete Part or Identifying Number (PIN). Device class M microtircuits represent non-JAtd class B microcircuits in accordance with 1.2.1 of MIL-STDr883, Provisions for the use of MIL-STD-883 in co

20、njunction with compliant non-JAN devices“. Uhen available, a choice of radiation hardness assurance (RHAI levels are reflected in the PIN. 1.2 - PIN. 1 The PIN shall be as shown in the following example: - 5962 90747 o1 M R X I I I T 7- 7- l I I I I I I I I I I I Feoeral RHA IZE Devlce Ca se Leb sto

21、ck class designator type cl ass out1 ine finish designator (1.2.11 (1.2.2) designator (1.2.4) (1.2.5) / (1.2.3) / Drawi ng number 1.2.1 Radiation hardness assurance (RHAI designator. Device classes M, B, and S RHA marked I devices sbks and shall be marked with the amroDriate RHA designator. characte

22、ristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratin s herein and the RHA marked device shall be marked in accordance with MIL-1-38535. A dash (-3 indicates a non RHA device. Device classes Q and V devices shall meet or exceed

23、 the electrical performance 1.2.2 Device type. The device type shall identify the circuit function as follows: Device type Generic number Circuit function o1 54BCT534 Octal D-type edge-triggered flip-flops, with inverted three-state outputs, TTL compatible 1.2.3 Device class designator. The device c

24、lass designator shall be a single letter identifying Device class Device requirements documentation the product assurance level as Tollows: M Vendor self certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S j or Y Ce rt i f ica ti on and

25、qual i fi cati on to MIL-M-38510 Certification and qualification to MIL-1-38535 1.2.4 Case outlines. For device classes M, B. and S. case outlines shall meet the requirements For device classes Q and V, case outlines shall in appendix C of MIL-M-38510 and as listed below. meet the requirements of MI

26、L-1-36535, appendix C of MIL-M-38510, and as listed below. Out1 i ne 1 etter Case outline R S 2 0-8 ( e.g., 10s. The PD number is based upon dc values. I 3/ Values will be added when they become available. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-

27、,-,-2.1 Government specifications, standards, bulletin, and handbook. Unless otherwise specified, the followlng speciffcatrons, standards, bUlIetln, and tmdb0Ok of the issue listed in that issue of I the Department of Defense Index of Specifications and Standards specified in the solicitation, form

28、a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MI L - M- 385 10 - Microcircuits, General Specification for. MIL-I -38535 - Integrated Circuf ts, Manufacturing, General Specification for. STANDARDS MIL I TARY MIL-STD-480 - Configuration Control-Engineering Changes, Dev

29、iations and Waivers. MI L-STD-883 - Test Methods and Procedures for Microelectronics. BULLETIN MIL I TARY MI L-BUL- 103 - List of Standardized Military Drawings (SMDs). HANDBOOK STANDARDIZED MILITARY DRAWING DEFENSE ElEClRNIcS SUPPLY CENTER DAYTON, OHK) 45444 MILITARY MI L-HDBK-780 - Military Drawin

30、gs. (Copies of the specifications, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity. ) references cited herein, the text of this drawing shall take

31、 precedence. 2.2 Order of precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device class M shall be in In the event of a conflict between the text of this drawing and the accordance with 1.2.1 of MIL-STD-883, Provisions for the.use of MIL-STD-883 in conjunction

32、with compliant non-JAN devices“ and as specified herein. The individual item requirements for device classes B and S shall be in accordance with MIL-M-38510 and as specified herein. B and S, a full electrical characterization table for each device type shall be included in this SMD. The individual i

33、tem requirements for device classes Q and Y shall be in accordance with MIL-1-38535 and as specified herein. For device classes SIZE A 5962-90747 REWSN LEVEL SHEET 4 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions snail be as specified in MIL-M-38

34、510 f or device classes M, B, and S and MIL-1-38535 for device classes Q and V and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDIZED SIZE MILITARY DRA

35、WING A W 9999996 00b7295 T20 W 5962-9074 7 3.2.2 Terminal connections. 3.2.3 Truth table. 3.2.4 Logic diagram. 3.3 Electrical performance characteristics and postirradiation parameter 1 imits. Unless The terminal connections shall be as specified on figure 1. The truth table shall be as specified on

36、 figure 2. The logic diagram shall be as specified on figure 3. otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. specified in table IIA. The electric

37、al tests for each subgroup are defined in table I. class M shall be in accordance with MIL-STD-883 (see 3.1 herein). PIN may also be marked as listed in MIL-BUL-103. accordance with MIL-M-38510. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups 3.5 Marking. Th

38、e part shall be marked with the PIN listed in 1.2 herein. Marking for device Marking for device classes B and S shall be in In addition, the manufacturers Marking for device classes Q and Y shall be in accordance with MI L-I -38535, 3.5.1 Certification/compliance mark. The compliance mark for device

39、 class M shall be a “C“ as required in - - see . ere n). The certification mark for device classes B and S shall be a “J“ ANSTk%qkiredj;n kL-#-38510. The certification mark for device classes Q and Y shall be a “QML“ as required in MIL-1-38535. required, from a manufacturer in order to be listed as

40、an approved source of sup ly in MIL-BUL-103 (see 6.7.3 herein). For device classes Q and V, a certificate of compliance shai;l be required from a Q#-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.3 herein). The certificate of compliance submitted to DESC-EC

41、S prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M the requirements of MIL-STO-883 (see 3.1 herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. MIL-STD-883 (see 3.1

42、 herein) or device classes B and S in MIL-M-38510 or for device classes Q and Y in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-48

43、0. For device class M, DESC, DESCs agent and the acquiring activity recain me o Pt on to review tne manufacturers facility and applicable required documentation. 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be 3.7 Certificate of conformance. A certificate of c

44、onformance as required for device class M in 3.8 Notification of change for device class M. For device class M, notification to DESC-ECS of 3.9 Verification and review for device class M. Offshore documentation shall be made available onshore at the option of the reviewer, 3.10 Microcircuit group as

45、signment for device classes M, B, and S. Device classes M, B, and S devices covered by this drawing shall be in microcircuit group number 127 (see MIL-M-38510, appendix E). 3.11 Serialization for device class S. All device class S devices shall be serialized in accordance with MIL - M 38510. 4. QUAL

46、ITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in For device classes Q and V, accordance with section 4 of MIL-M-38510 to the extent specified in MIL-STO-883 (see 3.1 herein). For device classes B and S, sampling and inspection p

47、rocedures shall be in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein. sampling and inspection procedures shall be in accordance with MIL-1-38535. * U S. GOVERNMENT PRINTINQ OFFICE 1888-518-0M SEP a7 Provided by IHSNot for ResaleNo reproduction or networking per

48、mitted without license from IHS-,-,-9999996 0067276 767 SIZE A STANDARDIZED . 5962-90747 TABLE I. Electrical performance characterfstics. Conditions I Group A I Limits I Unit I -55OC CI 5D ID I i FIGURE 3. Logic diagram. I U S GOVtRNMFNl PI3INTING OFFILE 1989- i19 D33 Provided by IHSNot for ResaleNo

49、 reproduction or networking permitted without license from IHS-,-,-. SIZE A STANDARDIZED 7v 5962-90747 FROM UNDER OUTPUT TEST -n2TEST POINT CL = 50 pF, includes probe and jig capacitance. RL = R1 = R2 = 500n Switch position table I DESC FORM 193A SEP 87 4 U S. GOVERNMENT PRINTING OFFICE 198-548-904 Provided by IHSNot for ResaleNo reproduction or networking permitted without lice