DLA SMD-5962-90656-1991 MICROCIRCUITS DIGITAL CHMOS 80-BIT NUMERIC PROCESSOR MONOLITHIC SILICON《硅单片 80位数值信息处理器 数字微型电路》.pdf

《DLA SMD-5962-90656-1991 MICROCIRCUITS DIGITAL CHMOS 80-BIT NUMERIC PROCESSOR MONOLITHIC SILICON《硅单片 80位数值信息处理器 数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90656-1991 MICROCIRCUITS DIGITAL CHMOS 80-BIT NUMERIC PROCESSOR MONOLITHIC SILICON《硅单片 80位数值信息处理器 数字微型电路》.pdf（21页珍藏版）》请在麦多课文档分享上搜索。

1、SMD-5962-90656 59 m 9999996 0007110 6 LTR I REVISIONS DESCRIPTION DA+ (YR.M-M) APPROVED STANDARDIZED THIS DRAWING IS AVAILABLE IR USE BY ALL DEPAThENiC AND AGENCIES OF THE DEPAFiTMENT OF DEFENSE I I SHEET 1 OF 20 AMSC NIA DESC FORM 193 SEP a7 *US. COVtRNMINl WHTIYG OtllCI: 1987- 74-1191W11 I DISTRIR

2、UTION STATEMENT A. Approved lor public release; dislrlbullon Ir unlimiled. i 5962-EWI Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-70656 59 9999996 0007LlL - - - -. -. . ._ P - I 1. SCOPE 1.1 acope. This drawing forms a part of a one part

3、 - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, 9, and 11) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or

4、 Identifying Number (PIN). accordance with 1.2.1 of NIL-STD-883, “Provisions for the use of HIL-STD-883 in conjunction with compliant non-JAN devices“. Device class 11 microcircuits represent non-JAN class B microcircuits in Mhen available, a choice of radiation hardness assurance (RHA) levels are r

5、eflected in the PIN. 1.2 m. The PIN shall be as shorm in the follotring example: - 90656 o1 X Q M - - - 5962 - I I I I I I I I I I I I RHA Federal Lead Case Devi ce 1 Devi ce stock class designator type class outline finish designator (See 1.2.1) (See 1.2.2) designator (See 1.2.4) (See 1.2.5) f (See

6、 1.2.3) f DrakJing number 1.2.1 Radiation hardness assurance (RHA) designator. Device classes M, 6, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked vith the appropriate RHA designator. V RHA marked devices shall meet the MIL-1-38535 specified RHA levels a

7、nd shall be marked with the appropriate RHA designator. A dash (-1 indicates a non-RHA device. Device classes Q and 1.2.2 Device typeW. The device type(s) shall identify the circuit function as follows: fu Device type Generic number Circuit function o1 8OC287-10 80-bit numeric processor 10 MHz 1.2.3

8、 Device class designator. The device class designator shall be a single letter identifying the product assurance level as follows: Device class Device requirements documentation t.1 Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-88

9、3 B or S Q or V Certification and qualification to MIL-M-38510 Certification and qualification to t-1IL-1-38535 1.2.4 Case outline(s). For device classes f.1, E, and S, case outline(s) shall meet the requirements in appendix C of MIL-1-38510 and as listed be1oi.i. MIL-1-38535, appendix C of MIL-1.1-

10、38518, and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of Outline letter Q Case outline D-5 (4-lead, 2.096“ x .620“ x .225“), dual-in-line package 1.2.5 bead finish. The lead finish shall be as specified in MIL-M-38510 for classes bl, E, and S or MIL-1-38

11、535 for classes Q and V. designation is for use in specifications when lead finishes Ar B, and C are considered acceptable and interchangeable without preference. Finish letter “X“ shall not be marked on the microcircuit or its packaging. The “X“ Provided by IHSNot for ResaleNo reproduction or netwo

12、rking permitted without license from IHS-,-,-SMD-5962-90b56 59 m 9799796 0007112 T = 1.3 Absolute maximum ratinas. I/ Storage temperature range - - - - - - - - - - - - - - - - Power dissipation (p )- - - - - - - - - - - - - - - - - - Lead temperature (sovdering, 10 seconds) - - - - - - - - Thermal r

13、esistance, junction-to-case (CIJc): - - - - - - - Junction temperature (TJ) - - - - - - - - - - - - - - - - -65OC to +15OoC 1.5 W +275OC See MIL-M-38510, appendix C +15OoC Voltage on any pin with respect to ground - - - - - - - - -0.5 V to Vcc +0.5 V 1.4 Recommended operating conditions. Case operat

14、ing temperature range (TC) - - - - - - - - - - Supply voltage (Vcc) - - - - - - - - - - - - - - - - - - -55OC to +12SoC 4.75 VI Vcc 55.25 V 1.5 Diaital lwic testinq for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - XX perc

15、ent 21 2. APPLICABLE DOCUMENTS 2.1 Government specifications. standards, bulletin, and handbook. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified

16、in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATIONS MILITARY MIL-M-38510 - MIL-1-38535 - STANDARDS MILITARY MIL-CTD-480 - MI L-CTD-883 - BULLETIN MILITARY MIL-BUL-103 - HANDBOOK MILITARY MIL-HDBK-780 - Microcircuits, General Specification for. Integrated C

17、ircuits, Manufacturing, General Specification for. Configuration Control-Engineering Changes, Deviations and Waivers. Test Methods and Procedures for Microelectronics. List of Standardized Military Drawings WIDS). Standardized Military Drawings. (Copies of the specifications, standards, bulletin, an

18、d handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) In the event of a conflict between the text of this drawing and the references cited 2.2 Order of precedence. herein, t

19、he text of this drawing shall take precedence. - I/ Stresses above the absolute maximum rating may cause permanent damage to the device. operation at the maximum levels may degrade performance and affect reliability. - 2/ Values wi 11 be added when they become avai labte. Extended STANDARDIZED MILIT

20、ARY DRAWING I SIZE I I 5962-90656 DEFESE ELECTROICS SUPPLY CENTER DATOH, OEiO 45444 A REVISION LEVEL SHEET I I 3 ESC FORM 193A JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-_-._- SUD-5962-90656 59 9999996 0007113 L 3. REQUIREMENTS 3.1 The in

21、dividual item requirements for device class M shall be in accordance with 1.2.1 of MIL.-STi-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as Specified herein. The individual item requirements for device classes E and S shall be in accordance with MIL-

22、M-38510 and as specified herein. be included in this SMD. M1L-1-38535, the device manufacturers Quality Management (QM) plan, and as specified herein. Item requirements. For device classes B and S, a full electrical characterization table for each device type shall The individual item requirements f

23、or device classes Q and V shall be in accordance with 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-38510 for device classes Il, E, and S and MIL-1-38535 for device classes Q and V and herein. 3.2.1 Case outLineCs)

24、. The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. 3.2.4 Functional block diagram. 3.2.L Radiation exposure circuit. 3.3 Electrical performance characteristics and postirradiation parameter limits. herein, the electrical performance characteristics and postir

25、radiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. The terminal connections shall be as specified on figure 1. The functional block diagram shall be as specified on figure 2. The radiation exposure circuit shall be specified when av

26、ailable. Unless otherwise specified 3.4 Electrical teat requirements. The electrical test requirements shall be the subgroups specified in table XIA. The electrical tests for each subgroup are defined in table I. 3.5 krking. The part shall be marked with the PIN listed in 1.2 herein. Marking for dev

27、ice class f4 shall be in accordance iJith MIL-STD-883 (see 3.1 herein). NSL-BUL-103. classes C and V shall be in accordance rith MIL-1-38535. In addition, the manufacturers PIN may also be marked as listed in Harking for device classes B and S shall be in accordance with MIL-M-38510. Marking for dev

28、ice 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C“ as required in M1L-WD-883 (see 3.1 herein). in MIL-1.1-38510. The certification mark for device classes B and S shall be a “J“ or “JAN“ as required The certification mark for device classes B and V shall b

29、e a “QML“ as required in MIL-1-38535. 3.6 Certificate of compliance. For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein). classes Q and V, a certificate of compliance shall be re

30、quired from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class 1.1 the requirements of MIL-STD-883 (see 3.1 he

31、rein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. For device The certificate of compliance submitted to DESC-ECC 3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-STD-883 (see 3.1 herein) or device clas

32、ses and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided dith each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DESC-ECC of change of product (see 6.2 herein) involving devices acquir

33、ed to this drawing is required for any change as defined in MIL-STD-480. For device class M, DESC, DESCs agent, and the acquiring 3.9 lerification and review for device class M. sctivity retain the option to review the manufacturers facility and applicable required documentation. documentation shall

34、 be made available onshore at the option of the reviewer. Offshore 3.10 Microcircuit group assignment for device classes M, B, and S. Device classes M, E, and S devices covered by this drawing shall be in microcircuit group number 105 (see MIL-M-38510, appendix E). 3.11 Serialization for device clas

35、s S. All device class S devices shall be serialized in accordance with iIL-M-38510. SIZE A 5962-90656 REVISION LEVEL I SHEET Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-90b5b 59 m 9b 0007114 3 W I TABLE 1. Electrical performance characte

36、ristics. STANDARDIZED MILITARY DRAWING L unit I Limits I I I I I Test ISymbol I Conditions I/ IGroup A !Device I I -55C C TC 5 +125OC- Isubgroups I type I I I I 1 1 I I I I I I 4.75 V 5 Vcc 5 5.25 V I I I Min I Max I unless otherwise specified 1 O1 I -0.5 I 0.8 I V SIZE 5962-90656 A i 1,2,3 i I I I

37、VIL I I Input low voltage I I I I I I CLK input tow voltage I vIcL I I I I I CLK input high voltage I VICH I I I I I I IH Input high voltage Output low voltage = 3.0 mA, I = 0.8 v, 2.0 v Output high voltage I VOH I IOH = -800 PA !VIN = 0.8 v, 2.0 v ! Input capacitance i CIN if, = 1 MHz I ISee 4.4.ld

38、 I I 1/0 or output I Co I capacitance (DO-DIS) I I I l I i4 I CLK capacitance I cCLK i i I I ISee 4.4.lb I Functional tests I - I I I 1 I I I I CLK period CKM = 1 At 1.5 V, see figure 3 I i tla I i 9,10,11 i I I CLK period CKM = o I I I I I tlb i 2/ I i I I I I 2.2 I 5.75 I I I 21 I I I I I I 2.2 I

39、5.75 I I I 21 I I I I I I I I IiI I I I I 2.4 I I I I I IA I I I I -10 I +IO I #UA III I I I I -10 I +IO I I I I IA I I I I I I I IA I I III I I I I I IiI I I I I I 12 I l. I I I I I I u I I I I I I III I I I I -0.5 I 0.8 I I 2/ I I I 0.45 I I 115 I in4 I I 10 I PF I I 20 I I 100 I 250 I ns I 50 I 1

40、25 I I I I I I I I See footnotes at end of table. I DEFENSE ELECTRONICS SUPPLY CE“ER DAYTON, OHIO 45444 REVISION LEVEL I SHEET 5 JUL 91 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SflD-5962-90656 57 I 9799996 0007LL5 5 M TABLE I. Electrical perfo

41、rmance characteristics - Continued. I l Test I Symbol i t2a CLK low time CKM = 1 I I t2b CLK low time CKEi = o I CLK high time i t3a CKM = 1 I A I 1 t3b CLK high time - CKM = O I I CLK fall time i t4 I 2f - I I CLK rise time i t5 21 I Dcta setup to NPWR i t6 inact ive I Data hold from NPUR 1 t, inac

42、t ive I I NPRD or NPWR active timel t8 I tg I I 1 tll 1 t10 Command valid to NPWR or NPRD active l i t12 Yinimum delay from PEREQ active to I NPRD active 21 I I i t18 command hold from NPWR inactjve I See footnotes at end of table. Conditions I/ -55C C TC 5 t125OC- 4.75 V 5 Vcc 5 5.25 V unless other

43、wise specified At 1.5 V, see figure 3 At 0.8 V, see figure 3 At 1.5 V, see figure 3 At 2.0 V, see figure 3 3.5 V to 1.0 V if CKM = 1 at 10MHz see figure 3 1.0 V to 3.5 V if CKM = 1 at 10 MHz see figure 3 See figure 3 4t 0.8 V, see figure 3 See figure 3 ;roup A subgroups 9, IO, 11 STANDARDIZED MILITA

44、RY DRAWING DEFENSE EtECTROBICS SUPPLY CEmR ,SS FORM 193A JUL 91 levi ce type o1 L Unit I l I Limits l i i I I I l I 91.5 I I I I II l I 0.0 I I I I a I I 50 I I I I l I I 1 II I I 20 I I I I 5962-90656 REVISION LEVEL SHEET Provided by IHSNot for ResaleNo reproduction or networking permitted without

45、license from IHS-,-,-SMD-5962-90656 59 9999996 00071Lb 7 STANDARDIZED MILITARY DRAWING DEFENSE ELECTROIPCS SUPPLY CENTER DAYTON, OHIO 45444 TABLE 1. Electrical performance characteristics - Continued. L Unit I Isubgroups I type I I I I I I I I I I I I I I I Limits I I I I I Conditions I/ (Group A ID

46、evice I Test ISYmbol I I -55OC 5 TC I t125“C- I 4.75 V 5 Vcc 5 5.25 V I I I Min I Max I I unless otherwise specified 1 SIZE 5962-90656 A REVISION LEVEL SHEET 7 Command hold from I tI9 I See figure 3 NPRD inactive I I I I I I t20 I setup time 3/ I I NPWR, NPRD to clk I I I I NPWR, NPRD from i t21 i c

47、lk hold time 3/ I I I I I I I I 24 I RESET to CLK setup time 3/ I I I I II I I hold time 31 I I I I write to write I I read to read I I write to read I I read to write I I I I data float 2/ A/ I I I t25 I RESET from CLK Command inactive time I t26 IAt 2.0 V, see figure 3 NPRD inactive to I t27 Isee

48、figure 3 I I I valid I I see figure 3 I NPRD active to data I t2* IDO-Dl5 loading = CL = 100 pF, I I I i I I I ERROR active to BUSY i t29 BUSY loading = Ct = 100 pF, i inactive I I see figure 3 I I I I I I I NPUR active to BUSY i t30 iUSY loading = CL = IM) pF, i active I I see figure 3 I I I i I I

49、I NPRD or NPUR active i t31 ion last data transfer of numerici to PEREQ inactive I 1 instruction, see figure 3 I I I I 9,10,11 i I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I o1 i 20 i i ns I i i ILI I I I I I I I III I I I I 22 I I I I I IiI. I I I I 20 I I I I I ILI I I I l I I I I I I I I I I *I I I I I I 25 I I I I IiI I I I I 60 I I I li1 I 1-1 I ILI I I I I I 100 I I I I I I lm I I 54