DLA SMD-5962-90654 REV B-2012 MICROCIRCUIT DIGITAL HIGH SPEED CMOS ANALOG MULTIPLEXER DEMULTIPLEXER TTL COMPATIBLE INPUTS MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. LTG 06-03-16 Thomas M. Hess B Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 12-04-19 Thomas M. Hess REV SHEET REV SHEET REV STATUS RE

2、V B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Marcia B. Kelleher DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE D

3、EPARTMENT OF DEFENSE AMSC N/A CHECKED BY Monica L. Poelking APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, ANALOG MULTIPLEXER/DEMULTIPLEXER, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON DRAWING APPROVAL DATE 91-12-30 REVISION LEVEL B SIZE A CAGE CODE 67268 5962-90654 SHEET 1 OF 13

4、DSCC FORM 2233 APR 97 5962-E256-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90654 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This

5、 drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radia

6、tion Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 90654 01 M E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see

7、 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the a

8、ppropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54HCT4051 Analog multiplexer/demultiplexer, TTL compatible inputs 1.2.3 Device class designator. The dev

9、ice class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or

10、V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 1.2.5 Lead finish. The lead finish is as specified in

11、 MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90654 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL

12、B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC- VEE) . -0.5 V dc to +10.5 V dc Supply voltage range (VCC) -0.5 V dc to +7.0 V dc Supply voltage range (VEE) +0.5 V dc to -7.0 V dc DC control input voltage range -0.5 V dc to VCC+ 0.5 V dc DC switch input vol

13、tage range . VEE- 0.5 V dc to VCC+ 0.5 V dc DC VEEcurrent . -20 mA DC control input clamp diode current . 20 mA DC switch “ON” I/O current (per pin) 2/ . 25 mA DC switch I/O diode current (per pin) 2/ 20 mA DC VCCor GND current (per pin) . 50 mA Storage temperature range (TSTG) . -65C to +150C Maxim

14、um power dissipation (PD) 3/ . 500 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Supply voltage range (VEE) -5.5 V

15、dc to 0.0 V dc Supply voltage range (VCC- VEE) . 2.2 V dc to +10.0 V dc Input voltage range, digital inputs (VIN) 0.0 V dc to VCCAnalog switch I/O voltage, analog inputs (VIS) . VEEto VCCCase operating temperature range (TC) . -55C to +125C Control input rise or fall time (tr, tf): VCC= 4.5 V, 5.5 V

16、 0 to 500 ns 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ In certain applications, the external load-resistor current may include both VCCand signal-line components.

17、 To avoid drawing VCCcurrent when switch current flows into the transmission gate inputs, the voltage drop across the bidirectional switch must not exceed 0.6 V (calculated from RON). No VCCcurrent will flow through RLif the switch current flows into terminal 3. (COMMON OUT/IN A terminal). 3/ For TC

18、= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90654 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE

19、 DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT O

20、F DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103

21、- List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-

22、Government publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents cited in the solicitation or contract. JEDEC SOLID STATE TECHNOLOGY ASSOCIATION (JEDEC) JEDEC Standard No. 7 - Standard for Descri

23、ption of 54/74HCXXXXX and 54/74HCTXXXXX Advanced High-Speed CMOS Devices. (Copies of these documents are available online at http:/www.jedec.org or from JEDEC Solid State Technology Association, 3103 North 10thStreet, Suite 240-S Arlington, VA 22201). 2.3 Order of precedence. In the event of a confl

24、ict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item req

25、uirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional

26、 certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements her

27、ein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and

28、 physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on fi

29、gure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Functional diagram. The functional diagram shall be as specified on figure 3. 3.2.5 “On” resistance versus input signal voltage curve. The “On” resistance versus input signal voltage curve shall be as specified on fi

30、gure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90654 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 3.2.6 Switching waveforms and test circuit. The swi

31、tching waveforms and test circuit shall be as specified on figure 5. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and sha

32、ll apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 he

33、rein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still b

34、e marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-

35、PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this draw

36、ing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved

37、source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance

38、as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of chang

39、e of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritimes agent, and the acquiring activity retain the option to revi

40、ew the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 39 (s

41、ee MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90654 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performa

42、nce characteristics. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max High level input voltage VIHVCC= 4.5 V 2/ 1, 2, 3 All 2.0 V Low level input voltage VILVCC= 4.5 V 2/ 1, 2, 3 All 0.8 V Quiescent supply current ICCVIN= VCCor

43、 GND VIS= VCCand VOS= VEEand repeat for VIN= VCCor GND VIS= VEEand VOS= VCCVCC= 5.5 V VEE= 0.0 V 1, 2, 3 All 160 A VCC= 5.5 V VEE= -4.5 V 320 Control input leakage current IINVCC= 5.5 V, VIN= VCCor GND 1, 2, 3 All 1.0 A Additional quiescent supply current, TTL inputs ICCAny one control inputs VIN= 2

44、.4 V or 0.5 V Other control inputs VIN= VCCor GND VCC= 5.5 V 1, 2, 3 All 3.0 mA Switch on/off leakage current, 8 channels IIZVIN= VIH= 2.0 V or VIL= 0.8 V For switch off: VIS= VCCand VOS= VEE, repeat for VIS= VEEand VOS= VCCFor switch on: VIS= VCCand VOS= VEE, repeat for VIS= VEEand VOS= VCC; limits

45、 valid for all applicable combinations of both VISand VOSvarying from VEEto VCCVCC= 5.5 V VEE= 0.0 V 1, 2, 3 All 2.0 A VCC= 5.0 V VEE= -5.0 V 4.0 Input capacitance CINVIN= 0 V, see 4.4.1c 4 All 10 pF Power dissipation capacitance 3/ CPDSee 4.4.1c 4 All 65 pF Common capacitance CCOMf = 1 MHz, power o

46、ff COMMON OUT/IN A to GND VEEor VCC, see 4.4.1c 4 All 38 pF Functional tests See 4.4.1b 7, 8 All See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-90654 DLA LAND AND MARITIME COLU

47、MBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max “ON” resistance (square wave input) RONVIS= VEEor

48、VCCVIN= VIH= 2.0 V or VIL= 0.8 V IOS= 1.0 mA See figure 4 4/ VCC= 4.5 V VEE= 0.0 V 1 All 160 2, 3 240 VCC= 4.5 V VEE= -4.5 V 1 120 2, 3 180 Peak “ON” resistance (all input waveform types) RON(peak) VIS= VEEto VCCStepped in 200 mV increments VIN= VIH= 2.0 V or VIL= 0.8 V IOS= 1.0 mA See figure 4 VCC= 4.5 V VEE= 0.0 V 1 All 180 2, 3 270 VCC= 4.5 V VEE= -4.5 V 1 130 2, 3 195 Propagation delay time, switch in to out tPHL, tPLHVCC= 4.5 V CL= 50 pF See figure 5 VEE= 0.0 V 4/ 9 All 12 ns 10, 11 18 VEE= -4.5 V 4/ 9 8 10, 11 12 Propagation delay time, switch turn “Off” dela