DLA SMD-5962-90597-1991 MICROCIRCUITS DIGITAL HIGH SPEED CMOS DECADE COUNTER DEVIDER WITH 10 DECODED OUTPUTS MONOLITHIC SILICON《硅单片 装有10解码输出的十进计数器 驱动器 高速氧化物半导体数字微型电路》.pdf

《DLA SMD-5962-90597-1991 MICROCIRCUITS DIGITAL HIGH SPEED CMOS DECADE COUNTER DEVIDER WITH 10 DECODED OUTPUTS MONOLITHIC SILICON《硅单片 装有10解码输出的十进计数器 驱动器 高速氧化物半导体数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-90597-1991 MICROCIRCUITS DIGITAL HIGH SPEED CMOS DECADE COUNTER DEVIDER WITH 10 DECODED OUTPUTS MONOLITHIC SILICON《硅单片 装有10解码输出的十进计数器 驱动器 高速氧化物半导体数字微型电路》.pdf（17页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONS LTR DESCRIPTION DATE (YR-M-DA) APPROVED SHEET HEET . IF IEVSTATUS SHEETS F SHEET MICNIA jTANDARDIZED M I LITA RY DRAWING HIS DRAWING IS AVAILABLE 3 USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA DESC FORM 193 SEP 87 DEFENSE ELECTRONICS SUPPLY CENTER CMCQD BY DAYT

2、ON, OHIO 45444 REVISION LEVEL I I SHEET 1 OF 16 b U.$. WVfRNMfNT PRIMING OFtlCt: 1987 - 748.119/6091 DISTRIBUTION STATEMENT A. Approved for public release; disirlbutfon Is unliniiled. 5962-El69 Licensed by Information Handling ServicesI SMD-5962-90577 59 m 999999b O003870 T m - _ I. SCOPE 1.1 SCO e.

3、 This drawing foms a part of a one part - one part number documentatSon system (see 5.6 herd Two product assurance classes consisting of mflitary high retiabiity (device classes 3, Q, and Mt and space applTciltion device classes S and Y), and a choice of case outlines and lead Pfnishes are available

4、 and are reflected in the Part or Identifying Number (PIN), Device class M nierocircuits represent nom-JAN class 6 microcircuits in accordance with 1.2.1 of MIt-STD-883, Provisions for he use of MIL-STD-883 in conjunction with compliant non-JAN devices“. When svailabTe, a choice of radiation hardnes

5、s assurance (RHAI levels are reflected in the PIN. 1.2 - PIN. The PIN shall be as shown in the following example: - X I I -r 1 5962 90597 O1 M -7- 7- 1 I i f I tead t Cace 1 DevSce I I edera stock class designator type cl ass outline finish designator (See 1.2.1) (See 1.2.2) designator (See 1.2.4) (

6、See 1.2.5) (See 1.2.3) T i -RAK Davlce 3 Drawing number 1.2.1 Radiation hardness assurance (RHAJ designator. Device classes M, B, and S RHA marked levices shall meet the MIL-M-38510 Specified RHA 1 evels and shall be marked with the appropriate RHA 3esi nator. Device classes Q and Y RHA marked devic

7、es shall meet the MIL-1-38535 specified RHA ievefs and shall be marked with the appropriate RHA designator. A dash (-1 indicates a non-RHA jevice. 1.2.2 Device type(s1. The device type(s1 shall tdentify the circuit function as follows: Device type Generic number Circuit function o1 54HCT4017 Decade

8、counter/divider, with 10 decoded outputs, TTL compatible inputs 1.2.3 Device class designator. The device class designator shall be a single letter identifying :he product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for n

9、on-JAN class E microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Q or Y Certification and qualification to MIL-M-38510 Certlfication and qualification to MIL-1-38535 1.2.4 Case outline(s). For device classes M, B, and S, case outline(s1 shalT meet the equirements in appendix C of MIL-M-38

10、510 and as listed below, For device classes Q and V, case utline(s) shall meet the requirements of MIL-1-38535, appendix C of MIL-k-38510, and as listed ,el ow. Ou tl i ne 1 etter E Case outline D-2 (16-lead, .84“ x .310“ x .200“), dual-in-line package SIZE A 5962-90597 STANDARDIZED MILITARY BRAWING

11、 FENSE ELKIInoNIcc SUPPLYCENTER SHEET DAmpI, OH#) 45444 2 3SC FORM 193A t U. S. GOVbRNMBNT PRINTINQ OFFICE 1890-949-249 jEP 87 Licensed by Information Handling Services! 1.2.5 Lead finish. The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S )r MIL-1-38535 f or classes Q and

12、V. Finish letter “X“ shall not be marked on the microcircuit or Its packaging. The “XI designation is for use in specifications when lead finjshes A, B, and C are :onsidered acceptable and interchangeable without preference. 1.3 Absolute maximum ratings. i/ Supply voltage range (VCC) - - - - - - - -

13、 - - - - DC input voltage - - - - - - - - - - - - - - - DC output voltage - - - - - - - - - - - - - - - - Clamp diode current - - - - - - - - - - - - - - - - DC output current (per pin1 - - - - - - - - - - - - DC Vcc or GND current (per pin) - - - - - - - - - - Storage temperature range - - - - - -

14、- - - - - - - Maximum power dissipation (Pg) - - - - - - - - - - Lead temperature (soldering, 10 seconds) - - - - - Thermal resistance, junction-to-case (OJJC) - - - - Junction temperature (TJ) - - - - - 4 - - - - - - - 1.4 Recommended operating conditions. Supply voltage (Vc 1 - - - - - - - - - - -

15、 - - - input voltage (VIN! - - - - - - - - - - - - - - - Output voltage (VOUT) - - - - - - - - - - - - - - - Case operating temperature (TC) - - - - - - - - - - 1.5 Digital logic testing for device classes Q and V. Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 501

16、2) - - - -0.5 V dC to t7.0 V dC -0.5 V dC to VCC + 0.5 V dc -0.5 V dc to Vcc t 0.5 V dc *20 mA A25 mA *50 mA -65C to +150C 500 mW 2/ +30O“C See MIL-M-38510, appendix C +175“C t4.5 V dc to +5.5 V dc 0.0 V dc to Vcc 0.0 V dc to Vsc -55C to +125 C O to 500 ns 15 ns 22 ns 16 ns 24 ns 16 ns 24 ns 20 ns 3

17、0 ns o ns O ns 5 ns 5 ns 25 MHz 17 MHz XX percent 31 i/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. V For TC = +lOO“C to +125“C, derate linearly at 12 mW/“C. !/ Values wi

18、ll be added when they become available. U, Si 60VLRNMCNT PRINTINO OPFICE lSBO-1149-14S ISC FORM 193A jEP 87 Licensed by Information Handling Servicest I SIXE MILITARY DRAWING A 5962-90597 STANDARDIZED . DEFENSE ELECTRONICS SUPPLY CEMER nMSH)N LEVU MEET $WTQM;OHIO 4W 4 b SMD-5962-70597 59 = 999999b 0

19、003872 3 = 2. APPLICABLE DOCUMENTS 2-1 .Government specifications, standards, bu1 letin, and handbook-. Unless otherwise spec the faflowing specifications, standaras, bulletin, and handbook of the issue listed in that Sscue of the Department of Refense Index of Specifications and Standards specified

20、 in the solici$ation, form a part of this drawing to the extent specified herein. SPCIFICATIONS MILITARY MI L-M- 38510 - Microcircuits, General Specification for. UIL-1-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS .MILITARY AMIL-STD-480 - ConfI uration Control-Eng

21、ineerin Chan es, Deviations and .Waivers. MIL-STD-883 - Test jethods and Procedures for t%croe?ectronics. BULLETIN MILITARY MIL-BSJL-103 - List of Standar4lzed Military Drawlngs (SMDs). HANDBOOK MILITARY MI L-HDBK-780 - Standardized Military Drawings. (Copies of the specifications, standards, bullet

22、in, and handbook required by manufacturers in connection with speciflc acquisltion functions should be obtafned from the contracting acttvity or as directed by the contracting activity. 1 r.eferences cited herein; t3e text of this drawing shall take precedence. 2.2 Order of precedence. Tn the event

23、of a conflict between the text of this drewtng and the 3. REQUIREMENTS 3.1 Item re uirements. The indivdual item requirements for devlce classM shall be in accordance wit; 1.2.1 .of MIL-STD-883, “Provlslons for the use of MIL-STD-883 in conjunction with compliant non-JAN devfces“ and as specifjed he

24、rein. The individual item requirements for device :lasses B and S shall be in accordance with MIL-M-38510 and as specified herefn, For device classes 3 and S, a full electrical characterization table for each device type shall be included in this SMD. The indivldual item re uirements for device clas

25、ses and V shall be in accordance wjth VIL-1-38535, the device manu8acturers Quality Management 9 I) plan, and as specified herein. 3.2 Design, construction, and physical dimenstons. The design, construction, and physical dimensions shall be as specified in MIL-M-38510 for device classes M, B, and S

26、and MIL-1-38535 for device classes Q and V and herein. 3.2. Case mttline(s). The case outline(s1 shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections+ The terminal connections shall be as specified on figure 1. Licensed by Information Handling ServicesI L STANDARDIZED MILITARY DRAWIN

27、G 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. SIZE A 5962-90597 3.2,5 Counting sequence diagram. The counting sequence diagram shall be as specified on figure 4, 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified

28、herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table 1 and shall apply over the full case operating temperature range, 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The el

29、ectrical tests for each subgroup are defined in table I. 3.5 Markin The part shall be marked with he PIN listed in 1.2 herein. Marking for device class Mde in accordance wifh MIL-STD-883 (see 3.1 herein). In addition, the manufacturers PIN may also be marked as listed in MIL-BUL-103. Marking for dev

30、ice classes B and S shall be in accordance with MIL-M-38510. Marking for device classes Q and V shall be in accordance with MIL-1-38535. 3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a “C“ as required ?n MIL-STD-883 ( see 3.1 herern). The certification mark for

31、 device classes B and S shall be a “J“ or “JAN“ as required in MIL-M-38510. The certification mark for device classes Q and Y shall be a QML“ as required in MIL-1-38535, 3.6 Certificate of com liance. For device class M, a certificate of compliance shall be required from a manufacturer in order to b

32、e listed as an approved source of supply in MIL-BUL-103 (see 6.7.3 herein), For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.2 herein). The certificate of compliance submitte

33、d to DESC-ECS prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M the requirements of MIL-STD-883 (see 3,l herein), or for device classes Q and V, the requirements of MIL-1-38535 and the requirements herein. MIL-STD-

34、883 (see 3.1 herein) or device classes B and S in MIL-M-38510 or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcrcuits delivered to this drawing. change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in

35、 MIL-STD-480. 3.7 Certificate of conformance. A certificate of conformance as required for device class M in 3.8 Notification of change for device class M. For device cTass M, notification to DESC-ECS of 3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, and the a

36、cquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer, 3.10 Microcircuit group assignment for device classes M, B, and S. Device classes M, B devices covered

37、 by this drawing shall be in microcircuit group number 40 (see MIL-M-38510, E) 3.11 Serialization for device class S, All device cTass S devices shall be serialized accordance with MIL-M-3-8TRI. 4. QUALITY ASSURANCE PROVISIONS and S appendix n 4.1 Sampling and inspection. For device class M, samplin

38、g and inspection procedures shall be in accordance with section 4 of MIL-M-38510 to the extent specified in MIL-STD-883 (see 3.1 herein). For device classes B and S, samplSng and inspection procedures shall be in accordance with MIL-M-38510 and method 5005 of MIL-STD-883, except as modified herein.

39、For device classes Q and V, camp1 ing and inspection procedures shall be in accordance with MIL-1-38535 and the device manufacturers QM plan. DEFENSE ELECTRONICS UPPLY CENTER REVISION LEVEL SHEET I DAYTON, OHIO 45944 5 U. 8. GOVERNMENT PRINTINQ OPFICL; LDOO-S4B-149 DESC FORM 193A SEP 87 Licensed by

40、Information Handling ServicesiSMD-59b2-70597 57 9779996 000387Ll 7 _. - - -7 F t TABLE I, Electrical performance characteristics. Test High level output voltage Low level output voltage High level input voltage Low level input vol tage Input capacitance Power dissipa ti on capacitance Quiescent curr

41、ent Additional quiescent supply current Input 1 eakage current Symbol I Conditions i/ IGroup A 1 Limits Unit I -55C 5 TC 5 +125OC - I unless otherwise specified Isubgroupsi I Min J Max I I I 1 I I I I !CC = 4.5 V, IV Vw I II01 = 20 pA I 1, 2, 3 I I l I- I I 4.41 I I!,; ;.O V or I I I I ,I I I101 = 4

42、.0 mAI I 3.71 I I I I I I i I I VOL i Vcc = 4.5 Y, i 1101 r 20 pA i 1, 2, 3 i 1 0.li v I I- I l I VI!,; $.O V or I I I I Functional tests ee footnotes at end of table. I 0.41 I I I I II01 = 4.0 MI i I I I I I I I VIN = O V, see 4.4.1 i 10 pf I i4 i I I 1 i I i i I I I I I I I IOUT = 0.0 A CPD I See

43、4.4.1 3/ t4 I I 50 I pF ICc 1 I I Ycc = 5.5 v, VIN = vcc or GND, I 1, 2, 3 1 I II I I I I I I i 1, 2, 3 I I I VIN = 2.4 V or 0.5 V I I I Otlw inputs: I I I I AICC 1 Any 1 input: I VIN = Vcc or GND, 1 vcc = 5.5 Y I I I I I I I I I I I I IIN i Vcc = 5.5 V, VIN = Vcc or GND i 1, 2, 3 i i -+1.0 PA I 1 I

44、 I I I I I I I See 4.4.lb I 17 I I SIZE A 5962-90597 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER SHEET DAYTON, OHIO 45444 6 1 1 1 :SC FORM 193A U. S. UOVERNMBNT PRINTING OFFICE 1990-1149-249 IEP 87 Licensed by Information Handling Servicesc TABLE I. Electrical performance charact

45、eristics - Continued. I I I I I I -55OC Tc +125OC - IsubgroupsiV I Min I Max I I I unless therYise specified I ropagati on delay , ItpHL1a I VCC = 4.5 19 I I 46 ns See figure 5 I 10, 11 I I 69 1 ns ropagation delay, I tPLH2 3 I 46 ns ltPHL2 1 10, 11 I 1 69 ns I ro agation delay, ItPLH3r I 19 I I 50

46、I ns OUTn I 10, 11 I I 75 I ns ro agation delay, ltPLH4, I 19 I I 50 I ns Id! to TC ItPHL4 I I I I I 10, 11 I I 75 I ns I I I I Vopagation del ay , I tPLH5 9 19 I I 46 I ns 1- Conditions i/ IGroup A I Limits I Unit Test I I CL = 50 PF, IPLHI I CP to DECODED DECIMAL OUTn CP to TC I I I I I, I I 1, to

47、 DECODED DECIML Itp3 I Mk to DECODED DECIML 195 OUTn , I 69 I ns I 46 I ns I I I 10, 11 I I 69 1 ns ransition time A/ ITLH, I 191 I 15 I ns I I 10, 11 I I 22 I ns Vopagation delay, 1tPLH6s I I tPHL6 I MK to TC I I I I I THL I I - l/ For a power supply of 5.0 V *lo%, the worst case output voltages (V

48、w and Y L) occur for HCT at 4.5 Y. Thus, the 4.5 Y values should be used when designing with thqs supply. Worst cases VI and VIL occur at Vcc = 5.5 V and 4-5 V respectively. - 2/ VIH and VIL not required and shall be applied as a forcing function for VOH or VOL tests. 3/ Power dissipation capacitanc

49、e (Cp 1, determines the dynamic power consum tion, - PD (total) = (Cpg + CL) Vcc2 f + ?VCC x IC 1 + n (delta Icc x VCCd, and !he dynamic current consumption (IS) is, 1s = (iCp + CL) VCCf. PD = dynamic power dissipation CL = load capacitance on each output = power dissipation capacitance of the device = input switching frequency n = number of inputs switching d = duty cycle Where: CPI - 4/ This parameter, if not tested, shall be guaranteed to the Specified limits. 4.2 Screening. For device class M, screening shall be in a