DLA SMD-5962-89945 REV B-2006 MICROCIRCUITS DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL 8-BIT D-TYPE EDGE-TRIGGERED READ BACK LATCHES MONOLITHIC SILICON《硅单片 8位D型边缘触发型回读锁存器 改进型肖.pdf
《DLA SMD-5962-89945 REV B-2006 MICROCIRCUITS DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL 8-BIT D-TYPE EDGE-TRIGGERED READ BACK LATCHES MONOLITHIC SILICON《硅单片 8位D型边缘触发型回读锁存器 改进型肖.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89945 REV B-2006 MICROCIRCUITS DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL 8-BIT D-TYPE EDGE-TRIGGERED READ BACK LATCHES MONOLITHIC SILICON《硅单片 8位D型边缘触发型回读锁存器 改进型肖.pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R188-92. 92-04-14 Tim H. Noh B Redraw with changes. Update to current requirements. Editorial changes throughout. - gap 06-07-06 Raymnd Monnin The original first page of this drawing has been replaced. REV SHET
2、 REV SHET REV STATUS REV B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Tim H. Noh DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Tim H. Noh COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY AL
3、L DEPARTMENTS APPROVED BY William K. Heckman MICROCIRCUITS, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, 8-BIT D-TYPE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-09-06 EDGE-TRIGGERED READ BACK LATCHES, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5
4、962-89945 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E331-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89945 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 223
5、4 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89945 01 K X Drawing
6、number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS996 8-bit D-type edge-triggered read back latches 1.2.2 Case outline(s). The case outlin
7、e(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 flat L GDIP3-T24 or CDIP4-T24 24 dual-in-line 3 CQCC1-N28 28 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appen
8、dix A. 1.3 Absolute maximum ratings. Supply voltage range -0.5 V dc to +7.0 V dc DC input voltage ( G, RD , EN , CLK and C/T ) . +7.0 V dc Voltage applied to D and to disabled three-state outputs . +5.5 V dc Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) . +300C The
9、rmal resistance, junction-to-case (JC) . See MIL-STD-1835 Maximum power dissipation (PD) 1/ . 467.5 mW Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage (VCC) . +4.5 V dc to +5.5 V dc Minimum high level input voltage (VIH) : G and RD . +2.2 V dc All others +2.0 V
10、 dc Maximum low level input voltage (VIL) 0.8 V dc Case operating temperature range (TC) . -55C to +125C _ 1/ Maximum power dissipation is defined as VCCx ICCand must withstand the added PD due to short-circuit output test, e.g., IOProvided by IHSNot for ResaleNo reproduction or networking permitted
11、 without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89945 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards
12、, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DE
13、PARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these
14、 documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and th
15、e references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-P
16、RF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be proc
17、essed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect f
18、orm, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construct
19、ion, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table
20、shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified
21、herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are d
22、escribed in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89945 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be
23、 in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not m
24、arking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-
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