DLA SMD-5962-89905 REV H-2012 MICROCIRCUIT LINEAR HIGH SPEED PULSE WIDTH MODULATOR CONTROLLER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device types 02 and 03. Technical and editorial changes throughout. 95-10-06 M. A. FRYE B Correct Figure 1 in regard to device types 02 and 03 for case outline 2. Change VCCto VSin Figure 2. Technical and editorial changes throughout. lgt 98-
2、03-27 R. MONNIN C Add class V for vendor CAGE 48726. Add table IIB. rrp 99-11-04 R. MONNIN D Make change to the Initial accuracy test as specified in the Oscillator section in table I. - ro 01-03-20 R. MONNIN E Make correction to case outline E terminal connections for device types 02 and 03 as spec
3、ified in figure 1. Add case outline 2 terminal connections for device type 01. ro 02-06-04 R. MONNIN F Drawing updated to reflect current requirements. -rrp 09-04-20 J. RODENBECK G Make a correction to output source current test in Table I, move the -0.5 mA limit from the min column to the max colum
4、n. - ro 10-10-18 C. SAFFLE H Make correction to footnote 1/ VSlimit from 15 V to 12 V for device types 02 and 03 only as specified under table I. - ro 12-08-22 C. SAFFLE REV SHEET REV H H SHEET 15 16 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A
5、 PREPARED BY JOSEPH A. KERBY DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE MICROCI
6、RCUIT, LINEAR, HIGH SPEED PULSE WIDTH MODULATOR CONTROLLER, MONOLITHIC SILICON DRAWING APPROVAL DATE 91-01-31 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 67268 5962-89905 SHEET 1 OF 16 DSCC FORM 2233 APR 97 5962-E429-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without lice
7、nse from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89905 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and spac
8、e application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples.
9、For device class M and Q: 5962 - 89905 01 E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / / Drawing number For device class V: 5962 - 89905 02 V E A Federal stock class designator RHA designator (see 1.2.1) Devi
10、ce type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M R
11、HA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1823
12、High speed PWM controller 02 1823A High speed PWM controller 03 1823B High speed PWM controller 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original i
13、ssuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordanc
14、e with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89905 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H
15、SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead fi
16、nish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VS) : Device type 01 . 30 V dc Device types 02 and 03 . 22 V dc DC output current, source or sink 0.5 A Pulse output current, sink or sou
17、rce (0.5 s) Device type 01 . 2.0 A Device types 02 and 03 . 2.2 A Analog input voltage : Device type 01 (pins INV, NINV, RAMP, S/S, and ILSD) . -0.3 V dc to 6.0 V dc Device types 02 and 03 (pins INV, NINV, and RAMP) -0.3 V dc to 7.0 V dc Device types 02 and 03 (pins S/S and ILSD) . -0.3 V dc to 6.0
18、V dc Clock output current -5.0 mA Error amplifier output current . 5.0 mA Soft start sink current 20 mA Oscillator charging current -5.0 mA Power dissipation (PD) 2/ 3/ . 1.0 W Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) . +150C
19、Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) : Case outline E . 80C/W Case outline 2 70C/W Power ground : Device types 02 and 03 . 0.2 V 1.4 Recommended operating conditions. Supply voltage (VS) . 10 V dc to 30 V dc Ambient operating tempe
20、rature range (TA) . -55C to +125C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ For case E, derate linearly above TA= +60C at 11 mW/C. For case 2, derate linearly a
21、bove TA= +40C at 9 mW/C. 3/ Must withstand the added PDdue to short circuit test; e.g., ISC. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89905 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVE
22、L H SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cite
23、d in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines
24、. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building
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