DLA SMD-5962-89868 REV B-2012 MICROCIRCUIT LINEAR POSITIVE ADJUSTABLE VOLTAGE REGULATOR MONOLITHIC SILICON.pdf

《DLA SMD-5962-89868 REV B-2012 MICROCIRCUIT LINEAR POSITIVE ADJUSTABLE VOLTAGE REGULATOR MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-89868 REV B-2012 MICROCIRCUIT LINEAR POSITIVE ADJUSTABLE VOLTAGE REGULATOR MONOLITHIC SILICON.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. - ro 06-05-04 R. MONNIN B Update drawing as part of 5 year review. -rrp 12-08-23 C. SAFFLE REV SHEET REV SHEET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED B

2、Y RAJESH PITHADIA DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY RAYMOND MONNIN MICROCIRCUIT, LINEAR,

3、 POSITIVE, ADJUSTABLE, VOLTAGE REGULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 01-12-19 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89868 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E446-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-ST

4、ANDARD MICROCIRCUIT DRAWING SIZE A 5962-89868 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device cla

5、ss V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 89868 01 Q Y A Fede

6、ral stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are ma

7、rked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 IP138A 5 A, positive adjustable voltage regulator 1.2.3 Device class designator. The devi

8、ce class designator is a single letter identifying the product assurance level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline lette

9、r Descriptive designator Terminals Package style Y MBFM1-P2 2 Flange mount 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING S

10、IZE A 5962-89868 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Power dissipation (PD) 50 W 2/ Input-output voltage differential . 35 V Junction temperature (TJ) +150C Storage temperature range -65C to +150C Lead temper

11、ature (soldering, 10 seconds) 300C Thermal resistance, junction-to-case (JC) 1C/W Thermal resistance, junction-to-ambient (JA) . 30C/W 1.4 Recommended operating conditions. Case operating temperature range -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks.

12、The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufa

13、cturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard M

14、icrocircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this dra

15、wing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Exte

16、nded operation at the maximum levels may degrade performance and affect reliability. 2/ Power dissipation is internally limited. This specification limited to 50 W; IMAX= 5 A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAW

17、ING SIZE A 5962-89868 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the

18、 device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein

19、for device classes Q and V. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specifi

20、ed herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The

21、electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacture

22、r has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V

23、 shall be a “QML“ or “Q“ as required in MIL-PRF-38535. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). The certificate of complianc

24、e submitted to DLA Land and Maritime-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein. 3.7 Certificate of conformance. A certificate of conformance as requi

25、red for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuits delivered to this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89868 DLA LAND AND MARITIME COLUMBUS

26、, OHIO 43218-3990 REVISION LEVEL B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TC +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Reference voltage VREFIOUT= 10 mA 1 01 1.238 1.262 V IOUT= 10 mA to 5

27、 A, 1,2,3 1.225 1.270 VIN- VOUT= 3 V to 35 V, PD 50 W Line regulation, 2/ VOUT/ VINRLINEVIN- VOUT= 3 V to 35 V 1 01 0.01 %/V 1,2,3 0.04 Load regulation, 2/ VOUT/ IOUTRLOADIOUT= 10 mA to 5 A, VOUT 5 V 1 01 15 mV IOUT= 10 mA to 5 A, VOUT 5 V 0.3 % IOUT= 10 mA to 5 A, VOUT 5 V 1,2,3 30 mV IOUT= 10 mA t

28、o 5 A, VOUT 5 V 0.6 % Thermal regulation t = 20 ms 1 01 0.01 %/W Ripple rejection RNVOUT= 10 V, f = 120 Hz, CADJ= 10 F 4,5,6 01 60 dB Adjustment pin current IADJ1,2,3 01 100 A Adjustment pin current change IADJIOUT= 10 mA to 5 A, VIN- VOUT= 3 V to 35 V 1,2,3 01 5 A Minimum load current IMINVIN- VOUT

29、= 35 V 1,2,3 01 5 mA Current limit ISCVIN- VOUT 10 V, DC 1,2,3 01 5 A VIN- VOUT 10 V, 0.5 ms peak 7 VIN- VOUT= 30 V 1 0.25 Temperature stability 3/ VOUT/ TEMP 1,2,3 01 2 % Long term stability VOUT/ TIME t = 1000 hrs, TA= 125C 7 01 1 % 1/ VIN- VOUT= 5 V and IOUT= 2.5 A, unless otherwise specified. 2/

30、 Regulation is measured at constant junction temperature, using pulse testing at a low duty cycle. Changes in output voltage due to heating effects are covered under thermal regulation specifications. For case outline Y, load regulation is measured from the bottom of the package. 3/ Guaranteed, if n

31、ot tested, to the limits specified herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89868 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 Case outline Y 1

32、/ Device type 01 Terminal number Terminal symbol 1 ADJ 2 VIN1/ Case is “VOUT”. FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89868 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-

33、3990 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the Q

34、M plan shall not affect the form, fit, or function as described herein. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. 4.2.1 Additional criteria for de

35、vice classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the devi

36、ce manufacturers Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified i

37、n method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. 4.3 Qualification inspection for device cla

38、sses Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology con

39、formance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. 4.4.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883

40、shall be omitted. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table II herein. 4.4.2.1 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shal

41、l be as specified in the device manufacturers QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturers TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon

42、request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table II herein.

43、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89868 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. Test requirements

44、Subgroups (in accordance with MIL-PRF-38535, table III) Device class Q Device class V Interim electrical parameters (see 4.2) 1 1 Final electrical parameters (see 4.2) 1,2,3,4 1/ 1,2,3,4 1/ Group A test requirements (see 4.4) 1,2,3,4,5, 2/ 6,7 1,2,3,4,5, 2/ 6,7 Group C end-point electrical parameter

45、s (see 4.4) 1 1 Group D end-point electrical parameters (see 4.4) 1 1 Group E end-point electrical parameters (see 4.4) - - 1/ PDA applies to subgroup 1. 2/ Subgroups 4, 5, 6, and 7, if not tested, shall be guaranteed to the limits specified in table I herein. 4.4.4 Group E inspection. Group E inspe

46、ction is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. End-point electrical parameters shall be as specified in table II herein. b. For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as spe

47、cified in MIL-PRF-38535 for the RHA level being tested. All device classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA= +25C 5C, after exposure, to the subgroups specified in table II herein. 5. PACKAGING 5.1 Packaging requirements. The requirement

48、s for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89868 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FORM 2234 APR 97 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipmen