DLA SMD-5962-89867 REV B-2007 MICROCIRCUIT LINEAR QUAD NAND RELAY DRIVERS MONOLITHIC SILICON《硅单片 四重非与门继电器驱动器 线性微型电路》.pdf
《DLA SMD-5962-89867 REV B-2007 MICROCIRCUIT LINEAR QUAD NAND RELAY DRIVERS MONOLITHIC SILICON《硅单片 四重非与门继电器驱动器 线性微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89867 REV B-2007 MICROCIRCUIT LINEAR QUAD NAND RELAY DRIVERS MONOLITHIC SILICON《硅单片 四重非与门继电器驱动器 线性微型电路》.pdf(9页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R037-92. 91-11-12 M. A. Frye B Incorporate revision A, NOR. Update drawing to current requirements. Editorial changes throughout. drw 07-05-02 Robert M. Heber THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN R
2、EPLACED. REV SHET REV SHET REV STATUS REV B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE
3、BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, LINEAR, QUAD NAND RELAY AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-04-05 DRIVERS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89867 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E387-07 Pro
4、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89867 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device req
5、uirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89867 01 C A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead fi
6、nish(see 1.2.3)1.2.1 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 UH-507 Quad NAND driver, high-output voltage and current 1.2.2 Case outline. The case outline is as designated in MIL-STD-1835 as follows: Outline letter Descr
7、iptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VCC) 7.0 V dc Input voltage (VIN) 5.5 V dc Output off-state voltage (VS) 100 V dc Output o
8、n-state sink current 500 mA Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +150C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA) 90C/W 1.4 Recommended operating conditions. Supp
9、ly voltage range (VCC) 4.5 V to 5.5 V Current into any output (on-state) 250 mA maximum Ambient operating temperature range . -55C to +125C Minimum high level input voltage VIN(1). 2.0 V Maximum low level input voltage VIN(0) . 0.8 V Provided by IHSNot for ResaleNo reproduction or networking permitt
10、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89867 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standar
11、ds, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
12、DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of the
13、se documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawin
14、g and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance wi
15、th MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may
16、 be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not
17、affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, c
18、onstruction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections and logic diagram. The terminal connections and logic diagram shall be as specified on figure
19、1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the
20、subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For package
21、s where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535
22、, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT D
23、RAWING SIZE A 5962-89867 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input cu
24、rrent, high IIN(1)VCC= 5.5 V, driven input = 2.4 V, other input = 0 V 1, 2,3 All 40 A VCC= 5.5 V, driven input = 5.5 V, other input = 0 V 1000 Input current, low IIN(0)VCC= 5.5 V, driven input = 0.4 V, other input = 4.5 V 1, 2, 3 All -800 A Output reverse current IOFFVCC= 4.5 V, driven input = 2.4 V
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