DLA SMD-5962-89659-1990 MICROCIRCUIT LINEAR FET BUFFER HYBRID《场效应晶体管缓冲器线性混合微型电路》.pdf

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1、f LTR DESCRIPTION DATE (YR-MO-DA) APPROVED STANDARDIZED MILITARY DRAWING THIS DRAWING IS AVAILABLE :OR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 AMSC NIA I I SHEET 1 *US. OOYIRMHT FWJlINo OFFICE: 1987 - 748-119/60911 DESC FO

2、RM 193 SEP a7 5962-E1314-1 DISTRIBUTION STATEMENT A. Approved for publlc release; dlslrlbulion Is unilmiled. -1 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-i I. scwk 1.1 Scope. Thfs drawing describes device requirements for class H hybrfd microci

3、rcuits ta be 1.2 Part number. The complete pdrt nunber shall be as shown in the following example: Irocessed i-n accordance with MIL-If-38534. 5962-89659 O1 X I I- T- X T 1 t I I I I I I I 1 1 t Drawing number Device type tase outline Lead finish per (1.2.11 (1.2.2) MIL-H-38534 1.2.1 Device type. Th

4、e device type chat? identify the circu%t function as folTows: Device type Generic number Ci rcui t function 01 EL2004 FET buffer 1.2.2 Case outlines. The case outlines shall be as designated in appendix C of MIL-bl-38510, and Outline letter Case outline (See figure 1, TO-8 (12-lead can) C-6 (52-lead

5、,.761Ir x ,761 x ,120“), square leadless chip carrier s fo-tlows: X Y 1.3 Absol ute maxirnuin rati ny s. 1.4 Recomnended operating conditions. Positive supply voltage (V+) - - - - - - - - - - - - - - - Negative supply voltage (V-) - - - - - - - - - - - - - - - Ambient operating temperature range (TA

6、) - - - - - - - - - *20 V dc *20 V dc 1.5 W 2.5 W *250 n4 -65C to +150C 3QOC 25“C/W 60C6W +175 C 3l0C/W lOOC/W +15 V dc -55C to +l25“C -15 Y dc SIZE A 5962 -8965 9 STANDARDIZED MILITARY DRAWING I DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 I REVISION LEVEL I SHEET 3 * J DESC FORM 193A SEP a

7、7 xi U S. GOVERNMENT PRINTING OFFICE 19W-548-9M Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-2. APPLICABLE DKUMENTS STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 2.1 Government specifications, standard, and bul

8、letin. Unless otherwise specified, the following ;pecifications, standard, and bulletin ot the issue listed in that issue of the Department of iefense Index of Specifications and Standards Specified in the solicitation, form a part of this SIZE A 5962-89659 REVISION LEVEL SHEFT 3 Irawing to the exte

9、nt specified herein. SPEC IF ICATI ONS MILITARY MIL-M-3b510 - Microcircuits, General Specification for. MIL-H-38534 - Hybrid Microcircuits, General Specification for. STANDARD MI LI TARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. BULLETIN MI LI TARY MIL-BUL-103 - List of Standar

10、ized Military Drawings (SMDs). (Copies of the specifications, standard, and bulletin required by manufacturers in connection with qecific acquisition functions should be obtained from the contracting activity or as directed by the ontracting activity. ) 2.2 Order of precedence. In the event of a con

11、flict between the text of this drawing and the meferences cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 I tem requirements. s specitied herein. The i ndi vi dual i tem requirements chal 1 be i n accordance MIL-H-38534 and 3.2 Design, construction, and physical dim

12、ensions. The design, construction, and physical limensions shall be as specitied in MIL-H-JSJ4 and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and on figure 1. 3.2.2 Tenninal connections. The terminal connections shall be as specified on figure 2. 3.3 Elec

13、trical performance characteristics. Unless otherwise specified herein, the electrical ierfonnance characteristics are as specified in table I and shall apply over the full specified iperating temperature range, 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups

14、 ;pecifified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-H-38534. The part shall be marked with the )art number listed in 1.2 herein. listed in MIL-BUL-103 (see 6.6 herein). In addition, the manufacturers part num

15、ber may also be marked as Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE I. Electtpical performance characteristics. 1 e t t t -55C TA +125C subgroups III L Min 1 Max f I I unless olherwfse specified I 1 1 I I. I f 1 t 1 Condiions group A t Li

16、mits t Unit Test I 10 mv IRs c 100 kSb I 1 t I 15 1 mV I I I Voltage gain tAy0L YIN = *lo V, Vs = Y5 Y 1 4,5,6 f 0.971 1.0 I V/V 1 t I I I t I 1 t I I 1 4,5,6 I 0.92; 0.98! V/V VN = *I0 V, RL = LQOQ I t t I t I I I 1 I I I t t I 1 I I Output offset uoitage IVos IUS z *f5 V lRL = kn I i tvs = *I5 Inp

17、ut impedance IRIN /Ys = Y5 Y, VIN = *i Y I4 !lo4 in lRL = 1 l. f 1 l!ItFity I tRL = I kn I 1 l I IV j4 Output impedance IROUT fVs = *5 V *I Y, ARt = 0 Output vattage swing p(j FVs = *I5 Y, VIN = 4 Y r 46 I *i2 I t I I b I I I t tVs = *15 V I 4,%6 I *9 I IV L IVik = *f0.5VY RL = 00 I I I I t t 1 I F

18、I L I f I 1 I I I r t , 1 = *15 V F 2,3 I I 10 I nA I 1 t tTj = TATMX k F I 1 t IVN = O Y, RL = L Ftn t: I F t I c I; I 1 t YEN = 0 Y, RL = I kn t I I I 1 I 1 I F I 0.251 nA I Input current FVs = 45 V Ib Wlk = (FY, Rir= 1 ka F I I I,2,3 i I24 ImA Supply current = f*5 IIs ee footnotes at end of“ taMe

19、 STANDARDIZED MILITARY DRAWING. DEFENSEELECtRONiCS SUEPLY CENTER DAWN, OHIO45444 : SIZE rA 5962-89659 SHEET AEYICIQN LEVEL 6 :SC FORM T93A iEP 82 t U S.GOVERNMENTPRINllNG OFFICE iBBB-5M54i Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-57b2-8765

20、7 57 7777776 0000bb2 T + I See footnotes at end of table. STAN DARDI ZED SIZE MILITARY DRAWING A 5962-89659 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET 5 DAYTON, OHIO 45444 TABLE I. Electrical performance characteristics - Continued. I I I I I unless oi3erwise specified /subgroup Conditio

21、ns IGroup A I -55C TA +I25OC Test Output offset voltaye !VOS IVs = 1.15 V IKs 5 100 ka IRL = 50n I IVIN = O V I I I I I1 I I I 2,3 Input impedance 14 I I I I *5 V, VIN = 1.1 V, 14 A L = 5gn to infinity I TA = 25 C I IROUT I I IVa I l = I Output impedance Output voltage swing IV0 IVs = 15 Y, VIN = 14

22、 V IRL = 50n I I I 4,5,6 I Input current I I1 I I I I I I Limits 1 Unit II Min i Max i - i 30 i mV I I T-r- I 35 I mV I I - 0.901 1.0 I v/v I I I 1 - 0.801 0.951 V/V I I I i 108 I In I I I I - I8 In I I I I I I *2.0 I iv I I I I - i 250 i pA I I i 10 i nA I I I I i i - I20 ImA I I I i Provided by IH

23、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- TABLE I. Electrical performance characteristics - Continued. STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYMN, OHIO 45444 Test StZE A 5962-89659 * REWSlN LEVEL SHEET 6 I 1 Symbo I Eandwi dth I I

24、 BW I I I I I I I I I I I I Slew rate i SR I I I I Ri se time 1% i I I I i Propagation del ay pP ee footnotes at end of table. Conditions Group A i Limits i Unit -55C TA +125C Isubgroupsl-II unless oherwTse specified I I Min 1 Max I I I I I MHz i 4 i 200 i I I I l I 1 I 5,6 I 175 I I MHz I I I I I I

25、 I 1 I IvlHz I 4 1 140 i I I I I I I i 5,6 i 125 i I MHz I r I I I I I I 4 12000 I I l I I I I I 5,6 li200 1 1 V/vA I I 1 1 I I I 1 V *15 V hest data (variables format) on 22 devices from the initial QCI group A lot sample, produced on the iertified line, for each device type listed herein. The data

26、 should also include a summary of all barameters manually tested, and for those which, if any, are guaranteed. n order to be listed as an approved source of supply in MIL-BUL-103 (see 6.6 herein). The ertificate of compliance submitted to DESC-ECC prior to listing as an approved source of supply ,ha

27、ll affirm that the manufacturers product meets the requirements of MIL-H-38534 and the ,equi rements herein. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer 5962-89659 DEFENSE ELECTRONICS SUPPLY CENTER REVISION LEVEL SHEET I DAYION, OHIO 45444 7 ir U.

28、 C. GOVERNhtENT PRINTING OFFICE: 1989-749.033 IESC FORM 193A SEP 87 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-89659 59 797999b 0000665 5 STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICC SUPPLY CENTER DAYTON, OHIO 45444 i- .605 (15.37)

29、 DIA .595 (15.13) SIZE A 5962-89659 8 REVICION LEVEL SHEET r .555 (14. 10) 030 (0.76) ,O22 (0.56) .O19 (0.43) DIA -I I- .O16 (0.41) % 450 ,100 TYP- + (2.54) SEE NOTE 4 .200 (5.08) .* TYP SEE NOTE 4 ,036 (0.91) .O26 (0.66) NOTES : 1. Dimeiisions are in inches. 2. Metric equivalents are for general in

30、formation only. 3. Metric equivalents are in parentheses. 4. Ledds having a maximum diameter ,019 (0.48 mm) measured in gauging plane ,054 (1.37 nrn) +.o01 (0.03 mm), -.O00 (0.00 mm) below the base plane of the product shall be within ,007 (0.18 mm) of their true position relative to a maximum width

31、 tab. FIGURE 1. Case outline x. a 4 U C.BOVERNMENT PiiNIlttQ OFFICE: IOSB-548-W DESG FORM 193A SEP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- I I Device type I I I Case outlines I I I Terminal number I I I STANDARDIZED MILITARY DRAWING DEFEN

32、SE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25-30 31 32-35 36 37 38 39 40 41 42 43 44 45-48 49 50 51 52 SIZE A 5962-89659 REVISION LEVEL SHEET 9 I o1 I o1 I I X I Y I I Terminal symbol I Terminal symbol I I vc+ No connection No conne

33、ction No connection Input Offset preset Offset adjust Wo connection vc - V- output Y+ - - - I No connection I No connection I No connection I No connection I No connection I No connection I No connection I No connection I No connection I No connection I No connection I No connection I No connection

34、I Input I No connection I No connection I No connection I Offset preset I Offset preset I No connection I No connection I No connection I Offset adjust I Offset adjust 1 No connection I vc- I No connection I v- I No connection I No connection I output I output I No connection I No connection I No co

35、nnection I y+ I No connection I vc+ I No connection I No connection I No connection I I FIGURE 2. Terminal connections. rt U. S. GOVERNMENT PRINTING OFFICE 1989-749433 DESC FORM 193A SEP a7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SHD-5962-876

36、59 57 = 799799b 0000667 7 = STANDARDIZED MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYiON, OHIO 45444 3.8 Certificate of conformance. A certiicate of conformance as required in MIt-H-38534 shall 4. QUALLTY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection procedures

37、shall be in accordance with 4.2 Screening. Screening shall be in accordance with MIL-H-38534 and as specified herein, and e provided with each lot of microcircuits del-ivered to this drawing. IIL-H-38534 and method 5008 of MIL-STD-883. hall be conducted on all devices prior to quality conformance in

38、spection. ritera shall apply: The following actditional a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, By C, or O using the circuit submitted with the certificate af compl iance ( see 3.7 herein 1. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Inte

39、rim and final electrical test parameters shalT be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. b. 4.3 Quality conformance inspection. Quality conformance inspection shail be in accordance with IL-H-385

40、34 and as specified herein. 008 and herein for including groups A, 6, C, and D inspections (see 4.3.1 through 4.3.4). Inspections to be performed shall be those specified in method 4.3.1 Group A inspection. Group A inspection shall be in accordance with MIL-H-38534 and as 01 lows: a. Tests shall be

41、as specified in table II herein. b. Subgroups 7 and 8 in table X, OP method 5008 of MIL-STD-883 shall be omitted. 4.3.2 Group B inspection. Group B inspection shall be in accordance with MIL-H-38534. SIZE A 5962-89659 REVISION LEVEL SHEET 19 4.3.3 Groups C inspection. Group C inspection shall be in

42、accordance with MIL-H-38534 and as 01 lows: a. b. End-point electrical parameters shall be as specified in tabTe II herein. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, Cy or D using the circuit submitted with the certificate of compliance (see 3.7 herein).

43、 (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE II. Electrical test requirements.

44、SIZE A STAN DARDI ZED 1 I I 5962-89659 i MIL-STD-883 test requirements i Subgroups I I (per method I I 5008, group A I I I test table) I I I I I I I I interim electrical test parameters I I I I I I I Final electrical test parameters I 1*,2,3,4,9 1 I I I - MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY

45、CENTER DAYTON, OHIO 45444 I I Group A test requirements I REVISION LEVEL SHEET 11 I I I 1,2,3,4,5* I I 6*.9.10*.11* I I -i _ i i I i Group C end-point electrical parameters i 1,293 I 1 * Applies to subgroup 1. * Subgroups 5, 6, 10, and 11 shall be tested as part of device initial characterization an

46、d after design and process changes. Subgroups 5, 6, 10, and 11 shall be guaranteed in table I for all lot(s) not specifically tesed. 4.3.4 Group D inspection. 5. PACKAGING Group D inspection shall be in accordance with MIL-H-38534. 5.1 Packaging requirements. (IL-H-38554. The requirements for packag

47、ing shall be in accordance with 6. NOTES 6.1 Intenaed use. Microcircuits conforming to this drawing are intended for original equipment 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device 6.3 Configuration control of SMDs. All proposed changes to existing S

48、MDs will be coordinated iesign applications and logistic support of existing equipment. :overed by a contractor-prepared specification or drawing. iith the users ot record for the individual documents. iccordance with MIL-STD-481 using DD Form 1693, Engineering Change Proposal (Short Form). :enter w

49、hen a system application requires configuration control and the applicable SMD. DESC will naintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics (FSC 5962) should contact DESC-ECC, telephone (513) 296