DLA SMD-5962-89570 REV G-2009 MICROCIRCUIT HYBRID LINEAR HIGH SPEED SINGLE CHANNEL OPTOCOUPLER.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated drawing to reflect MIL-H-38534 processing. Editorial changes throughout. 91-05-29 D. M. Cool B Add vendor CAGE 31757. Replace incorrect sheet 1. Change table II. Update document. Editorial changes throughout. 92-12-10 K. A. Cottongim C Ad

2、d case outlines X and Y. Rewrite entire document. 93-08-05 K. A. Cottongim D Changes in accordance with NOR 5962-R035-94. 93-11-12 K. A. Cottongim E Added device type 02 for class K. Redrew entire document. -sld 98-06-16 K. A. Cottongim F Updated drawing to reflect the current requirements of MIL-PR

3、F-38534. -sld 03-05-15 Raymond Monnin G Update drawing. -gz 09-04-09 Joseph D. RodenbeckTHE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Steve Duncan DEFENSE SUPPLY C

4、ENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Donald R. Osborne COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY William K. Heckman MICROCIRCUIT, HYBRID, LINEAR, HIGH SPEED, SINGLE CHANNEL, OPTOCOUPLER AND AGENCIES OF THE DEP

5、ARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-11-01 AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 67268 5962-89570 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E264-09Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89

6、570 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and a

7、re reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: For class H devices: 5962-89570 01 P X Drawing number Device type Case outline Lead finish (see

8、 1.2.2) (see 1.2.4) (see 1.2.5) For class K devices: 5962 - 89570 02 K P X Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Radiation hardness assurance (RHA

9、) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit fun

10、ction 01 HCPL-5401, 66115-105 Single channel optocoupler 02 HCPL-540K, 66115-301 Single channel optocoupler 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and re

11、quire QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard mili

12、tary quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range

13、, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C, and D). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89570 DE

14、FENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisit

15、ion document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited

16、temperature range. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style P CDIP2-T8 8 Dual-in-line X See figure 1 8 Dual-in-line Y See figure 1 8 Dual-in-line 1.2.5 Lead finish. The lead finish shall

17、 be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) 0.0 V dc to 7.0 V dc Average forward current (IAVG) 10 mA Peak forward current (IFPK) . 20 mA 2/ Reverse input voltage (VR) . 3.0 V dc Average output current, (IO) 25 mA Output voltage range (VO). -0.5 V d

18、c to +10 V dc Three state enable voltage (VE) -0.5 V dc to +10 V dc Power dissipation, (PD) . 400 mW Storage temperature range. -65C to +150C Lead temperature (soldering, 10 seconds). +260C Junction temperature (TJ) . +175C Thermal resistance, junction-to-case (JC): Case outline P. See MIL-STD-1835

19、Case outlines X and Y. 28 C/W Case temperature (TC) +170C 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.75 V dc to 5.25 V dc High level input current range (IF(ON). 6.0 mA to 10.0 mA Low level input voltage (VF(OFF). 0.7 V dc maximum High level enable voltage range (VEH) 2.0 V d

20、c to VCCLow level enable voltage range (VEL) 0 V dc to 0.8 V dc Ambient operating temperature range (TA). -55C to +125C 1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/

21、 Peak forward input current pulse width 2.0 V dc). 4/ Parameters shall be tested as part of device initial characterization and after design and process changes. Parameters shall be guaranteed to the limits specified in table I for all lots not specifically tested. Provided by IHSNot for ResaleNo re

22、production or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89570 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Case outline X 50SEATINGPLANESymbol Millimeters Inches Min Max Min Max A 4.57 .180 A

23、1 1.40 1.65 .055 .065 b 0.41 0.51 .016 .020 c 0.18 0.33 .007 .013 D 9.40 9.91 .370 .390 e 2.29 2.79 .090 .110 E 9.65 9.91 .380 .390 E1 8.13 .320 L 1.07 1.32 .042 .052 S 0.89 1.27 .035 .050 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using in

24、ch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle(s) marked on top of the package. FIGURE 1. Case outline. Provided by IHSNot for ResaleNo reproduction or networki

25、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89570 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 Case outline Y Symbol Millimeters Inches Min Max Min Max A 4.32 .170 A1 1.14 1.40 .045 .055 b 0.41 0.51 .0

26、16 .020 c 0.18 0.33 .007 .013 D 9.40 9.91 .370 .390 e 2.29 2.79 .090 .110 E 8.13 .320 eA 7.37 7.87 .290 .310 Q 0.51 .020 S 0.89 1.27 .035 .050 NOTES: 1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of prob

27、lems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. Pin 1 is indicated by the ESD triangle(s) marked on top of the package. FIGURE 1. Case outline - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

28、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89570 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234 APR 97 Device types All Case outlines P, X, and Y Terminal numbers Terminal symbols 1 2 3 4 5 6 7 8 NC +VF-VFNC GND VOVEVCCNOTE: NC is no connectio

29、n FIGURE 2. Terminal connections. Input Enable Output H L L L L H H H Z L H Z H = Logic high voltage level L = Logic low voltage level Z = High impedance state FIGURE 3. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCU

30、IT DRAWING SIZE A 5962-89570 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 10 DSCC FORM 2234 APR 97 NOTES: 1. Pulse generator having the following characteristics: tR= tF= 5.0 ns f = 500 kHz 25% duty cycle 2. Load capacitance (CL) includes probe and jig capacitance.

31、 3. All diodes (D1through D4) are 1N4150 or equivalent. FIGURE 4. Propagation delay times test circuit and waveform. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89570 DEFENSE SUPPLY CENTER COLUMBUS COLUMB

32、US, OHIO 43218-3990 REVISION LEVEL G SHEET 11 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*, 2, 3, 9 Group A test requiremen

33、ts 1, 2, 3, 9, 10, 11 Group C end-point electrical parameters 1, 2, 3 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices Not applicable * PDA applies to subgroup 1. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall

34、 apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall spe

35、cify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TAas specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table I

36、I herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A

37、 inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. Provided by

38、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89570 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 12 DSCC FORM 2234 APR 97 4.3.3 Group C inspection (PI). Group C inspection shall be in

39、 accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level

40、control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TAas specified in accordanc

41、e with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not cur

42、rently applicable to this drawing. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment)

43、, design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated as spe

44、cified in MIL-PRF-38534. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution o

45、f changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of s

46、upply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-S

47、TANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 09-04-09 Approved sources of supply for SMD 5962-89570 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the additio

48、n or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DSCC maintains an online database of all current sources of sup