DLA SMD-5962-89538 REV B-2011 MICROCIRCUIT MEMORY DIGITAL CMOS 16K X 8 UV EPROM POWER DOWN MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 03 for vendor CAGE number 65786. Add a reprogrammability test to 4.3.2. Change to margin test method A. Editorial changes throughout. 93-01-12 M. A. Frye B Moved endurance and data retention testing requirements from Section 4 o
2、f drawing to Section 3 of drawing. Updated body of drawing to reflect current requirements. - glg 11-03-15 Charles Saffle THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY K
3、enneth Rice DLA LAND AND MARITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY All DEPARTMENTS APPROVED BY Donald Cool MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 16K X 8 UV EPROM, POWER DOWN, MONOLITHIC SILICON AN
4、D AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-01-26 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89538 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E276-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT
5、DRAWING SIZE A 5962-89538 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Par
6、t or Identifying Number (PIN). The complete PIN shall be as shown in the following example: 5962-89538 01 X A | | | | | | | | | | | | Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function a
7、s follows: Device type Generic number Circuit Access time 01 (see 6.6) 16K x 8 UV EPROM 65 ns 02 (see 6.6) 16K x 8 UV EPROM 55 ns 03 (see 6.6) 16K x 8 UV EPROM 45 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows: Outline letter Descriptive designat
8、or Terminals Package style U CQCC1-N32 32 Rectangular leadless chip carrier 1/ X GDIP1-T28 or CDIP2-T28 28 Dual-in-line 1/ Z GDFP2-F28 28 Flat package 1/ 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range to ground pote
9、ntial (VCC) . -0.5 V dc to +7.0 V dc DC voltage applied to Outputs in the high Z -0.5 V dc to +7.0 V dc DC input voltage . -3.0 V dc to +7.0 V dc Thermal resistance, junction-to-case (JC): Case outlines U, X and Z See MIL-STD-1835 Maximum power dissipation (PD) 2/ 1.0 W Junction temperature (TJ) . +
10、175C Lead temperature (soldering, 10 seconds maximum) . +260C Storage temperature range . -65C to +150C Temperature under bias -55C to +125C Data retention 10 years, minimum Endurance . 25 cycles/byte, minimum 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc
11、Input high voltage range (VIH) +2.0 V dc Input low voltage range (VIL) +0.8 V dc Case operating temperature range (TC) . -55C to +125C 1/ Lid shall be transparent to permit ultraviolet light erasure. 2/ Must withstand the added PD due to short circuit test; e.g. , IOS. Provided by IHSNot for ResaleN
12、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89538 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The follo
13、wing specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing,
14、General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircu
15、it Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing
16、 and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements The individual item requirements shall be in accordance with
17、 MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may b
18、e processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not af
19、fect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535,
20、appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.3.1 Unprogrammed devices. The trut
21、h table for unprogrammed devices for contracts involving no altered item drawing shall be as specified on figure 2. When required in groups A, B, or C inspection (see 4.3), the devices shall be programmed by the manufacturer prior to test in a checkerboard pattern or equivalent (a minimum of 50 perc
22、ent of the total number of bits programmed) or to any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed. 3.2.3.2 Programmed devices. The truth table for programmed devices shall be specified by an altered item drawing. 3.3 Electrical performance c
23、haracteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. T
24、he electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where the entire SMD PIN number
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