DLA SMD-5962-89535 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY OCTAL BIDIRECTIONAL TRANSCEIVER WITH 8-BIT PARITY GENERATOR CHECKER AND THREE-STATE OUTPUTS MONOLITHIC .pdf
《DLA SMD-5962-89535 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY OCTAL BIDIRECTIONAL TRANSCEIVER WITH 8-BIT PARITY GENERATOR CHECKER AND THREE-STATE OUTPUTS MONOLITHIC .pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-89535 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY OCTAL BIDIRECTIONAL TRANSCEIVER WITH 8-BIT PARITY GENERATOR CHECKER AND THREE-STATE OUTPUTS MONOLITHIC .pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical changes to figures 1, 2, 3 and table I. Deleted vendor CAGE number 27014 from 5962-8953501KX and added to 5962-8953501LX. Editorial changes throughout. 90-11-06 W. Heckman B Changes IAW NOR 5962-R225-92. Replaced table I. - ltg 92-06-18
2、 Tim Noh C Change paragraphs 3.1 and 3.5 to include QD statements. Upgrade document to reflect current requirements. Correct Test circuit on Figure 5. Editorial changes throughout. - les 02-01-30 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. - gap 09-03-18 Ro
3、bert M. Heber The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Larry T. Gauder CHECKED BY Tim H. Noh DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:
4、/www.dscc.dla.mil APPROVED BY William K. Heckman STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-09-12 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, OCTAL BIDIRECTIONAL TRANSCEIVER WITH 8-BIT P
5、ARITY GENERATOR/CHECKER AND THREE-STATE OUTPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-89535 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E458-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRA
6、WING SIZE A 5962-89535 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1
7、.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89535 01 K X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic nu
8、mber Circuit function 01 54F657 Octal bi-directional transceiver with 8-bit parity generator/checker and three state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or GDFP3
9、-F24 24 Flat L GDIP3-T24 or GDIP4-T24 24 Dual-in-line 3 CQCC1-N28 28 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage . -0.5 V dc minimum to +7.0 V dc maximum DC input voltage range . -0.5 V dc minimu
10、m to +7.0 V dc maximum DC input current range -30 mA minimum to +5.0 mA maximum Voltage applied to output in high output state . -0.5 V dc to +5.5 V dc Current applied to output in low output state: A0- A740 mA B0- B7PARITY, ERROR 96 mA Storage temperature range . -65C to +150C Maximum power dissipa
11、tion (PD) per device 2/ 1.15 W Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Maximum input clamp current (IIC) -18 mA
12、Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.8 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ Must withstand the added PDdue to short circuit test (e.g. IOS).Provided by
13、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89535 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standard
14、s, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrate
15、d Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDB
16、K-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict betwee
17、n the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements
18、shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certifica
19、tion to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These
20、 modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. This drawing has been modified to allow
21、 the manufacturer to use the alternate die/fabrication requirements of paragraph A.3.2.2 of MIL-PRF-38535 or other alternative approved by the qualifying activity. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38
22、535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Test circuit and switching
23、waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range.
24、 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT D
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