DLA SMD-5962-89481 REV A-2004 MICROCIRCUIT LINEAR CMOS 12-BIT MULTIPLYING D A CONVERTER MONOLITHIC SILICON《硅单片12位乘法D A转换器互补型金属氧化物半导体线性微电路》.pdf

《DLA SMD-5962-89481 REV A-2004 MICROCIRCUIT LINEAR CMOS 12-BIT MULTIPLYING D A CONVERTER MONOLITHIC SILICON《硅单片12位乘法D A转换器互补型金属氧化物半导体线性微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-89481 REV A-2004 MICROCIRCUIT LINEAR CMOS 12-BIT MULTIPLYING D A CONVERTER MONOLITHIC SILICON《硅单片12位乘法D A转换器互补型金属氧化物半导体线性微电路》.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - drw 04-09-10 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC

2、N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking MICROCIRCUIT, LINEAR, CMOS, 12-BIT, MULTIPLYI

3、NG D/A CONVERTER, MONOLITHIC AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-03-23 SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-89481 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E420-04 Provided by IHSNot for ResaleNo reproduction or networking permitted without licen

4、se from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89481 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in acc

5、ordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89481 01 V A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device types. The device types identify the circuit fun

6、ction as follows: Device type Generic number Circuit function 01 AD7541AS 12-bit multiplying DAC 02 AD7541AT 12-bit multiplying DAC 03 PM7541AB 12-bit multiplying DAC 04 PM7541AA 12-bit multiplying DAC 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline l

7、etter Descriptive designator Terminals Package style 2 CQCC1-N20 20 Square leadless chip carrier V GDIP1-T18 or CDIP2-T18 18 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (VDD) . +17 V dc Reference input vol

8、tage (VREF) . 25 V dc VRFBto GND 25 V dc Digital input voltage (VIN): Device types 01, 02. -0.3 V dc to VDDDevice types 03, 04. GND, VDDVoltage at OUT1, OUT2 pins -0.3 V dc to VDDPower dissipation 450 mW 1/ Storage temperature range. -65C to +150C Lead temperature (soldering, 10 seconds). +300C Junc

9、tion temperature (TJ). +175C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Cases V and 2. 120C/W 1.4 Recommended operating conditions. Positive supply voltage (VDD). +15 V dc Ambient operating temperature range (TA) -55C to +125C Reference

10、input voltage range -10 V dc to +10 V dc 1/ Derate 6 mW/C above TA= +75C Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89481 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3

11、 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the so

12、licitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMEN

13、T OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins A

14、venue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a sp

15、ecific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer List

16、ing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flo

17、w as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL

18、-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with

19、1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating

20、temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked wi

21、th the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A c

22、ompliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. Provided by IHSNot for

23、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89481 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions

24、1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxRelative accuracy RA 1, 2, 3 01 1 LSB 1 02 12, 3, 12 0.5 1, 2, 3 03, 04 0.5 Differential nonlinearity DNL 1, 2, 3 01, 03 1 LSB 1 02 12, 3, 12 0.5 1, 2, 3 04 0.5 Gain error AE 2/ 1 01 6 LSB 2, 3 8 1 02 62, 3

25、512 3 1 03 22, 3 31 04 1 2, 3 2Power supply rejection ratio PSRR 3/ 1 01, 02 .01 %per% 2, 3 .02 1 03, 04 .001 2, 3 .002 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89481 DEF

26、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics continued. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min MaxOutput leakage current 4

27、/ IOUTIOUT1and IOUT2pins 1 01, 02 5 nA Digital input = 0 V, VDD2, 3 200 1 03, 04 52, 3 100 Reference input resistance RIN1, 2, 3 01, 02 7 18 k 03, 04 15 Digital input high voltage VIH1, 2, 3 All 2.4 V Digital input low voltage VIL1, 2, 3 All 0.8 V Digital input leakage current IINVIN= 0 V or VDD1, 2

28、, 3 All 1 A Supply current IDDDigital inputs = VINor VIL1, 2, 3 All 2 mA Digital inputs = 0 V or VDD1 100 A 2, 3 500 Digital input capacitance CINSee 4.3.1c, TA= +25C 4 All 8 pF Output capacitance IOUT1pin IOUT2pin COUT1COUT2Digital inputs = VIH, See 4.3.1c, TA= +25C 4 All 200 70 pF IOUT1pin IOUT2pi

29、n COUT1COUT2Digital inputs = VIL, See 4.3.1c, TA= +25C 70 200 1/ VDD= +15 V, VOUT1= VOUT2= 0 V, VREF= 10 V unless other wise specified. 2/ Measured using internal feedback resistor. 3/ Delta VDD= 5%. 4/ DAC loaded with 0000 0000 0000 for IOUT1and digital inputs = VIL. Digital inputs = VIHfor IOUT2.

30、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89481 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 6 DSCC FORM 2234 APR 97 Device types 01, 02, 03, and 04 Case outlines V 2

31、Terminal number Terminal symbol 1 IOUT1NC 2 IOUT2IOUT13 GND IOUT24 BIT 1 (MSB) GND 5 BIT 2 BIT 1 (MSB) 6 BIT 3 BIT 2 7 BIT 4 BIT 3 8 BIT 5 BIT 4 9 BIT 6 BIT 5 10 BIT 7 BIT 6 11 BIT 8 NC 12 BIT 9 BIT 7 13 BIT 10 BIT 8 14 BIT 11 BIT 9 15 BIT 12 (LSB) BIT 10 16 VDDBIT 11 17 VREFBIT 12 (LSB) 18 RFBVDD19

32、 - - - VREF20 - - - RFBNC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89481 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET

33、7 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source o

34、f supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to th

35、is drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentatio

36、n. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-

37、883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level control an

38、d shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electri

39、cal test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, t

40、able I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 12 Group A test requirements (method 5005) 1, 2, 3, 4, 12 Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. Provided by IHSNot for ResaleNo rep

41、roduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89481 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 8 DSCC FORM 2234 APR 97 4.3 Quality conformance inspection. Quality conformance inspection shall be in accord

42、ance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 5, 6, 7, 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be omitted

43、. c. Subgroup 4 (CINand COUTmeasurements) shall be measured only for the initial test and after process or design changes which may affect capacitance. Sample size is 15 devices, all input and output terminals tested, and no failures. d. Subgroup 12 test is used for grading in part selection at TA=

44、+25C. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition B or D. The test circuit shall be maintained by the manufacturer under document revision level con

45、trol and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,

46、000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microci

47、rcuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to e

48、xisting SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614)