DLA SMD-5962-88752 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL HEX INVERTER MONOLITHIC SILICON.pdf
《DLA SMD-5962-88752 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL HEX INVERTER MONOLITHIC SILICON.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88752 REV D-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL HEX INVERTER MONOLITHIC SILICON.pdf(10页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Technical changes in Table I. Editorial changes throughout. 92-03-09 Michael A. Frye B Update drawing to reflect current requirements. New boilerplate. ljs 00-06-19 Raymond Monnin C Update to reflect latest changes in format and requirements. Edi
2、torial changes throughout. Correct hysteresis limit. - les 03-06-11 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. - gap 09-08-04 Charles F. Saffle The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D D D O
3、F SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Monica L. Poelking DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY Donald Cool
4、 APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, HEX INVERTER, MONOLITHIC SILICON DRAWING APPROVAL DATE 89-01-18 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88752 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E176-09 Provided by IHSNot for ResaleNo reproductio
5、n or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non
6、-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88752 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The
7、 device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F14 Hex inverter Schmitt trigger 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDI
8、P1-T14 or CDIP2-T14 14 Dual-in-line package D GDFP1-F14 or CDFP2-F14 14 Flat package 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range 1/ -0.5 V dc to +7.0 V dc DC input voltage range
9、 -0.5 V dc to +7.0 V dc DC input current range -30 mA to +5.0 mA Voltage applied to output in high output state . -0.5 V to +VCCCurrent applied to output in low output state . 40 mA Storage temperature range -65C to +150C Maximum power dissipation (PD) 2/ . 225 mW Lead temperature (soldering, 10 sec
10、onds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc to 5.5 V dc Maximum input clamp current (IIK) . -18 mA Maximum high level output current (IOH) -1.0 mA Maximum low leve
11、l output current (IOL) . 20 mA Case operating temperature range (TC) -55C to +125C _ 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ Must withstand the added PDdue to short circuit output current test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking pe
12、rmitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, st
13、andards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification
14、for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies o
15、f these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cit
16、ed herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, append
17、ix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML pro
18、duct in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or fun
19、ction of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physica
20、l dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specifie
21、d on figure 2. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply
22、 over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88752 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3
23、.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in
24、 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLASMD596288752REVD2009MICROCIRCUITDIGITALBIPOLARADVANCEDSCHOTTKYTTLHEXINVERTERMONOLITHICSILICONPDF

链接地址:http://www.mydoc123.com/p-699381.html