DLA SMD-5962-88596 REV D-2008 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL BUFFER DRIVER MONOLITHIC SILICON《高级双极数字单硅片微电路 采用小功率肖特基晶体管-晶体管逻辑 带缓冲器 线路驱动器》.pdf

《DLA SMD-5962-88596 REV D-2008 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL BUFFER DRIVER MONOLITHIC SILICON《高级双极数字单硅片微电路 采用小功率肖特基晶体管-晶体管逻辑 带缓冲器 线路驱动器》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-88596 REV D-2008 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED LOW POWER SCHOTTKY TTL BUFFER DRIVER MONOLITHIC SILICON《高级双极数字单硅片微电路 采用小功率肖特基晶体管-晶体管逻辑 带缓冲器 线路驱动器》.pdf（13页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add “Changes in accordance with NOR 5962-R125-94“. 92-09-02 M. L. Poelking B Add device 02. Technical changes in table I. Update boilerplate. Editorial Changes. Removed vendor cage 18324. 94-04-06 M. L. Poelking C Update to reflect latest changes

2、 in format and requirements. Editorial changes throughout. -les 01-01-30 Raymond Monnin D Update drawing to current requirements. Editorial changes throughout. gap 08-07-23 Robert M. Heber The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV D D D D D D D D D

3、D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY Larry T. Gauder DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Raymond Monnin COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Fr

4、ye MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED LOW POWER SCHOTTKY TTL, BUFFER/DRIVER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-05-12 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-88596 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E162-08 Provided by IHSN

5、ot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for

6、 MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88596 01 S X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.

7、3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS241A 1/ Three-state output octal buffers and line drivers 02 54ALS241B Three-state output octal buffers and line drivers 1.2.2 Case outline(s). The case outline(s)

8、 are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style S GDFP2-F20 or CDFP3-F20 20 Flat package 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 2/ Supply voltage . -0.5 V dc to +7

9、.0 V dc Input voltage (VIN) . -1.2 V dc at -18mA to +7.0 V dc Voltage applied to a disable 3-state output . 5.5 V dc Storage temperature range . -65C to +150C Maximum power dissipation (PD) . 176 mW 3/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-S

10、TD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . +4.5 V dc to +5.5 V dc Minimum high-level input voltage (VIH) +2.0 V dc Maximum low level input voltage (VIL): TC= +125C . 0.7 V dc TC= -55C . 0.8 V dc TC= +25C . 0.8 V dc Case operating temper

11、ature range (TC) -55C to +125C _ 1/ Not available from an approved source. 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ Maximum power dissipation is defined as VCCx

12、ICC, and must withstand the added PDdue to short circuit test; e.g., I0S. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET

13、3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the s

14、olicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTME

15、NT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Ph

16、iladelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has b

17、een obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified an

18、d qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the

19、 Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required

20、 to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Te

21、rminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test

22、 circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The elec

23、trical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CEN

24、TER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where mark

25、ing of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A

26、. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved

27、 source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conf

28、ormance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and re

29、view. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection

30、 procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 10

31、15 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power d

32、issipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretio

33、n of the manufacturer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical perform

34、ance characteristics. Test Symbol Conditions 1/ -55C TC+125C Device type Group A subgroups Limits Unit unless otherwise specified Min Max High level output voltage VOHIOH= -0.4 mA All 1, 2, 3 2.5 V OH= -3 mA All 2.4 VCC= +4.5 V, VIH= +2.0 V, VILat: 2/ -55C = 0.8 V, +25C = 0.8 V, +125C = 0.7 V IOH= -

35、12 mA All 2.0 Low level output voltage VOLIOH= +12 mA VCC= +4.5 V, VIH= +2.0 V 2/ VILat: -55C = 0.8 V, +25C = 0.8 V, +125C = 0.7 V All 1, 2, 3 0.4 V Input clamp voltage VICIIN= -18 mA, VCC= +4.5 V All 1, 2, 3 -1.2 V Off-state output current IOZHVCC= +5.5 V, VIH= +2.0 V, VOUT= +2.7 V All 1, 2, 3 20 A

36、 IOZLVCC= +5.5 V, VIH= +2.0 V, VOUT= +0.4 V All 1, 2, 3 -20 High level input current IIH1VCC= +5.5 V, VIN= +2.7 V All other inputs = 0.0 V All 1, 2, 3 20 A IIH2VCC= +5.5 V, VIN= +7.0 V All other inputs = 0.0 V All 1, 2, 3 0.1 mA Low level input current IILVCC= +5.5 V, VIN= 0.4 V, All other inputs 4.

37、5 V All 1, 2, 3 -0.1 mA Output current IOVCC= +5.5 V, VOUT= 2.25 V 3/ All 1, 2, 3 -20 -112 mA Supply current ICCHVCC= +5.5 V Outputs high All 1, 2, 3 17 mA ICCLOutputs low All 28 CCZOutputs disabled All 32 Functional tests See 4.3.1c 4/ All 7, 8 See footnotes at end of table. Provided by IHSNot for

38、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol

39、Conditions -55C TC+125C Device type Group A subgroups Limits Unit unless otherwise specified Min Max tPLH All 9, 10, 11 3 13 ns 01 1 11.5 Propagation delay time, A to Y tPHL 02 9, 10, 11 1 17 ns 01 5 21 tPZH1 02 9, 10, 11 3 21 ns 01 7 21 Output enable time, 1 Gto Y tPZL1 02 9, 10, 11 3 21 ns 01 2 10

40、 tPHZ1 02 9, 10, 11 2 17 ns Output disable time, 1 Gto Y tPLZ1 All 9, 10, 11 2 22 ns 01 7 24 tPZH2 02 9, 10, 11 3 24 ns 01 7 22 Output enable time, 2G to Y tPZL2 02 9, 10, 11 3 22 ns tPHZ2 All 9, 10, 11 2 12 ns Output disable time, 2G to Y tPLZ2 VCC= 4.5 V to 5.5 V, CL= 50 pF, 5/ RL1= 500 5%, RL2= 5

41、00 5%, See figure 4 All 9, 10, 11 5 25 ns 1/ Unused inputs that do not directly control the pin under test must be 2.5 V or 0.4 V. No unused inputs shall exceed 5.5 V or go less than 0.0 V. No input shall be floated. 2/ All outputs must be tested. In the case where only one input at VILmaximum or VI

42、Hminimum produces the proper output state, the test must be performed with each input being selected as the VILmaximum or VIHminimum input. 3/ The output conditions have been chosen to produce a current that closely approximates on half of the true short circuit output current, IOS. Not more than on

43、e output shall be tested at one time, and the duration of the test condition shall not exceed one second. 4/ Function tests shall be conducted at input test conditions of GND VIL VOLand VOH VIH VCC. 5/ Propagation delay limits are base on single output switching. Unused inputs = 3.5 V or 0.3 V. Prov

44、ided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 Device types 01 and 02 Case outline S Terminal number

45、Terminal symbol 1 G 2 1A1 3 2Y4 4 1A2 5 2Y3 6 1A3 7 2Y2 8 1A4 9 2Y1 10 GND 11 2A1 12 1Y4 13 2A2 14 1Y3 15 2A3 16 1Y2 17 2A4 18 1Y1 19 2G 20 VCCFIGURE 1. Terminal connections. Inputs Output Inputs Output 1 G 1A 1Y 2G 2A 2Y H X Z L X Z L L L H L L L H H H H H FIGURE 2. Truth table. Provided by IHSNot

46、for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction

47、 or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 FIGURE 4. Switching waveforms and test circuit . Provided by IHSNot for ResaleNo reproduction

48、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88596 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 10 DSCC FORM 2234 APR 97 NOTES: 1. CLincludes probe and jig capacitance. 2. When measuring propagation delay times of three-state outputs, switch S1 is open. 3. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the outpu