DLA SMD-5962-88583 REV B-2006 MICROCIRCUIT LINEAR BIPOLAR HEX NTDS FAST DRIVER MONOLITHIC SILICON《硅单片双极十六进制NTDS快速驱动器线性微电路》.pdf

《DLA SMD-5962-88583 REV B-2006 MICROCIRCUIT LINEAR BIPOLAR HEX NTDS FAST DRIVER MONOLITHIC SILICON《硅单片双极十六进制NTDS快速驱动器线性微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-88583 REV B-2006 MICROCIRCUIT LINEAR BIPOLAR HEX NTDS FAST DRIVER MONOLITHIC SILICON《硅单片双极十六进制NTDS快速驱动器线性微电路》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Drawing updated to reflect current requirements. Editorial changes throughout. drw 01-07-26 Raymond Monnin B Updated to current requirements. 5 year review. drw 06-12-21 Raymond Monnin THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. RE

2、V SHET REV SHET REV STATUS REV B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY Charles E. Besore DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY AL

3、L DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT LINEAR, BIPOLAR, HEX NTDS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 89-08-28 FAST DRIVER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-88583 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E165-07 Provi

4、ded by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requi

5、rements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-88583 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead fini

6、sh(see 1.2.3)1.2.1 Device type. The device type identifies the circuit function as follows: Device type Generic number Circuit function 01 MOF1305D Hex NTDS fast driver 1/ 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows: Outline letter Descriptive designator Termi

7、nals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Positive supply voltage (V+) +7.0 V dc Negative

8、 supply voltage (V-) -7.0 V dc Input voltage range -0.5 V dc to +5.5 V dc Power dissipation (PD) . 500 mW 2/ Storage temperature range -65C to +150C Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended

9、operating conditions. Positive supply voltage range (V+) +4.5 V dc to +5.5 V dc Negative supply voltage range (V-) -4.5 V dc to -5.5 V dc Ambient operating temperature range (TA) -55C to +125C Maximum low level (VIL). 0.4 V dc Minimum high level (VIH) 2.4 V dc _ 1/ This circuit was designed to be co

10、mpatible with Naval Tactical Data System (NTDS) of MIL-STD-1397 “Standard Digital Navy Systems, Input-Output Interfaces”, interfacing between TTL logic levels and those employed in Navy computers. The applicable specifications are specified in this drawing. 2/ Derate linearly above TA= +90C, 8.33 mW

11、/C. Must withstand the added PDdue to short circuit test; e.g., IOS, for a maximum 10 ms. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO

12、N LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are thos

13、e cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Ou

14、tlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Or

15、der Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and

16、regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qual

17、ified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-

18、PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark

19、 in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall

20、 be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the

21、full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The

22、part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certificati

23、on/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used.

24、 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics.

25、Test Symbol Conditions -55C TA +125C V+ = 4.5 V to 5.5 V V- = -4.5 V to -5.5 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max Positive supply current I+ VIN= 2.4 V, no load 1, 2, 3 All 40 mA VIN= 0 V, no load 40 Negative supply current I- VIN= 2.4 V, no load 1, 2, 3 All

26、 -55 mA VIN= 0 V, no load -40 Output high voltage VOHVIN= 2.0 V, IOL= -10 mA 1, 2, 3 All -0.5 0 V Output low voltage VOLVIN= 0.8 V, IOL= 10 mA 1, 2, 3 All -3.0 V Input low current IILVIN= 0.4 V 1, 2, 3 All -1.6 mA Input high current IIHVIN= 2.4 V 1, 2, 3 All 40 A Input leakage current IIHHVIN= 5.5 V

27、 1, 2, 3 All 100 A Output off current IOFFV+ = 0 V, V- = 0 V, VO= -7 V, see figure 2 1, 2, 3 All -70 A Output short circuit current IOSVIN= 0.4 V, VO= 0 V 1, 2, 3 All 300 mA Propagation delay time, low to high tPLHSee figure 3 9 All 200 ns 10, 11 1/ 250 Propagation delay time, high to low tPHLSee fi

28、gure 3 9 All 200 ns 10, 11 1/ 250 1/ Guaranteed, if not tested, to the limits specified. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION

29、 LEVEL B SHEET 5 DSCC FORM 2234 APR 97 Device type All Case outline E and F 2 Terminal number Terminal symbol 1 NC NC 2 IN A NC 3 OUT A IN A 4 IN B OUT A 5 OUT B IN B 6 IN C NC 7 OUT C OUT B 8 GND IN C 9 V- OUTC 10 OUT D GND 11 IN D NC 12 OUT E V- 13 IN E OUT D 14 OUT F IN D 15 IN F OUT E 16 V+ NC 1

30、7 - - - IN E 18 - - - OUT F 19 - - - IN F 20 - - - V+ FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LE

31、VEL B SHEET 6 DSCC FORM 2234 APR 97 FIGURE 2. IOFFtest circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 7 DSCC FOR

32、M 2234 APR 97 AC waveforms AC test circuit FIGURE 3. AC waveforms and test circuit. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVE

33、L B SHEET 8 DSCC FORM 2234 APR 97 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approve

34、d source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits deliv

35、ered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required do

36、cumentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 o

37、f MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition C. The test circuit shall be maintained by the manufacturer under document revision level contr

38、ol and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final el

39、ectrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 50

40、05, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and

41、11, if not tested, shall be guaranteed to the limits in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-88583 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 9 DSCC FO

42、RM 2234 APR 97 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II he

43、rein. b. Subgroups 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition C. The test c

44、ircuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specif

45、ied in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Micr

46、ocircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specif

47、ication or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial

48、 users shall inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.6 Approved sources of supply. Ap