DLA SMD-5962-88510 REV B-1998 MICROCIRCUIT HYBRID LINEAR QUAD 12-BIT DIGITAL-TO-ANALOG CONVERTER《数位类比转换器12位四方混合动力线性微电路》.pdf
《DLA SMD-5962-88510 REV B-1998 MICROCIRCUIT HYBRID LINEAR QUAD 12-BIT DIGITAL-TO-ANALOG CONVERTER《数位类比转换器12位四方混合动力线性微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-88510 REV B-1998 MICROCIRCUIT HYBRID LINEAR QUAD 12-BIT DIGITAL-TO-ANALOG CONVERTER《数位类比转换器12位四方混合动力线性微电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、LT R A B REV SHEET REV SHEET DATE (YR-MO-DA) APPROVED 9 1 -04-22 W. Heckman 98-01 -1 5 DESCRIPTION Made corrections to table I and figure 1. Changed drawing to reflect MIL-H-38534 processina. Editorial changes throuahout. Correct IEE and ICC limits. Change to reflect MIL-PRF-38534 processina. Editor
2、ial chanaes throuahout. K. A. Cotongim REV STATUS OF SHEETS I REV I PMICNIA BBB STANDARD MICROCIRCUIT DRAWING THIS DRAWM IS AVAUBLE I FOR USE BY ALL DEPARTMENTS AND AGENCES OF THE DEPARTEENT OF DEFENSE AMSC NA SE A 596298851 O CAGE CODE 67268 SHEET 111213 PREPARED BY Donald R. Osborne CHECKED BY Ray
3、 hnin APPROVED BY Mchael Frye DRAWING APPROVAL DATE 88-07-06 REVISON LEML 0 DEFENSE SUPPLY CENTER COLUMBUS P. O. BOX 3990 COLUMBUS, OHIO 43216-5000 MICROCIRCUIT, HYBRID, LINEAR, QUAD, 12-BlT, DIGITAL-TO-ANALOG CONVERTER SHEET 1 OF 12 DSCC FORM 2233 APR 97 Approved for public release; distribution is
4、 unlimited. 5962-E 141 -98 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-885LO REV B 9999996 OL20b29 8TL 1. SCOPE 1.1 Sape. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with MIL-
5、PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). 1.2 ?lN. The PIN shall be as shown in the following example: T Drawing number 4L Device type f Case outline f Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Devic
6、e . The device type(s) shall identify the circuit function as follows: Device o1 02 03 04 AD394s AD394T AD395s 1/ AD395T 1/ Quad 12 bit DAC (bipolar) Quad 12 bit DAC (bipolar) Quad 12 bit DAC (unipolar) Quad 12 bit DAC (unipolar) 1.2.2 Case outline(sl . The case outline(s) shall be as designated in
7、MIL-STD-1835 and as follows: Temiinals - X See figure 1 28 Dual-in-line 1.2.3 1.3 * -21 . The lead finish shall be as specified in MIL-PRF-38534. +Vs to DGND . Digital inputs (pins 1 through 16) to DGND . VREFIN to AGNP . AGND to DGND Outputs (pins 18,21,24, and 27): Shorted to AGND or DGND Shortedt
8、odls Storage temperature range . Lead temperature (soldering, 1 O seconds) Junction temperature (TJ) Thermal resistance, junction-to-case (QJC) . Thermal resistance, junction-to-ambient (8JA) . -VS to DGND -0.3 v dc to +17 v dc +0.3 Vdc to -17 V dc -0.3 V dc to +7 V dc +25 V dc Io.6 V dc Indefinite
9、Momentary +300 C +175C 8 CMI 25 CMI -65 C to + 150 C 1.4 ecomnded 0D-a condi-. IV to DGND 115Vdc110% VREFIN to AGND . +lOVdc Ambient operating temperature range (TA) . -55 C to +125“ C 1/ 2/ These generic numbers are inactive for new design. Stresses above the absolute maximum rating may cause perma
10、nent damage to the device. Extended operation at the maximurn levels may degrade performance and affect reliability. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 432165000 SIZE A I 5962-8851 O I SHEET REVISION LEVEL B DSCC FORM 2234 APR 97 Provided by IHSNot for Resale
11、No reproduction or networking permitted without license from IHS-,-,-SND-5962-88510 REV B W 9999996 OL20b30 5L3 W 2. APPLICABLE DOCUMENTS . 2.1 Governm The following specification, standards, and handbook form a part of this drawing to the extent specified herein. Unless otherwise specified, the iss
12、ues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. I STANDARDS DEPARTMEN
13、T OF DEFENSE MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-973 - Configuration Management. MIL-STD-1835 - Microcircuit Case Outlines. HANDBOOK DEPARTMENT OF DEFENSE MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, stan
14、dards, and handbook are available from the Standardization I Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191 11-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes prece
15、dence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. I 3. REQUIREMENTS 3.1 . The individual item performance requirements for device class H shall be in accordance with MIL-PRF- 38534. Compliance with MIL-PRF-38534 may in
16、clude the performance of all tests herein or as designated in the device manufacturer?s Quality Management (QM) plan or as designated for the applicable device class. Therefore, the tests and inspections herein may not be performed for the applicable device class (see MIL-PRF-38534). Futhermore, the
17、 manufacturers may take exceptions or use alternate methods to the tests and inspections herein and not perform them. However, the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. 3.2 Desian. construction. arertificate of c- . A certificate of compli
18、ance shall be required from a manufacturer in order to supply to this Irawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufactureis product meets he performance requirements of MIL-PRF-38534 and herein. 3.8 Certificat of confm . A certificate of conf
19、ormance as required in MIL-PRF-38534 shall be provided with each lot of nicrocircuits delivered to this drawing. 4. QUALiTY ASSURANCE PROVISIONS 4.1 n the device manufactureis Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or unction as described herein
20、. . Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified 4.2 Scree-. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. Bum-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circu
21、it shall be maintained by the manufacturer under document revision level control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent
22、 specified in test method 1 O1 5 of MIL-STD-883. (2) TA as Specified in accordance with table I of method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tesk prior to bum-in are optional at the discre
23、tion of the manufacturer. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 5962-8851 O DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-88510 REV B m 999999b 0320632 3b m TABLE I. El
24、ectrical Derformance cmristics. Test I nput voltage high Input voltage low Input current high Input current low Output voltage range Gain error Gain error temperature coeffuent Offset error Offset temperature coefficient See footnotes at end of i 000000000000 External +10.000 V ref BC= 111111111111
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- DLASMD596288510REVB1998MICROCIRCUITHYBRIDLINEARQUAD12BITDIGITALTOANALOGCONVERTER 数位 类比 转换器 12 四方 混合 动力

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