DLA SMD-5962-87681 REV M-2012 MICROCIRCUIT LINEAR HIGH SPEED PULSE WIDTH MODULATOR CONTROLLER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Page 4, table I; delete temperature stability test. Add long term stability test. Electrical changes throughout table I. Editorial changes throughout. 88-11-09 M. A. FRYE B Add case outline 2. Add vendor CAGE 34333. Make corrections to load regul
2、ation and output voltage test conditions. Also correct short-circuit current, output source current, and RAMP bias current test limits. Change RAMP voltage-valley and RAMP voltage-valley to peak, delay to output, and charge current test limits. Editorial changes throughout. 90-05-29 M. A. FRYE C Add
3、 device types 02 and 03. Editorial changes throughout. 94-05-03 M. A. FRYE D Paragraph 1.2.2, case outline X, change descriptive designator from “CQCC2-N28B” to “CQCC1-N28B”. Table I: Input offset voltage test, VOS, change minimum limit from “-10 mV” to “-15 mV” and change maximum limit from “+10 mV
4、” to “+15 mV”. Table I: start threshold, VSTART, fro device type 01, change maximum limit from “+9.6 V” to “+9.7 V”. Changes in accordance with N.O.R. 5962-R196-94. 94-06-02 M. A. FRYE E Terminal connections, add case outline 2 to device types 02 and 03. Changes in accordance with N.O.R. 5962-R202-9
5、5. 95-10-05 M. A. FRYE F Table I, start up current test, ISTART; for the max value of “0.3” add “02, 03” in device type column. Changes in accordance with N.O.R. 5962-R160-97. 97-01-07 R. MONNIN G Add device class V devices. Redrawn. - ro 00-06-08 R. MONNIN H Add case outline “F”. Make correction to
6、 the VOH1test condition under the Error amplifier section as specified in table I. - ro 02-07-19 R. MONNIN J Drawing updated to reflect current requirements. - ro 07-11-14 R. HEBER K Add device types 04 and 05. -rrp 08-12-03 R. HEBER L Under Table I; output source current test, move the -0.5 mA limi
7、t from the min column to the max column, ILIMdelay to output test, add footnote 2/. Update boilerplate paragraphs to current MIL-PRF-38535 requirements. - ro 10-11-30 C. SAFFLE M Add temperature stability test to Table I for device type 04. - ro 12-09-07 C. SAFFLE REV SHEET REV M M M SHEET 15 16 17
8、REV STATUS REV M M M M M M M M M M M M M M OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY MARCIA B. KELLEHER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND
9、 AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY ROBERT R. EVANS APPROVED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, HIGH SPEED PULSE WIDTH MODULATOR CONTROLLER, MONOLITHIC SILICON DRAWING APPROVAL DATE 88-02-09 AMSC N/A REVISION LEVEL M SIZE A CAGE CODE 67268 5962-87681 SHEET 1 OF 17 DSCC FORM 2233
10、APR 97 5962-E449-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87681 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing docume
11、nts two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness A
12、ssurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - 87681 01 E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / / Drawing number
13、 For device class V: 5962 - 87681 01 V E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet th
14、e MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The devi
15、ce type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 1825 High speed PWM controller 02 1825A High speed PWM controller 03 1825B High speed PWM controller 04 1825-SP High speed PWM controller 05 1825A-SP High speed PWM controller 1.2.3 Device class desig
16、nator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on th
17、e device. Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo
18、 reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87681 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL M SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: O
19、utline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack X CQCC1-N28B 28 Square leadless chip carrier with thermal pads 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in
20、 MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC): Device types 01 and 04 . 30 V dc Device types 02, 03, and 05 22 V dc DC output current, source or sink . 0.5 A Pulse output current, source or sink (0.5 s
21、): Device types 01, 02, 03, and 04 2.0 A Device type 05 . 2.2 A Analog input voltage: NONINVERTING, INVERTING, and RAMP pins . -0.3 V dc to 7.0 V dc SOFT START and CURRENT LIMIT / SD pins . -0.3 V dc to 6.0 V dc Power ground: Device type 05 . 0.2 V Clock output current -5.0 mA Error amplifier output
22、 current 5.0 mA Soft start sink current 20 mA Oscillator charging current -5.0 mA Power dissipation (PD) (all packages) . 1.0 W 2/ 3/ Storage temperature range . -65C to +150C Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC) .
23、 See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range: Device types 01 and 04 . 10 V dc to 30 V dc Device types 02, 03, and 05 12 V dc to 22 V dc Sink/source output current (continuous or time average): Device types 04 and 05 . 0 mA to 100 mA Reference load current: Device typ
24、es 04 and 05 . 0 mA to 10 mA Ambient operating temperature range (TA) . -55C to +125C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ For case outline E, derate linea
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