DLA SMD-5962-86879 REV D-2002 MICROCIRCUIT LINEAR BUS INTERFACE DRIVER CIRCUIT MONOLITHIC SILICON《硅单块 总线界面激励电路直线式微型电路》.pdf
《DLA SMD-5962-86879 REV D-2002 MICROCIRCUIT LINEAR BUS INTERFACE DRIVER CIRCUIT MONOLITHIC SILICON《硅单块 总线界面激励电路直线式微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-86879 REV D-2002 MICROCIRCUIT LINEAR BUS INTERFACE DRIVER CIRCUIT MONOLITHIC SILICON《硅单块 总线界面激励电路直线式微型电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make changes to paragraphs 1.3, 4.3.1c, table I, and figure 3. Make editorial changes throughout. 89-01-30 M. A. FRYE B Add one vendor, CAGE 07933. Make changes to table I and editorial changes throughout. Remove vendor CAGE 34371. Device 013X is
2、 not available from an approved source of supply. 90-05-30 M. A. FRYE C Changes in accordance with N.O.R. 5962-R013-91. 91-09-27 M. A. FRYE D Drawing updated to reflect current requirements. - ro 02-07-08 R. MONNIN THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STA
3、TUS REV D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 PMIC N/A PREPARED BY DONALD R. OSBORNE DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY RAY MONNIN COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROV
4、ED BY MICHAEL A. FRYE MICROCIRCUIT, LINEAR, BUS INTERFACE DRIVER CIRCUIT, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 88-05-05 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-86879 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E375-02 DISTRIBUTION STATEMENT A.
5、 Approved for public release; distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86879 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 2 DSCC FORM 2234 A
6、PR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86879 01 E X Drawing num
7、ber Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 HS-3182, HI-8382 Bus interface line driver circuit 1.2.2 Case outline(s). The case outline(s)
8、 are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum
9、ratings. V+ minus V- (differential voltage) . 40 V dc V17 V dc VREF6 V dc Logic input voltage range . (GND - 0.3 V) to (V1+ 0.3 V) Maximum power dissipation (PD): Case E 1.725 W 1/ Case 3 1.12 W 1/ Junction temperature (TJ) +175C Lead temperature (soldering, 10 seconds) +275C Storage temperature ran
10、ge -65C to +150C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case E 86.5C/W Case 3 133.7C/W _ 1/ Derate above +25C, 11.5 mW/C for case E, and 7.5 mW/C for case 3. Provided by IHSNot for ResaleNo reproduction or networking permitted without
11、 license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86879 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. 2/ Supply voltage: V+ 15 V dc 10% V- -15 V dc 10% V15 V dc 5% VREF5 V dc 5% Ambient oper
12、ating temperature range (TA) -55C to +125C Maximum load: Data rate at 12.5 KBPS: RL= 800 , CL= 30 nF; RL= 400 , CL= 6.9 nF. Data rate at 100 KBPS: RL= 800 , CL= 4 nF. 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks
13、 form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT
14、 OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of St
15、andard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of prec
16、edence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. _ 2/ All voltages referenced to
17、 GND Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86879 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The in
18、dividual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been gra
19、nted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the
20、 requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design,
21、construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as sp
22、ecified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specif
23、ied in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accorda
24、nce with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manu
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