DLA SMD-5962-86853 REV B-2008 MICROCIRCUIT DIGITAL HIGH SPEED CMOS DUAL D-TYPE FLIP-FLOP WlTH PRESET AND CLEAR WlTH LS TTL COMPATIBLE INPUTS MONOLlTHlC SILICON.pdf

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1、CURRENT CAGE CODE 67268 REVISIONS I Greg A. Pitz I DEFENSE SUPPLY CENTER COLUMBUS LTR A B AMSC NIA DESCRIPTION Update boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. - LTG Update boilerplate to MIL-PRF-38535 requirements. - LTG STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS A

2、VAllABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE I REVISION LEVEL SHEET 1 OF 10 DSCC FORM 2233 DATE (YR-MO-DA) 03-04-09 08-11-14 CHECKED BY D. A. DiCenzo APPROVED BY N. A. Hauck DRAWING APPROVAL DATE 86-1 1-07 APR 97 5962-E027-09 APPROVED Thomas M. Hess Thomas M. Hess CO

3、LUMBUS, OHIO 4321 8-3990 http:llwww.dscc.dla.mil MICROCIRCUIT, DIGITAL, HIGH SPEED CMOS, DUAL D-TYPE FLIP-FLOP WlTH PRESET AND CLEAR WlTH LS TTL COMPATIBLE INPUTS, MONOLlTHlC SILICON Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-USCC FUKM ZZ54 I AP

4、R 97 I. SCOPE 1 .I Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or ldentifvin Number (PIN). The complete PIN is as shown in the following example: 5962-r3 Bi Drawing number Devi

5、ce type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device tvpefs). The device type(s) identify the circuit function as follows: Device tvpe Generic number Circuit function 0 1 CD54HCT74 Dual D-type flip-flop with preset and clear with LS TTL compatible inputs 1.2.2 Case outli

6、nefs). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Packaae stvle C GDIPI-TI4 or CDIP2-TI4 14 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 11 Supply

7、 voltage range (Vcc) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC + 0.5 V dc . DC output voltage range (VOUT) -0.5 V dc to VCC + 0.5 V dc . Clamp diode current +20 mA DC output current (per pin) +25 mA . DC Vcc or GND current (per pin) +50 mA Storage temperature range (TSTG)

8、. -65OC to +150C Maximum power dissipation (PD) 21 . 500 mW Lead temperature (soldering 10 seconds) . 260C Thermal resistance, junction-to-case (QJc) . See MIL-STD-1835 Junction temperature (TJ) 175OC 11 Unless otherwise specified, all voltages are referenced to ground. - 21 For Tc = +lOOC to +125OC

9、, derate linearly at 12 mWI0C. - STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 - - -. . me-. SIZE A REVISION LEVEL B 5962-86853 SHEET 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-I UYLL tUKM LL.54 APR 97

10、I 1.4 Recommended oeratincl conditions. Supply voltage range (Vcc) . +4.5 V dc to +5.5 V dc Case operating temperature range (Tc) . -55C to +125“C Input rise or fall time: Vcc = 4.5 V . 0 to 500 ns Minimum setup time, data to clock? (tSHL1, fSLHI): vcc = 4.5 v: Tc = 25C 20 ns Tc = -55OC/+1250C 30 ns

11、 Minimum setup time, preset or clear to clock T (tSHL2): vcc = 4.5 v: . Tc = 25C 20 ns . Tc = -55C1+1250C 30 ns Minimum width of clock, preset or clear pulse (tw): vcc = 4.5 v: Tc = 25C 20 ns . Tc = -55OC1+1250C 30 ns Minimum hold time, clock to data (tHHL) (tHLH): vcc = 4.5 v: Tc = 25C 3.0 ns Tc =

12、-55“C/+125“C 3.0 ns Maximum clock frequency (fMAx): vcc = 4.5 v: Tc = 25C . 25 MHz Tc = -55“C1+125“C 16 MHz 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein

13、. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENTOFDEFENSESTANDARDS MIL-STD-883 - Test Method Standard Microcircuit

14、s. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:l/assist.daps.dla.mil/quicksearch/ or

15、 from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 191 11-5094.) 2.2 Order of recedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, how

16、ever, supersedes applicable laws and regulations unless a specific exemption has been obtained. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 - -.a *A. SIZE A REVISION LEVEL B 5962-86853 SHEET 3 Provided by IHSNot for ResaleNo reproduction or networking permi

17、tted without license from IHS-,-,-DSLL tUKM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non- JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualif

18、ied Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PR

19、F-38535. This QML flow.as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark i

20、n accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Desian, construction, and phvsical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) sha

21、ll be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Loaic diaaram. The logic diagram shall be as specified on figure 3. 3.2.5 Timina waveforms. The t

22、iming waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. T

23、he electrical test requirements shall be the subgroups specified in table 11. The electrical tests for each subgroup are described in table I. 3.5 Markinq. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manu

24、facturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certificationlcomliance mark. A compliance indicator “C“ shall be marked on all non-JAN

25、devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C“ shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required

26、from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendi

27、x A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of chanae. Notification of change to DSCC-VA shall be required for any c

28、hange that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. STANDARD MIC

29、ROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 - - . - . SIZE A REVISION LEVEL B 5962-86853 SHEET 4 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-Provided by IHSNot for ResaleNo reproduction or networking permitted witho

30、ut license from IHS-,-,-Device type 0 1 Case outline C Terminal number Terminal symbol - 1 1 CLR 2 1 D 3 1 CP 4 IPRE 5 1 Q 6 IT 7 GLD 8 2Q 9 2Q 10 2PRE 11 2CP 12 - 2D 13 2CLR 14 Vcc FIGURE 1. Terminal connections FIGURE 2. Truth table. I H = High voltage level L = Low voltage level X = Irrelevant ?

31、= Low-to-high transition QO = The level of Q before the indicated input conditions were established = This configuration is nonstable; that is, it will not persist when preset and clear inputs return to their inactive (high) level. UYLL tUKlVI LL54 APR 97 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY

32、 CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 - -.a m,.-. SIZE A REVISION LEVEL B 5962-86853 SHEET 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEVICE TYPE 01 UYLL UKIVI LLar APR 97 FIGURE 3. Loalc daaram STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPL

33、Y CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 - .-.a mmm* SIZE A REVISION LEVEL B 5962-86853 SHEET 7 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-FOR fmax,INPUT DUTY CYCLE = 50%. tf=6 ns -* t, C / 3.0 v / 2.7 v / 1.3 v - / 0.3 v GND - HHL L a HLH C

34、3.0 v 1.3 v GND - - SHLI OUTPUT VOL -C SHLZ 3.0 v PRESET 1.3 V GND Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-USCC I-VKM 2294 APR 97 MI L-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electric

35、al parameters 1 (method 5004) Final electrical test parameters I*, 2, 3, 9 (method 5004) Group A test requirements (method 5005) Groups C and D end-point electrical parameters (method 5005) 4. VERIFICATION 4.1 Samlina and inspection. Sampling and inspection procedures shall be in accordance with MIL

36、-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B,

37、 C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance wi

38、th the intent specified in method 101 5 of MIL-STD-883. (2) TA = +125OC, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electri

39、cal test requirements. * PDA applies to subgroup 1. 4.3 Qualitv conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests

40、 shall be as specified in table II herein. b. Subgroups 5,6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 4 (GIN measurement) shall be measured only for the initial test and after process or design changes which may affect input capacitance. d. subgroup 7 shall include

41、verification of the truth table. 1,2,3,4,7,9,10,11 1,2, 3 5962-86853 SHEET 9 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 - - - - - - -. . - - . SIZE A REVISION LEVEL B Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

42、 IHS-,-,-DSCC FUKM ZZY4 APR 97 4.3.2 Grous C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer un

43、der document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA = +125“

44、C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaclina reauirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are inten

45、ded for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Relaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor- prepared specification or drawing. 6.3 Conficluration control

46、 of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users should inform Defense Supply Center Co

47、lumbus (DSCC) when a system application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronics devices (FSC 5962) should contact D

48、SCC-VA, telephone (614) 692-0544. 6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 4321 8-3990, or telephone (61 4) 692-0547. 6.6 Approved sources of suplv. Approved sources of supply are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 - - - - -. . - . SIZE A REVISION LEVEL B 5962-86853 SHEET 10 Provided by IHSNot fo