DLA SMD-5962-86062 REV E-2012 MICROCIRCUIT DIGITAL HIGH-SPEED CMOS OCTAL INVERTING D-TYPE LATCH WITH THREE-STATE OUTPUTS MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add vendor CAGE 01295 to case outlines R and 2. Add vendor CAGE 27014 to case outline 2. 87-09-23 M. A. Frye B Change CAGE code to 67268. Add case outline S to drawing. Add vendor CAGE 01295 to case outline S. Remove vendor CAGE 04713 from drawin
2、g. Editorial changes to table I. Editorial changes throughout. 89-07-24 M. A. Frye C Update boilerplate to MIL-PRF-38535 requirements. jak 01-12-04 Thomas M. Hess D Update boilerplate to MIL-PRF-38535 requirements. - LTG 07-11-28 Thomas M. Hess E Correct VOHand VOLtest condition IOin table I. Update
3、 boilerplate to MIL-PRF-38535 requirements. - jak 12-12-14 Thomas M. Hess Current CAGE CODE is 67268 REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY Greg a. Pitz DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.
4、landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Nelson A. Hauck MICROCIRCUIT, DIGITAL, HIGH-SPEED CMOS, OCTAL INVERTING D-TYPE LATCH WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON AND AGENCIES OF THE DEPART
5、MENT OF DEFENSE DRAWING APPROVAL DATE 86-07-17 AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 5962-86062 SHEET 1 OF 13 DSCC FORM 2233 APR 97 5962-E105-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-8606
6、2 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number
7、(PIN). The complete PIN is as shown in the following example: 5962-86062 01 R A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54
8、HC563 Octal inverting D-type latch with three-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line S GDFP2-F20 or CDFP3-F20 20 Flat pack 2 CQCC
9、1-N20 20 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86062 DLA LAND AND MARITIME COLUMBUS, OHI
10、O 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range -0.5 V dc to VCC+0.5 V dc DC output voltage range -0.5 V dc to VCC+0.5 V dc DC input diode current . 20 mA DC output diode current. 20
11、 mA DC output current (per pin) 35 mA DC VCCor GND current (per pin) . 70 mA Maximum power dissipation (PD) . 500 mW 2/ Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 Junction temperature (TJ) . +175C Storage temperature range (TSTG) . -65C
12、 to +150C 1.4 Recommended operating conditions. Supply voltage range (VCC) +2.0 V dc to +6.0 V dc Case operating temperature range (TC) -55C to +125C Input rise or fall time: VCC= 2.0 V 0 to 1000 ns VCC= 4.5 V 0 to 500 ns VCC= 6.0 V 0 to 400 ns Minimum setup time (tS): TC= +25C: VCC= 2.0 V 75 ns VCC
13、= 4.5 V 15 ns VCC= 6.0 V 13 ns TC= -55C/+125C: VCC= 2.0 V 110 ns VCC= 4.5 V 22 ns VCC= 6.0 V 19 ns Minimum hold time (th): TC= +25C: VCC= 2.0 V 50 ns VCC= 4.5 V 10 ns VCC= 6.0 V 9 ns TC= -55C/+125C: VCC= 2.0 V 75 ns VCC= 4.5 V 15 ns VCC= 6.0 V 13 ns Minimum pulse width (tW): TC= +25C: VCC= 2.0 V 80
14、ns VCC= 4.5 V 16 ns VCC= 6.0 V 14 ns TC= -55C/+125C: VCC= 2.0 V 120 ns VCC= 4.5 V 24 ns VCC= 6.0 V 20 ns 1/ Unless otherwise specified, all voltages are referenced to ground. 2/ For TC= +100C to +125C, derate linearly at 12 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted w
15、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86062 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handb
16、ooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF
17、 DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents
18、are available online at https:/assist.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
19、 this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class
20、 level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance wit
21、h the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. T
22、hese modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
23、as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 L
24、ogic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROC
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