DLA SMD-5962-86054 REV A-2005 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVER MONOLITHIC SILICON《硅单块 电致发光的列驱动器 直线型微型电路》.pdf
《DLA SMD-5962-86054 REV A-2005 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVER MONOLITHIC SILICON《硅单块 电致发光的列驱动器 直线型微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-86054 REV A-2005 MICROCIRCUIT LINEAR ELECTROLUMINESCENT ROW DRIVER MONOLITHIC SILICON《硅单块 电致发光的列驱动器 直线型微型电路》.pdf(13页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Update drawing to current requirements. Editorial changes throughout. - drw 05-07-19 Raymond Monnin THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7
2、 8 9 10 11 12 PMIC N/A PREPARED BY Rick C. Officer DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, LINEAR, ELECTRO
3、LUMINESCENT ROW DRIVER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 92-01-02 MONOLITHIC SILICON AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-86054 SHEET 1 OF 12 DSCC FORM 2233 APR 97 5962-E381-05 Provided by IHSNot for ResaleNo reproduction or networking permitted withou
4、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits
5、 in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-86054 01 X A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit
6、 function as follows: Device type Generic number Circuit function 01 55551 Electroluminescent row driver (see figures 1 and 5) 02 55552 Electroluminescent row driver (see figures 1 and 5) 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descript
7、ive designator Terminals Package style X CQCC1-N44 44 Square leadless chip carrier Y CQCC2-J44 44 Square J-lead chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage (VCC) 18 V dc Input voltage -0.3 V dc to VCC+
8、0.3 V dc Q off state output voltage. 225 V Common terminal current (pulsed mode). 1.5 mA Storage temperature -65C to +150C Lead temperature (soldering, 10 seconds) +300C Power dissipation (PD) . 1475 mW 2/ Junction temperature (TJ) 150C Thermal resistance, junction-to-case (JC). See MIL-STD-1835 1.4
9、 Recommended operating conditions. Supply voltage (VCC) 10.8 V dc to 13.2 V dc High level input voltage: VCC= 10.8 V. 8.1 V dc minimum VCC= 13.2 V. 9.9 V dc minimum Low level input voltage: VCC= 10.8 V. 2.7 V dc minimum VCC= 13.2 V. 3.3 V dc minimum Clock frequency (fCLK) (TA= +25C). 6.25 MHz Ambien
10、t operating temperature range (TA) -55C to +125C _ 1/ All voltages are referenced to GND terminal. 2/ 1475 mW for operation between -55C to +25C. For operating above +25C free-air temperature, derate linearly at 14.6 mW/C.Provided by IHSNot for ResaleNo reproduction or networking permitted without l
11、icense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and hand
12、books form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT O
13、F DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents
14、 are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the re
15、ferences cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-3
16、8535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processe
17、d as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form,
18、 fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction,
19、 and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Logic diagram. The logic diagram shal
20、l be as specified on figure 2. 3.2.4 Truth table. The truth table shall be as specified on figure 3. 3.2.5 Switching diagrams. The switching diagrams shall be as specified on figure 4. 3.2.6 Typical operating sequence. The typical operating sequence shall be as specified on figure 5. 3.3 Electrical
21、performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specifie
22、d in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86054 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL A
23、SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C VCC= 12 V Group A subgroups Device type Limits Unit unless otherwise specified Min Max High level output voltage, serial outputs VOHSIOUT= -100 A 1, 2, 3 All 10 V Low level output v
24、oltage, serial outputs VOLSIOUT= 100 A 1, 2, 3 All 1.5 V Low level output voltage, Q outputs VOLQIOUT= 50 mA 1, 2, 3 All 50 V Low level Q output current IOLVCC= 10.8 V, TA= +25C 2/ 1 All 50 mA VCC= 15 V, TA= +25C 2/ 80 High level input current IIHVIN= 12 V 1, 2, 3 All 5 A Low level input current IIL
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