DLA SMD-5962-81016 REV F-2006 MICROCIRCUIT DIGITAL CMOS PRESETTABLE BINARY DECADE UP DOWN COUNTER MONOLITHIC SILICON《硅单片可预置二进制 十进制 降值计数器 升值计数器 氧化物半导体数字微型电路》.pdf

《DLA SMD-5962-81016 REV F-2006 MICROCIRCUIT DIGITAL CMOS PRESETTABLE BINARY DECADE UP DOWN COUNTER MONOLITHIC SILICON《硅单片可预置二进制 十进制 降值计数器 升值计数器 氧化物半导体数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-81016 REV F-2006 MICROCIRCUIT DIGITAL CMOS PRESETTABLE BINARY DECADE UP DOWN COUNTER MONOLITHIC SILICON《硅单片可预置二进制 十进制 降值计数器 升值计数器 氧化物半导体数字微型电路》.pdf（16页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Remove vendor FSCM 04713. Editorial changes throughout. 84-03-19 N. A. Hauck B Add vendor FSCM 27014. Device 01FX inactive for new design. Editorial changes throughout. 86-03-03 N. A. Hauck C Convert to military drawing format. Device 01FX inacti

2、ve for new design. Add IOHand IOLto table I and delete minimum limits for tr. Editorial changes throughout. 86-06-09 N. A. Hauck D Add device type 02 and vendor CAGE 34371. Delete vendor CAGE 31019. Changes to 1.3, 1.4, table I, and table II. Change in military drawing format. Change drawing CAGE co

3、de to 67268. Editorial changes throughout. 90-06-26 Monica Poelking E Technical changes in 1.4 and table I. Editorial changes throughout. 92-04-07 M. A. Frye F Update boilerplate to MIL-PRF-38535 requirements. - LTG 06-08-24 Thomas M. Hess THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN CHANGED. CU

4、RRENT CAGE CODE IS 67268 REV SHEET REV F SHEET 15 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY J. R. Baker DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY C. R. Jackson COLUMBUS, OHIO 43218-3990 http:/www.dsc

5、c.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY R. P. Evans MICROCIRCUIT, DIGITAL, CMOS, PRESETTABLE BINARY/DECADE UP/DOWN COUNTER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 81-07-01 MONOLITHIC SILICON AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933

6、81016 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E603-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97

7、1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 81016 01 E A Drawing number Device

8、type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 4029B Presettable binary/decade up/down counter 02 4029B Presettable binary/decade up/down counter 1.2.2 Case o

9、utlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1

10、.3 Absolute maximum ratings. Supply voltage range (VDD), device type 01 . -0.5 V dc to +18.0 V dc Supply voltage range (VDD), device type 02 . -0.5 V dc to +20.0 V dc Input voltage range -0.5 V dc to VDD+ 0.5 V dc DC input current. 10 mA Storage temperature range (TSTG) . -65C to +150C Maximum power

11、 dissipation (PD) . 500 mW 1/ Lead temperature (soldering, 10 seconds). +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VDD), device type 01 . +3.0 V dc to +15.0 V dc Supply voltage range

12、 (VDD), device type 02 . +3.0 V dc to +18.0 V dc Case operating temperature range (TC). -55C to +125C Input rise or fall time (tr, tf): TC= +25C, VDD= 5 V dc 15.0 s TC= -55C, +125C, VDD= 5 V dc . 15.0 s TC= +25C, VDD= 10 V dc. 10.0 s TC= -55C, +125C, VDD= 10 V dc . 15.0 s TC= +25C, VDD= 15 V dc. 5.0

13、 s TC= -55C, +125C, VDD= 15 V dc . 15.0 s 1/ For TC= +100C to +125C, derate linearly at 12 mW/C to 200 mW. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-

14、3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions Continued. Minimum setup time, CARRY IN (ts1): TC= +25C, VDD= 5 V dc, device type 01 360 ns TC= +25C, VDD= 5 V dc, device type 02 200 ns TC= -55C, +125C, VDD= 5 V dc, device type 02 300 ns TC= +25C, VDD= 10 V dc

15、, device type 02 70 ns TC= -55C, +125C, VDD= 10 V dc, device type 02 105 ns TC= +25C, VDD= 15 V dc, device type 02 60 ns TC= -55C, +125C, VDD= 15 V dc, device type 02 90 ns Minimum setup time, B/D or U/D (ts2): TC= +25C, VDD= 5 V dc, device type 01 360 ns TC= +25C, VDD= 5 V dc, device type 02 340 ns

16、 TC= -55C, +125C, VDD= 5 V dc, device type 02 510 ns TC= +25C, VDD= 10 V dc, device type 02 140 ns TC= -55C, +125C, VDD= 10 V dc, device type 02 210 ns TC= +25C, VDD= 15 V dc, device type 02 100 ns TC= -55C, +125C, VDD= 15 V dc, device type 02 150 ns Minimum clock pulse width (tw1): TC= +25C, VDD= 5

17、 V dc, device type 01 250 ns TC= -55C, +125C, VDD= 5 V dc, device type 01 350 ns TC= +25C, VDD= 5 V dc, device type 02 180 ns TC= -55C, +125C, VDD= 5 V dc, device type 02 270 ns TC= +25C, VDD= 10 V dc, device type 02 90 ns TC= -55C, +125C, VDD= 10 V dc, device type 02 135 ns TC= +25C, VDD= 15 V dc,

18、device type 02 60 ns TC= -55C, +125C, VDD= 15 V dc, device type 02 90 ns Minimum PRESET ENABLE pulse width (tw2): TC= +25C, VDD= 5 V dc, device type 01 250 ns TC= -55C, +125C, VDD= 5 V dc, device type 01 375 ns TC= +25C, VDD= 5 V dc, device type 02 130 ns TC= -55C, +125C, VDD= 5 V dc, device type 02

19、 195 ns TC= +25C, VDD= 10 V dc, device type 02 70 ns TC= -55C, +125C, VDD= 10 V dc, device type 02 105 ns TC= +25C, VDD= 15 V dc, device type 02 50 ns TC= -55C, +125C, VDD= 15 V dc, device type 02 75 ns Minimum hold time, CARRY IN (th): TC= +25C, VDD= 5 V dc, device type 02 50 ns TC= -55C, +125C, VD

20、D= 5 V dc, device type 02 75 ns TC= +25C, VDD= 10 V dc, device type 02 35 ns TC= -55C, +125C, VDD= 10 V dc, device type 02 52 ns TC= +25C, VDD= 15 V dc, device type 02 25 ns TC= -55C, +125C, VDD= 15 V dc, device type 02 38 ns Provided by IHSNot for ResaleNo reproduction or networking permitted witho

21、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions Continued. Maximum input clock frequency (fMAX): TC= +25C, VDD= 5 V dc, device type 01 1.5 M

22、Hz TC= -55C, +125C, VDD= 5 V dc, device type 01. 2.0 MHz TC= +25C, VDD= 5 V dc, device type 02 2.0 MHz TC= -55C, +125C, VDD= 5 V dc, device type 02. 1.15 MHz TC= +25C, VDD= 10 V dc, device type 01 4.0 MHz TC= -55C, +125C, VDD= 10 V dc, device type 01. 2.6 MHz TC= +25C, VDD= 15 V dc, device type 01 5

23、.5 MHz TC= -55C, +125C, VDD= 15 V dc, device type 01. 3.6 MHz Minimum PRESET ENABLE removal time (trem): TC= +25C, VDD= 5 V dc, device type 01 450 ns TC= -55C, +125C, VDD= 5 V dc, device type 01. 700 ns TC= +25C, VDD= 5 V dc, device type 02 200 ns TC= -55C, +125C, VDD= 5 V dc, device type 02. 300 ns

24、 TC= +25C, VDD= 10 V dc, device type 02 110 ns TC= -55C, +125C, VDD= 10 V dc, device type 02. 165 ns TC= +25C, VDD= 15 V dc, device type 02 80 ns TC= -55C, +125C, VDD= 15 V dc, device type 02. 120 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specif

25、ication, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Spe

26、cification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings

27、. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the tex

28、t of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without lice

29、nse from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JA

30、N class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accorda

31、nce with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the de

32、vice. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions sh

33、all be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2.

34、3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Timing diagrams. The timing diagrams shall be as specified on figure 4. 3.2.6 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 5. 3.3 Electrical performance c

35、haracteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. T

36、he electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compli

37、ance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of complian

38、ce. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 and QML-38535 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufa

39、cturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of chang

40、e. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall b

41、e made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97

42、 TABLE I. Electrical performance characteristics. Test Symbol Test conditions -55C TC +125C unless otherwise specified Device type Group A subgroups Limits Unit Min Max 1, 3 5.0 VIN= 0.0 V or VDDVDD= 5.0 V 1/ All 2 150.0 1, 3 10.0 VIN= 0.0 V or VDDVDD= 10.0 V 2/ 02 2 300.0 1, 3 20.0 VIN= 0.0 V or VD

43、DVDD= 15.0 V 1/ All 2 600.0 1, 3 100.0 Quiescent supply current IDDVIN= 0.0 V or VDDVDD= 20.0 V 3/ 02 2 3000.0A VDD= 5.0 V 2/ All 1, 2, 3 0.05 VDD= 10.0 V 2/ 02 1, 2, 3 0.05 Low-level output voltage VOLVIN= 0.0 V or VDD| IO| 1 A VDD= 15.0 V All 1, 2, 3 0.05 V VDD= 5.0 V 2/ All 1, 2, 3 4.95 VDD= 10.0

44、 V 2/ 02 1, 2, 3 9.95 High-level output voltage VOHVIN= 0.0 V or VDD| IO| 1 A VDD= 15.0 V All 1, 2, 3 14.95 V VDD= 5.0 V VO= 0.5 V or 4.5 V All 1, 2, 3 1.5 VDD= 10.0 V VO= 1.0 V or 9.0 V 2/ 02 1, 2, 3 3.0 Low-level input voltage VILVDD= 15.0 V VO= 1.5 V or 13.5 V All 1, 2, 3 4.0 V VDD= 5.0 V VO= 0.5

45、 V or 4.5 V All 1, 2, 3 3.5 VDD= 10.0 V VO= 1.0 V or 9.0 V 2/ 02 1, 2, 3 7.0 High-level input voltage VIHVDD= 15.0 V VO= 1.5 V or 13.5 V All 1, 2, 3 11.0 V 1 0.51 2 1/ 0.36 VDD= 5.0 V VO= 0.4 V VIN= 0.0 V or VDDAll 3 1/ 0.64 1 1.3 2 0.9 VDD= 10.0 V 2/ VO= 0.5 V VIN= 0.0 V or VDD02 3 1.6 1 3.4 2 2.4

46、Low-level output current IOLVDD= 15.0 V 2/ VO= 1.5 V VIN= 0.0 V or VDDAll 3 4.2 mA See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 81016 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

47、 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Test conditions -55C TC +125C unless otherwise specified Device type Group A subgroups Limits Unit Min Max 1 -0.2 2 -0.14 VDD= 5.0 V VO= 4.6 V VIN= 0.0 V or VDDAll 3 -0

48、.25 1 -1.6 2 2/ -1.15 VDD= 5.0 V VO= 2.5 V VIN= 0.0 V or VDD02 3 2/ -2.0 1 -1.3 2 -0.9 VDD= 10.0 V 2/ VO= 9.5 V VIN= 0.0 V or VDD02 3 -1.6 1 -1.5 2 -1.1 High-level output current IOHVDD= 15.0 V 2/ VO= 13.5 V VIN= 0.0 V or VDDAll 3 -1.8 mA 1, 3 0.1 VDD= 15.0 V VIN= 0.0 V or VDD01 2 1.0 1, 3 0.1 Input current IINVDD= 20.0 V 3/ VIN= 0.0 V or VDD02 2 1.0 A Input capacitance CINVIN= 0.0 V, TC= +25C See 4.3.1c All 4 7.5 pF Functional tests See 4.3.1d All 7, 8 9 20 450.0 01 10, 11 30 650.0 9 1.5 500.0 VDD= 5.0 V 02 10, 11 1.5 750.0 9 1.5 240