DLA SMD-5962-78008 REV H-2005 MICROCIRCUIT DIGITAL MOS CLOCK DRIVERS MONOLITHIC SILICON《硅单片金属氧化半导体时钟脉冲驱动器 数字微型电路》.pdf

《DLA SMD-5962-78008 REV H-2005 MICROCIRCUIT DIGITAL MOS CLOCK DRIVERS MONOLITHIC SILICON《硅单片金属氧化半导体时钟脉冲驱动器 数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-78008 REV H-2005 MICROCIRCUIT DIGITAL MOS CLOCK DRIVERS MONOLITHIC SILICON《硅单片金属氧化半导体时钟脉冲驱动器 数字微型电路》.pdf（9页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Change to military drawing format. Page 4, table I, delete 500 pF tests for rise and fall times. Change limit for fall times. 86-10-30 M. A. Frye D Add device type 02 to drawing. 87-06-22 M. A. Frye E Add vendor CAGE 04713 for devices 02CX, 02GX,

2、 and 02PX. Remove vendor CAGE 27014 for device 02. Add case outline D-4. Make changes to table I and figure 1. Make changes to 1.3, 1.4, and editorial changes throughout. Placed 01CX device back on drawing and changed status to not available from an approved source. 89-01-27 M. A. Frye F Add vendor

3、CAGE 27014 for device types 02CX and 02GX. Remove vendor CAGE 04713 from drawing. Device type 02PX not available from an approved source. Editorial changes throughout. Change limits for IIL, tPHL, tPLH, and tr. 90-10-31 M. A. Frye G For device type 02, correct test conditions of VOLtest. Update draw

4、ing to current requirements. - drw 04-04-14 Raymond Monnin H Add to figure 1, device type 01, P package terminal connections. Editorial changes throughout. - drw 05-03-08 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS R

5、EV H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 PMIC N/A PREPARED BY Joseph A. Kerby DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles E. Besore COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael

6、A. Frye MICROCIRCUIT, DIGITAL, MOS CLOCK DRIVERS,AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 78-07-21 MONOLITHIC SILICON AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 14933 78008 SHEET 1 OF 8 DSCC FORM 2233 APR 97 5962-E210-05 Provided by IHSNot for ResaleNo reproduction or networki

7、ng permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B

8、 microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 78008 01 C A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify th

9、e circuit function as follows: Device type Generic number Circuit function 01 0056 MOS clock driver, with VBBconnection 1/ 02 0026 MOS clock driver 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C

10、 GDIP1-T14 or CDIP2-T14 14 dual-in-line G MACY1-X8 8 can P GDIP1-T8 or CDIP2-T8 8 dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage (V+ - V-) 22 V dc Input voltage (VIN- V-) 5.5 V dc Storage temperature. -65C to

11、 +150C Maximum power dissipation (PD), TA= +25C: Case C 1380 mW Case G 1150 mW Case P 830 mW Lead temperature (soldering 10 seconds) +300C Thermal resistance, junction-to-case (JC): Cases C, G, and P See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA). 150C/W Junction temperature (TJ) . +1

12、75C Peak output current 1.5 A Input current . 100 mA 1.4 Recommended operating conditions. Supply voltage (V+ - V-) 10 V dc to 20 V dc Ambient operating temperature range (TA) . -55C to +125C 1/ Device type 01 is provided with back bias voltage (VBB) connection to supply a higher voltage to the outp

13、ut stage. This aids in pulling up the output when it is in the high state. An external resistor tied between these extra pins and a supply higher than V+ will cause the output to pull up to (V+ - 0.1 V) in the off-state. Provided by IHSNot for ResaleNo reproduction or networking permitted without li

14、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks

15、form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. 2.1 Government specificat

16、ion, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-3853

17、5 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Draw

18、ings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedenc

19、e. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirement

20、s. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has

21、 been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modificatio

22、ns to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2

23、 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall

24、 be as specified on figure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test

25、 requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78008 DEFENSE SUPPLY CENTER COLUMBUS COL

26、UMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max High level output voltage VOHVIN- V- = 0.4 V, RBB= 1 k, VBB V+ +

27、1.0 V 1, 2, 3 01 V+ -0.3 V IN- V- = 0.4 V, IL= -100 A 02 V+ -1.0 Low level output voltage VOLVIN- V- = 2.4 V, IL= -100 A 1, 2, 3 All V- +1.0 V High level input current IIHVIN- V- = 2.4 V 1, 2, 3 All 15 mA Low level input current IILVIN- V- = 0 V 1, 2, 3 All -15 A Supply current, “ON” ICC(ON)V+ - V-

28、= 20 V, VIN- V- = 2.4 V 1, 2, 3 01 30 mA 02 40 High level input voltage VIHVOUT= V- +1.0 V 1, 2, 3 All 2.0 V Low level input voltage VILVOUT= V+ -1.0 V 1, 2, 3 All 0.4 V Turn on delay tPHLCL= 1,000 pF 2/ 9, 10, 11 All 5.0 17 ns Turn off delay tPLHCL= 1,000 pF 2/ 9, 10, 11 All 5.0 18 ns Rise time trC

29、L= 1,000 pF 2/, 3/ 9 All 35 ns 10, 11 38 Fall time tfCL= 1,000 pF 2/ 9 All 30 ns 10, 11 35 1/ These specifications apply for V+ - V- = 10 V to 20 V. 2/ Subgroups 10 and 11 if not tested, shall be guaranteed ti the limits specified in table I. 3/ Rise time is transition from logic “0” to logic “1” wh

30、ich is voltage fall. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 Device types 01 02 Case outlines C

31、 G P C G P Terminal number Terminal symbol 1 NC OUTPUT A VBBA NC OUTPUT A NC 2 VBBA VBBA INPUT A NC NC INPUT A 3 OUTPUT A INPUT A V- OUTPUT A INPUT A V- 4 NC V- INPUT B NC V- INPUT B 5 INPUT A INPUT B OUTPUT B INPUT A INPUT B OUTPUT B 6 NC VBBB VBBB NC NC V+ 7 V- OUTPUT B V+ V- OUTPUT B OUTPUT A 8 N

32、C V+ OUTPUT A NC V+ NC 9 NC - - - - - - NC - - - - - - 10 INPUT B - - - - - - INPUT B - - - - - - 11 NC - - - - - - NC - - - - - - 12 OUTPUT B - - - - - - OUTPUT B - - - - - - 13 VBBB - - - - - - NC - - - - - - 14 V+ - - - - - - V+ - - - - - - FIGURE 1. Terminal connections. Provided by IHSNot for R

33、esaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The

34、 part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall

35、be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (se

36、e 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance

37、 as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acqu

38、iring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance wi

39、th MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition

40、 A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accorda

41、nce with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. Provided by IH

42、SNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements

43、 Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1,

44、2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The f

45、ollowing additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in

46、 table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The te

47、st circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleN

48、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in a

49、ccordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replac