DLA SMD-5962-76033 REV E-2006 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL DATA SELECTOR MULTIPLEXER MONOLITHIC SILICON《硅单片数据选择器 多路复用器肖脱基小功率TTL双极数字微型电路》.pdf
《DLA SMD-5962-76033 REV E-2006 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL DATA SELECTOR MULTIPLEXER MONOLITHIC SILICON《硅单片数据选择器 多路复用器肖脱基小功率TTL双极数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-76033 REV E-2006 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL DATA SELECTOR MULTIPLEXER MONOLITHIC SILICON《硅单片数据选择器 多路复用器肖脱基小功率TTL双极数字微型电路》.pdf(10页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Add vendor, FSCM 04713. Delete min limits from IILand propagation delays. Editorial changes throughout. 86-02-25 N. A. HAUCK C Delete vendor CAGES: 18324, 34335, 07263, and 27014. Add LCC, outline letter 2, to case outlines. Table I, change: IIL,
2、 low level input current at “A, B, or C“ to “A or B“. ICC, 8 mA max to 11 mA max. tPHL1, (CL= 15 pF, subgroup 9) = 12 ns to 15 ns. (Subgroups 10, 11) = 17 ns to 21 ns. (CL= 50 pF, subgroup 9 ) = 17 ns to 18 ns. tPHL2, (CL= 15 pF, subgroup 9) = 18 ns to 24 ns. (subgroups 10, 11) = 25 ns to 34 ns. (CL
3、= 50 pF, subgroups 9) = 23 ns to 27 ns. (Subgroups 10, 11) = 35 ns to 38 ns. Revise to military drawing format. Add logic diagram. Change CAGE number to 67268. 87-10-26 M. A. FRYE D Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 03-05-06 R. MONNIN E
4、Make correction to the 3.5 Marking paragraph to remove the 5962- option. Under VOLtest in Table I, change IOHto IOL. Under the propagation delay tests in Table I, correct VCClimit to 5.0 V instead of 4.5 V. - ro 06-04-10 R. MONNIN CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS B
5、EEN REPLACED. REV SHET REV SHET REV STATUS REV E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY T. E. GORDON DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY ROBERT R. GONZALAS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE F
6、OR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-11-24 MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, DATA SELECTOR/MULTIPLEXER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 76033 SHEET 1 OF 9 DSCC FO
7、RM 2233 APR 97 5962-E289-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This dr
8、awing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76033 01 E X Drawing number Device type (see 1.2.1) Case outli
9、ne(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS158 Quad two-input data selector/multiplexer with enable 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1
10、835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings
11、. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ . 44 mW Lead temperature (soldering, 10 seconds) +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC): See M
12、IL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue t
13、o short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENT
14、S 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE
15、 SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of
16、 Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19
17、111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3.
18、REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manuf
19、acturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Manageme
20、nt (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when
21、 the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connection
22、s. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical
23、 performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. P
24、rovided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76033 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Sy
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