DLA SMD-5962-76017 REV H-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL DATA SELECTOR MULTIPLEXER MONOLITHIC SILICON《硅单片数据选择器 多路复用器肖脱基小功率TTL双极数字微型电路》.pdf

《DLA SMD-5962-76017 REV H-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL DATA SELECTOR MULTIPLEXER MONOLITHIC SILICON《硅单片数据选择器 多路复用器肖脱基小功率TTL双极数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-76017 REV H-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW-POWER SCHOTTKY TTL DATA SELECTOR MULTIPLEXER MONOLITHIC SILICON《硅单片数据选择器 多路复用器肖脱基小功率TTL双极数字微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED E Delete vendors: CAGE 18324, 34335, 27014, and 07263. Change tZH, tPHL1, tPLH1, tPHL2, tZL, and tLZ. Add logic diagram. Revise to military drawing format. -mlg 87-10-23 Michael A. Frye F Add case outline 2. Editorial changes throughout. -les 97-11

2、-28 Raymond Monnin G Update to reflect latest changes in format and requirements. Editorial changes throughout. -les 03-03-12 Raymond Monnin H Update to reflect latest changes in format and requirements. Correct paragraph in 3.5. Editorial changes throughout. les 05-08-02 Raymond Monnin THE ORIGINAL

3、 FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. CURRENT CAGE CODE 67268 REV SHET REV SHET REV STATUS REV H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Monica L. Grosel DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO

4、43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, LOW-POWER SCHOTTKY TTL, DATA SELECTOR/ AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-03-23 MULTIPLEXER, MONOLITHIC SILICON AMSC N/A

5、REVISION LEVEL H SIZE A CAGE CODE 14933 76017 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E400-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISIO

6、N LEVEL H SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following exam

7、ple: 76017 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 54LS253 Dual 4-line to 1-line data selector/multiplexer 1.2.2 Case outlin

8、es. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 2 CQCC1-N20 20 square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL

9、-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 4/ . 77 mW Lead temperature (soldering, 10 seconds) . +300C Thermal res

10、istance, junction-to-case (JC): See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc Maximum low level input voltage (VIL) 0.7 V dc Case operating tem

11、perature range (TC) -55C to +125C _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the pa

12、rameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Unused inputs must be held high or low. 4/ Maximum power dissipation is defined as VCCx ICCand must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for

13、ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks

14、. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manu

15、facturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard

16、 Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a co

17、nflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item

18、requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitio

19、nal certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements

20、herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction,

21、and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on fig

22、ure 1. 3.2.3 Truth table. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table

23、I and shall apply over the full case operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2

24、234 APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the P

25、IN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“

26、certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate o

27、f compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, a

28、ppendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option

29、 to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76

30、017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHV

31、CC= 4.5 V, IOH= -1 mA VIN= 0.7 V or 2.0 V 1, 2, 3 All 2.5 V Low level output voltage VOLVCC= 4.5 V, IOL= 4 mA VIN= 0.7 V, or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VICVCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V Off-state output current IO(off)VCC= 5.5 V, VO= 2.7 V 1, 2, 3 All 20 A VIH= 2 V,

32、VO= 0.4 V 1, 2, 3 All -20 A High level input current IIH1VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A IIH2VCC= 5.5 V, VIH= 5.5 V 1, 2, 3 All 100 A Low level input current IILVCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All 400 A Short circuit output current IOSVCC= 5.5 V, VOUT= 0.0 V 1/ 1, 2, 3 All -6 -130 mA Supply c

33、urrent ICCVCC= 5.5 V, all inputs grounded 1, 2, 3 All 12 mA VCC= 5.5 V, output control at 4.5 V, all other inputs grounded 1, 2, 3 All 14 mA Functional tests See 4.3.1c 7 All tPHL19 All 20 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 3/ 10, 11 All 28 ns 25 Propagation delay time, data to Y 2/ CL= 50 pF 1

34、0% 10, 11 All 38 ns tPLH19 25 CL= 15 pF 10% 3/ 10, 11 All 35 ns 30 CL= 50 pF 10% 10, 11 All 45 ns tPHL29 32 CL= 15 pF 10% 3/ 10, 11 All 45 ns 37 Propagation delay time, select to Y CL= 50 pF 10% 10, 11 All 56 ns tPLH29 45 CL= 15 pF 10% 3/ 10, 11 All 63 ns 50 CL= 50 pF 10% 10, 11 All 70 ns See footno

35、tes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance ch

36、aracteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max tZH9 All 28 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 3/ 10, 11 All 39 ns 46 Output enable time, control to Y 2/ CL= 50 pF 10% 10, 11 All 69 ns tZL9 23 CL= 15 pF

37、10% 3/ 10, 11 All 32 ns 28 CL= 50 pF 10% 10, 11 All 42 ns tHZ9 41 CL= 5 pF 10% 3/ 10, 11 All 57 ns 46 Output disable time, control to Y CL= 50 pF 10% 10, 11 All 69 ns tLZ9 27 CL= 5 pF 10% 3/ 10, 11 All 38 ns 32 CL= 50 pF 10% 10, 11 All 48 ns 1/ The output conditions have been chosen to produce a cur

38、rent that closely approximates one half of the true short-circuit output current IOS. Not more than one output will be tested at a time, and the duration of the test condition shall not exceed one second. 2/ Propagation delay time testing testing may be performed using either CL= 5 pF, CL= 15 pF, or

39、 CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. 3/ Parameters are guaranteed, if not tested. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD M

40、ICROCIRCUIT DRAWING SIZE A 76017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 Case outlines E and F 2 Terminal number Terminal symbol 1 1 G NC 2 B 1 G 3 1C3 B 4 1C2 1C3 5 1C1 1C2 6 1C0 NC 7 1Y 1C1 8 GND 1C0 9 2Y 1Y 10 2C0 GND 11 2C1 NC 12 2C

41、2 2Y 13 2C3 2C0 14 A 2C1 15 2 G 2C2 16 VCCNC 17 - - - 2C3 18 - - - A 19 - - - 2 G 20 - - - VCCFIGURE 1. Terminal connections. SELECT INPUTS DATA INPUTS OUTPUT CONTROL OUTPUT B A C0 C1 C2 C3 G Y X X X X X X H Z L L L X X X L L L L H X X X L H L H X L X X L L L H X H X X L H H L X X L X L L H L X X H

42、X L H H H X X X L L L H H X X X H L H Address inputs A and B are common to both sections. H = high level, L = low level, X = irrelevant, Z = high impedance (off). FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCI

43、RCUIT DRAWING SIZE A 76017 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76017 DEF

44、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004

45、 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revisi

46、on level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interi

47、m and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-

48、883, method 5005, table I) Interim electrical parameters (method 5004) - - - Final electrical test parameters (method 5004) 1*, 2, 3, 9 Group A test requirements (method 5005) 1, 2, 3, 7, 9, 10*, 11* Groups C and D end-point electrical parameters (method 5005) 1, 2, 3 * PDA applies to subgroup 1. * Subgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspecti