DLA SMD-5962-13214-2013 MICROCIRCUIT LINEAR 19 MHz 40 V LOW POWER QUAD OPERATIONAL AMPLIFIER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET 15 16 17 18 19 20 21 22 23 24 REV STATUS REV OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRC
2、UIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY CHARLES F. SAFFLE MICROCIRCUIT, LINEAR, 19 MHz, 40 V, LOW POWER, QUAD OPERATIONAL AMPLIFIER, MONOLITHIC SILICON DRAWING APPROVAL DATE 13-07-25 AMSC N/A RE
3、VISION LEVEL SIZE A CAGE CODE 67268 5962-13214 SHEET 1 OF 24 DSCC FORM 2233 APR 97 5962-E199-13 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-13214 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION L
4、EVEL SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device class Q ) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identif
5、ying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 F 13214 01 V X C Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Cas
6、e outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). Th
7、e device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 ISL70444SEH Radiation hardened, 19 MHz, 40 V, low power, quad operational amplifier 1.2.3 Device class designator. The device class designator is a single letter identifying the product assuranc
8、e level as follows: Device class Device requirements documentation Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X See figure 1 14 Flat
9、 pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-13214 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVI
10、SION LEVEL SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ Maximum supply voltage . 42 V Maximum differential input current . 20 mA Maximum differential input voltage 42 V or VS 0.5 V to +VS+ 0.5 V Minimum/maximum input voltage 42 V or VS 0.5 V to +VS+ 0.5 V Maximum/minimum current fo
11、r input voltage +VSor VS20 mA Electrostatic discharge (ESD) ratings: Human body model (HBM) . 2 kV Machine model (MM) 200 V Charged device model (CDM) 750 V Maximum junction temperature range (TJ) +150C Storage temperature range (TSTG) . -65C to +150C Thermal resistance, junction to case (JC) 9C/W 2
12、/ Thermal resistance, junction to ambient (JA) . 35C/W 3/ 1.4 Recommended operating conditions. Single supply voltage (VS) 3 V 10% to 36 V 10% Split rail supply voltage (VS) . 1.5 V 10% to 18 V 10% Ambient operating temperature range (TA) -55C to +125C 1.5 Radiation features. Maximum total dose avai
13、lable (dose rate = 50 300 rads(Si)/s) . 300 krads(Si) 4/ Maximum total dose available (dose rate 0.010 rad(Si)/s) 50 krads(Si) 4/ Single event phenomenon (SEP): No Single event latchup (SEL) occurs at effective LET (see 4.4.4.2) 86.4 MeV/mg/cm25/ No Single event burnout (SEB) occurs at effective LET
14、 (see 4.4.4.2) . 86.4 MeV/mg/cm25/ _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ For JC, the “case temperature” location is the center of the package underside. 3/
15、JAis measured with the component mounted on a low effective thermal conductivity test board in free air. 4/ Device radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883, method 1019, condition A to a maximum total dose of 300 krads(Si)
16、, and condition D to a maximum total dose of 50 krads(Si). 5/ Limits are characterized at initial qualification and after any design or process changes which may affect the SEP characteristics but are not production tested unless specified by the customer through the purchase order or contract. See
17、manufacturers SEE test report for more information. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-13214 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 4 DSCC FORM 2234 APR 97 2. APPLIC
18、ABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTME
19、NT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-
20、103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Non-Government
21、 publications. The following document(s) form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. ASTM INTERNATIONAL (ASTM) ASTM F1192 - Standard Guide for the Measurement of Single Event P
22、henomena (SEP) from Heavy Ion Irradiation of semiconductor Devices. (Copies of these documents are available online at http:/www.astm.org or from ASTM International, 100 Barr Harbor Drive, P.O. Box C700, West Conshohocken, PA, 19428-2959). 2.3 Order of precedence. In the event of a conflict between
23、the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted witho
24、ut license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-13214 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL SHEET 5 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-
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