DLA SMD-5962-03234 REV C-2013 MICROCIRCUIT HYBRID LINEAR 48 CHANNEL ANALOG MULTIPLEXER.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Added device type 02. Updated drawing to the reflect current requirements. -sld 06-01-05 Raymond Monnin B Added device type 03. -sld 08-02-20 Robert M. Heber C Added radiation hardness assurance requirements. Paragraph 1.3, corrected the positive
2、, negative, and VREFvoltages from “+20 V and -20 V“ to “+16.5 V and -16.5 V“. Table I; sheet 6, under the Group A subgroups column added footnote 4 for the Address input currents and Enable input current tests. Table I; sheet 7, under the Group A subgroups column added footnote 4 for all current tes
3、ts. Updated drawing paragraphs. -sld 13-04-30 Charles F. Saffle REV SHEET REV C C C C C C C C C SHEET 15 16 17 18 19 20 21 22 23 REV STATUS REV C C C C C C C C C C C C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg Cecil DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990
4、 http:/www.landandmaritime.dla.mil/ STANDARD MICROCIRCUIT DRAWING CHECKED BY Greg Cecil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raymond Monnin MICROCIRCUIT, HYBRID, LINEAR, 48 CHANNEL, ANALOG MULTIPLEXER AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 03-03-1
5、3 AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-03234 SHEET 1 OF 23 DSCC FORM 2233 APR 97 5962-E398-13Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03234 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1
6、Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are
7、 reflected in the PIN. 1.2 PIN. The PIN shall be as shown in the following example: 5962 F 03234 01 K X C Federal RHA Device Device Case Lead stock class designator type class outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 Ra
8、diation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device
9、type Generic number Circuit function 01 ACT8502 48 channel, voltage and current analog multiplexer, high impedance analog input with ESD protection 02 ACT8506 48 channel, voltage and current analog multiplexer, high impedance analog input 03 ACT8503 48 channel, analog multiplexer, high impedance ana
10、log input with ESD protection 1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Li
11、sting (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where
12、 non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but m
13、ay not test) periodic and conformance inspections (Group A, B, C, and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the
14、acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. Provided
15、by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03234 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator T
16、erminals Package style X See figure 1 96 Ceramic quad flat pack 1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ Positive supply voltage between +VCCand GND +16.5 V dc Negative supply voltage between -VEEand GND -16.5 V dc VREFto GND +16.5 V
17、 dc Digital input overvoltage range: VEN(pins 5, 6, 91, and 92) . ( GND - 4)V VA(pins 1, 3, 93, and 95). ( GND - 4)V VB(pins 2, 4, 94, and 96). ( GND - 4)V Analog input overvoltage range: Device types 01and 03 -18 V dc VS +18 V dc Device type 02 . -25 V dc VS +25 V dc Power dissipation (PD): Device
18、types 01 and 02 . 120 mW Device type 03 . 60 mW Thermal resistance junction-to-case (JC) . 10C/W 2/ Storage temperature range . -55C to +150C Lead temperature (soldering, 10 seconds) . +300C 1.4 Recommended operating conditions. Positive supply voltage (+VCC) +15 V dc 3/ Negative supply voltage (-VE
19、E) -15 V dc 3/ VREF. +5 V dc 3/ Logic low level voltage (VAL) . +0.8 V dc Logic high level voltage (VAH) . +4.0 V dc Case operating temperature range (TC) -55C to +125C 1.5 Radiation features. 4/ Maximum Total Ionizing Dose (TID) (dose rate = 50 - 300 rad(Si)/s) . 300 krad(Si) 5/ 6/ Enhanced Low Dos
20、e Rate Sensitvity (ELDRS) 150 krad(Si) 5/ Single Event Phenomenon (SEP) effective linear energy transfer (LET): Single Event Latchup (SEL) Immune 5/ Single Event Upset (SEU) . 86 MeV-cm2/mg 7/ Single Event Transient (SET) 86 MeV-cm2/mg 7/ 1/ Stresses above the absolute maximum ratings may cause perm
21、anent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Based on the maximum power dissipation spread over the multiplexer die. 3/ Recommended power supply turn on sequence : +VCC, -VEE, followed by VREF. 4/ See section 4.3.5 for the ma
22、nufacturers radiation hardness assurance analysis and testing. 5/ The only active element in these devices are purchased as SMD 5962F9563002V9A which assures TID, ELDRS, and SEL. 6/ The package in this drawing is a larger version of the same type (flat package) as the one in SMD 5962-95630, the lid
23、underside is nickel plate (no gold), and RGA data shows negligible amounts of hydrogen. 7/ SEU and SET testing performed at 86 MeV-cm2/mg with no upsets or single event transients. These devices will be re-tested after design or process changes that can affect RHA response of these devices. Provided
24、 by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-03234 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handboo
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