DLA MIL-PRF-28750 E-2008 RELAYS SOLID STATE GENERAL SPECIFICATION FOR.pdf

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1、 MIL-PRF-28750E 28 October 2008 SUPERSEDING MIL-PRF-28750D 1 February 1999 PERFORMANCE SPECIFICATION RELAYS, SOLID STATE, GENERAL SPECIFICATION FOR This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the g

2、eneral requirements for hermetically sealed or encapsulated solid-state relays (SSRs) (see 6.1), incorporating semiconductor, microelectronic, and passive circuit devices. 1.2 SSR classification. a. Class I (discrete) construction: SSR utilizing this type of technology, employs only discrete type co

3、mponents, which can be nonhermetically sealed. The completed SSR is hermetically sealed. b. Class II (hybrid) construction: SSR utilizing this type of technology, employs chip (die) and wire bond technology. The completed SSR is hermetically sealed. 1.3 Part or Identifying Number (PIN). The PIN will

4、 consist of the designator, the basic number of the specification sheet, an assigned dash number (see 3.1), and a screening level that indicates the level of quality and reliability (see 1.3.1). M 28750/5 -001 Y Designator Specification Dash Screening sheet number level (see 1.3.1) 1.3.1 Screening l

5、evel. The screening level is identified by a single letter, Y or W. Use screening level Y for high reliability applications (see 3.8); and screening level W for general purpose applications (see 4.4.4.5e and 4.6.1.2b). AMSC N/A FSC 5945 INCH-POUND Comments, suggestions or questions on this document

6、should be addressed to Defense Supply Center Columbus, ATTN: VAT, Post Office Box 3990, Columbus, OH 43218-3990, or emailed to (relaydla.mil). Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at http:/assist.daps.d

7、la.mil. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28750E 2 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited

8、in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3 and 4 of this speci

9、fication, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those

10、cited in the solicitation or contract. FEDERAL STANDARD FED-STD-H28 - Screw-Thread Standards for Federal Services. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-DTL-17 - Cable, Radio Frequency, Flexible and Semirigid, General Specification for. MIL-PRF-19500 - Semiconductor Devices, General Specification

11、 For. MIL-PRF-38534 - Hybrid Microcircuits, General Specification For. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Method Standard, Electronic and Electrical Component Parts. MIL-STD-750 - Test Methods for Semiconductor Devices. MIL-STD-790 - Standard Practice for Established Reliability and

12、High Reliability Qualified Products List (QPL) Systems for Electrical, Electronic, and Fiber Optic Parts Specifications. MIL-STD-883 - Test Method Standard Microelectronics. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http:/assist.dap

13、s.dla.mil/quicksearch/ or http:/assist.daps.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Non-Government publications. The following documents form a part of this document to the extent specified herein. Unless otherwise

14、specified, the issues of these documents are those cited in the solicitation or contract. ELECTRONIC INDUSTRIES ASSOCIATION (EIA) EIA-557 - Statistical Process Control Systems. (Applications for copies are available online at http:/www.eia.org/ or should be addressed to the ECA/EIA Standards and Tec

15、hnology, 2500 Wilson Boulevard, Arlington, VA 22201-3834). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28750E 3 INSTITUTE OF ELECTRICAL AND ELECTRONIC ENGINEERS (IEEE) IEEE-315A - Graphic Symbols for Electrical and Electronics Diagrams. (

16、Applications for copies are available online at http:/www.ieee.org/ or should be addressed to the Institute of Electrical and Electronic Engineers, 445 Hoes Lane, P. O. Box 1331, Piscataway, NJ 08854-1331.) 2.4 Order of precedence. In the event of a conflict between the text of this document and the

17、 references cited herein (except for related specification sheets), the text of this document takes precedence, unless otherwise noted. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Specification sheet

18、s. The individual item requirements shall be as specified herein and in accordance with the applicable specification sheet. In the event of conflict between requirements of this specification and the specification sheet, the latter shall govern. 3.2 Qualification. SSRs furnished under this specifica

19、tion shall be products which are authorized by the qualifying activity for listing on the applicable Qualified Products List (QPL) at the time of award of contract (see 4.4 and 6.3). 3.3 Quality system. The manufacturer shall establish and maintain a QPL system for parts covered by this specificatio

20、n. Requirements for this system are specified in MIL-STD-790. For class II SSRs, the manufacturers QPL system shall also address the requirements of appendix A and the qualifying activity for this specification may use pre-existing certification of the manufacturing facility in accordance with MIL-P

21、RF-38534 as an alternative. The manufacture shall also establish a component evaluations system as part of the MIL-STD-790 overall system in accordance with appendix B. 3.3.1 Statistical process control (SPC). As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish an SPC sys

22、tem that meets the requirements of EIA-557. 3.3.2 Electrostatic discharge (ESD) control program. As part of the overall MIL-STD-790 QPL system, the manufacturer shall establish and maintain an ESD control system. As a minimum, this plan must address the identification of ESD sensitive (ESDS) sub-com

23、ponents and end items, facilities, training, design protection, handling procedures, marking, cleaning, preservation, packaging, and verification. 3.4 Materials. Materials shall be as specified herein. However, when a definite material is not specified, a material shall be used which will enable the

24、 SSRs to meet the performance requirements of this specification. Materials used shall be self-extinguishing; and shall not support combustion, give off noxious gases in harmful quantities, give off gases in quantities sufficient to cause explosion of sealed enclosures, cause contamination to any pa

25、rt of the SSR, or form current carrying tracks when subjected to any of the tests specified herein. The selection of materials shall be such as to provide maximum shelf life. After qualification, any change of parts or material shall be submitted to the Government qualifying activity for approval. A

26、cceptance or approval of any constituent material shall not be construed as a guaranty of the acceptance of the finished product. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28750E 4 3.4.1 Metals and plating. Metals shall be of a corrosio

27、n-resistant type or shall be plated or treated to resist corrosion. Use of pure tin, plating or otherwise, is prohibited internally and externally (see 6.7.2b). Use of tin-lead finishes are acceptable provided that the minimum lead content is 3 percent. 3.5 Circuit element requirements for class II

28、SSRs. The requirements for circuit elements shall be in accordance with appendix B. 3.6 Interface and physical dimensions. SSRs shall meet the interface and physical dimensions specified (see 3.1). 3.6.1 Threaded parts. All threaded parts shall be in accordance with FED-STD-H28. Where practical, all

29、 threads shall be in conformity with the coarse-thread series. The fine-thread series may be used only for applications that show a definite advantage through their use. Where a special diameter-pitch combination is required, the thread shall be of American National Form and of any pitch between 16

30、and 36, which is used in the fine-thread series. Terminal threads shall be class 2A and class 2B for external and internal threads, respectively. 3.6.2 Envelope (case, cover, or enclosure). SSRs with metal cases shall be provided with means to permit assured contact to ground. The enclosure shall no

31、t be electrically connected to any terminal, except one provided specifically for grounding or as specified (see 3.1). 3.6.3 Sealing process. Sealed SSRs shall be dried, degassed, and backfilled (see 6.8) with an atmosphere and sealed by welding such that the requirements of this specification are m

32、et (see 3.9). Adjunct sealant, if used, shall comply with the following: a. Sealant shall not extend beyond 20 percent of the length of the exposed terminals above the glass meniscus. b. Trace color is permitted if it is a natural result of the sealant process. c. After curing, sealant shall form a

33、permanent nonconductive, noncracking seal under all relay environments. 3.6.4 Mounting means. Mounting means shall be as specified (see 3.1). 3.6.4.1 Socket. Plug-in SSRs shall be so designed that the weight of the SSR will be supported, and the stability of the mounting will be provided by means ot

34、her than the terminals. 3.6.5 Terminals (see 3.1). Terminals shall be as specified herein. 3.6.5.1 Solder-lug terminals. Solder-lug terminals shall be designed to accommodate two conductors, each rated to carry the maximum rated current of the contact or coil terminated. 3.6.5.2 Wire leads. Wire lea

35、ds shall be as specified (see 3.1). 3.6.5.3 Plug-in termination. Plug-in terminations shall conform to the arrangements or dimensions and interfaces necessary for proper mating with the associated connectors or sockets as specified (see 3.1). The mounting arrangement of the SSR and its corresponding

36、 socket shall be so designed that the entire weight of the SSR will be suspended and the stability of its mounting will be provided by an auxiliary mounting means other than the electrical terminals of the socket (see 3.1). During qualification, SSRs, with plug-in terminals shall have electrical tes

37、ts of section 4 and environmental tests of section 4 performed with the appropriate or specified socket or connector assembled to the SSR. For further guidance on lead finishes, see 6.7.2. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28750

38、E 5 3.6.5.4 Screw. Screw terminals shall be supplied with one nut, capable of engaging the screw by at least three full threads, two flat washers and one lock washer. The size of screw thread and length shall be as specified (see 3.1). At least three full threads of the screw shall visibly protrude

39、with all hardware tightened in place. 3.6.6 Circuit diagram. The circuit diagram as specified (see 3.1), shall be a terminal view. Circuit symbols shall be in accordance with IEEE-315A. For SSRs without an orientation tab, the circuit diagram as specified (see 3.1), shall be orientated so that when

40、the SSR is held with the circuit diagram right side up as shown in the appropriate specification sheet (see 3.1), and rotated away from the viewer about a horizontal axis through the diagram until the header terminals face the viewer, then each terminal shall be in the location shown on the circuit

41、diagram. 3.6.7 Temperature. Unless otherwise specified (see 3.1), the SSR shall operate satisfactorily throughout the temperature range of -55C to +125C, and shall not be damaged when stored at a temperature in the range of -55C to +125C. 3.6.8 Package. The outline dimensions of the package shall be

42、 as specified (see 3.1). In addition, the relay shall meet the following requirements. 3.6.8.1 Class I. Discrete technology SSRs supplied to this specification shall be sealed in glass, metal, or ceramic (or combination of these) packages. Adhesive or polymeric material shall not be used for package

43、 cover/lid attachment, seal, or repair. Use of any other package material shall require prior approval from the qualifying authority. 3.6.8.2 Class II. Hybrid technology SSRs supplied to this specification shall be hermetically sealed in glass, metal, or ceramic (or combinations of these) packages.

44、No adhesive or polymeric materials shall be used for package lid attach (or seal) or repair. Flux shall not be used in the final sealing process. The minimum distance between the glass to metal seals and the package sealing surface for seam welded packages after final seal shall be .040 inch (1.02 m

45、m) minimum. 3.6.8.3 Internal water vapor content. The internal water vapor content shall not exceed 5,000 parts per million at +100C. Polymer impregnation or secondary seal (backfill, coating, or other uses of organic polymeric materials to effect, improve, or repair the seal) of the SSR package sha

46、ll not be permitted. NOTE: Packages containing beryllia shall not be ground, sandblasted, machined, or have other operations performed on them which will produce beryllia or beryllium dust. Furthermore, beryllium oxide packages shall not be placed in acids that will produce fumes containing berylliu

47、m. 3.6.9 Metals. Metal surfaces shall be corrosion resistant or shall be plated or treated to resist corrosion and shall meet the requirements specified in 3.6.11. 3.6.10 Other materials. External parts, elements, or coatings including markings shall be non-nutrient to fungus and shall not blister,

48、crack, outgas, soften, flow, or exhibit defects that adversely affect storage, operation, or environmental capabilities of SSRs delivered to this specification under the specified test conditions. 3.6.11 Package and lead materials and finishes. 3.6.11.1 Lead or terminal material. A lead or terminal

49、material that enables the relay to meet all of the performance requirements of this specification shall be used. For further guidance on lead and terminal materials that meet the performance requirements of this specification, see 6.7.1. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-28750E 6 3.6.11.2 L