DLA MIL-PRF-19500 127 W-2012 SEMICONDUCTOR DEVICES DIODE SILICON VOLTAGE REGULATOR TYPES 1N4370A-1 THROUGH 1N4372A-1 AND 1N746A-1 THROUGH 1N759A-1 1N4370AUR-1 THROUGH 1N4372AUR-1 AG.pdf

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1、 MIL-PRF-19500/127W 6 July 2012 SUPERSEDING MIL-PRF-19500/127V 18 May 2010 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICES, DIODE, SILICON, VOLTAGE REGULATOR, TYPES 1N4370A-1 THROUGH 1N4372A-1 AND 1N746A-1 THROUGH 1N759A-1, 1N4370AUR-1 THROUGH 1N4372AUR-1 AND 1N746AUR-1 THROUGH 1N759AUR-1, 1N4

2、370C-1 THROUGH 1N4372C-1 AND 1N746C-1 THROUGH 1N759C-1, 1N4370CUR-1 THROUGH 1N4372CUR-1 AND 1N746CUR-1 THROUGH 1N759CUR-1, 1N4370D-1 THROUGH 1N4372D-1 AND 1N746D-1 THROUGH 1N759D-1, 1N4370DUR-1 THROUGH 1N4372DUR-1 AND 1N746DUR-1 THROUGH 1N759DUR-1, JAN, JANTX, JANTXV, JANHC, AND JANKC JANS level (se

3、e 6.4). This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1. SCOPE 1.1 Scope. This specification covers the performance requirem

4、ents for 500 milliwatt, silicon, voltage regulator diodes with voltage tolerances of 5, 2, and 1 percent. Three levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500. Two levels of product assurance is provided for each unencapsulated device. * 1.2

5、Physical dimensions. See figure 1 (DO-35), figure 2 (DO-213AA), and figures 3, 4, and 5 for die. 1.3 Maximum ratings. Maximum ratings are as shown in maximum and primary test ratings (see 3.9 herein) and as follows: * a. PTL= 500 mW, (DO-35) at TL= +50C, L = .375 inch (9.53 mm); both ends of case or

6、 diode body to heat sink at L = .375 inch (9.53 mm). Derate IZto 0 at +175C. b. PTEC= 500 mW, (DO-213AA) at TEC= +125C, derate to 0 at +175C. -65C TJ +175C; -65C TSTG +175C. c. PT(PCB)= 400 mW, TA= 55C. AMSC N/A FSC 5961 INCH-POUND * Comments, suggestions, or questions on this document should be add

7、ressed to DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIST Online database at https:/assist.dla.mil . The documentation

8、and process conversion measures necessary to comply with this document shall be completed by 6 October 2012. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/127W 2 * 1.4 Primary electrical characteristics. Primary electrical characteris

9、tics are as shown in maximum and primary test ratings (see 3.9 herein) and as follows: a. 2.4 V dc VZ 12 V dc. b. 1N4370A-1 through 1N4372A-1 and 1N746A-1 through 1N759A-1 are 5 percent voltage tolerance. c. 1N4370C-1 through 1N4372C-1 and 1N746C-1 through 1N759C-1 are 2 percent voltage tolerance. d

10、. 1N4370D-1 through 1N4372D-1 and 1N746D-1 through 1N759D-1 are 1 percent voltage tolerance. Thermal resistance: RJL= 250C/W maximum at L = .375 inch (9.53 mm) (DO-35). RJEC= 100C/W maximum. Junction to end-caps (DO-213AA). RJA= 300C/W junction to ambient including PCB see note. * NOTE: See figures

11、6, 7, and 8 for derating curves. TA= +75C for both axial and MELF (UR) on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-Oz Cu, horizontal, still air, pads (UR) = .067 inch (1.70 mm) x .105 inch (2.67 mm); pads (axial) = .092 inch (2.34 mm) diameter, strip = .030 inch (0.762 m

12、m) x 1 inch (25.4 mm) long, axial lead length L .187 inch ( 4.75 mm); RJA with a defined thermal resistance condition included is measured at IZ= as defined in the electrical characteristics table herein. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sect

13、ions 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must

14、 meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the exten

15、t specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semicon

16、ductor Devices. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or https:/assist. dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in

17、 the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for

18、 ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/127W 3 Symbol Dimensions Notes Inches Millimeters Min Max Min Max BD .055 .090 1.40 2.29 3 BL .120 .200 3.05 5.08 4 LD .018 .023 0.46 0.58 LL 1.000 1.500 25.40 38.10 LU .050 1.27 5 NOTES: 1. Dimensions are in i

19、nches. 2. Millimeters are given for general information only. 3. Dimension BD shall be measured at the largest diameter. 4. The BL dimension shall include the entire body including slugs. 5. Dimension LU shall include the sections of the lead over which the diameter is uncontrolled. This uncontrolle

20、d area is defined as the zone between the edge of the diode body and extending .050 inch (1.27 mm) onto the leads. 6. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 1. Physical dimensions for types 1N4370A-1 through 1N4372A-1, 1N4370C-1 through 1N4372C-1, 1N4370D-1 t

21、hrough 1N4372D-1, 1N746A-1 through 1N759A-1, 1N746C-1 through 1N759C-1, and 1N746D-1 through 1N759D-1 (DO-35). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/127W 4 Symbol Dimensions Inches Millimeters Min Max Min Max BL .130 .146 3.30

22、 3.71 BD .063 .067 1.60 1.71 ECT .016 .022 0.41 0.56 S .001 min 0.03 min NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 2. Physical dimensions for types 1N4370AUR-1 through

23、1N4372AUR-1, 1N4370CUR-1 through 1N4372CUR-1, 1N4370DUR-1 through 1N4372DUR-1, 1N746AUR-1 through 1N759AUR-1, 1N746CUR-1 through 1N759CUR-1, and 1N746DUR-1 through 1N759DUR-1 (DO-213AA). DO-213AAProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF

24、-19500/127W 5 (A version) Ltr Dimensions Inches Millimeters Min Max Min Max A .021 .025 0.53 0.63 B .013 .017 0.33 0.43 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. The physical characteristics of the die thickness are .010 .002 (0.25 mm 0.051 mm). Me

25、tallization is top = (anode)-AL, back: (cathode)-AU. AL thickness = 25,000 minimum, AU thickness = 4,000 minimum. FIGURE 3. Physical dimensions (JANHCA and JANKCA die dimensions). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/127W 6 (

26、B version) Ltr Dimensions Inches Millimeters Min Max Min Max A .024 .028 0.61 0.71 B .017 .021 0.43 0.53 NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. The physical characteristics of the die thickness are .010 .002 (0.25 mm 0.051 mm). Metallization is

27、top = (anode)-AL, back: (cathode)-AU. AL thickness = 40,000 minimum, AU thickness = 5,000 minimum. 4. Circuit layout data: For zener operation, cathode must be operated positive with respect to anode. FIGURE 4. Physical dimensions (JANHCB and JANKCB die dimensions). Provided by IHSNot for ResaleNo r

28、eproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/127W 7 Ltr Dimensions Inches Millimeters Min Max Min Max A .019 .023 0.48 0.58 B .013 .017 0.33 0.43 C .008 .012 0.20 0.30 NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Element

29、 evaluation accomplished utilizing TO-5 package. 3. The physical characteristics of the die thickness are .010 .002 (0.25 mm 0.05 mm). Metallization is top = (anode) - AL, back: (cathode) - AU AL thickness = 25,000 minimum. AU thickness = 4,000 minimum. * FIGURE 5. Physical dimensions, JANHCC and JA

30、NKCC die. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/127W 8 3. REQUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under thi

31、s specification shall be products that are manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list (QML) before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. The abbreviations, symbols, and defin

32、itions used herein are defined in MIL-PRF-19500, and as follows. EC - end-caps * 3.4 Interface and physical dimensions. The interface and physical dimensions shall be specified in MIL-PRF-19500 and figures 1 and 2 (DO-35 and DO-213AA), and figures 3, 4, and 5 (die) herein. 3.4.1 Lead finish. Lead fi

33、nish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). 3.4.2 Diode construction. All devices shall be metallurgically bonded double plug construction in accordance with the

34、requirements of category I, II, or III (see MIL-PRF-19500). 3.5 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturers identification and date code shall be marked on the devices. Initial container package marking shall be in accordance with MIL-PRF-19500. The polarity shall be in

35、dicated with a contrasting color band to denote the cathode end. The prefixes JAN, JANTX, and JANTXV can be abbreviated as J, JX, and JV, respectively. (example: The part number can be reduced to J746B1) No color coding shall be permitted for part numbering. 3.5.1 UR devices. For UR version devices

36、only, all marking, except polarity may be omitted from the body, but shall be retained on the initial container. Polarity marking of UR devices shall consist as a minimum, a band or 3 contrasting dots around the periphery of the cathode. 3.6 Selection of tight tolerance devices. The C and D suffix d

37、evices shall be selected from JAN, JANTX, or JANTXV devices, which have successfully completed all applicable screening, and groups A, B, and C testing as 5 percent tolerance devices. All sublots of C and D suffix devices shall pass table I, subgroup 2, at tightened tolerances. Tighter tolerances fo

38、r mounting clip temperature shall be maintained for reference purpose to establish correlation. For C and D tolerance levels, TL= +25C 2C at .375 inch (9.53 mm) from body, or zero inches for surface mount devices or equivalent. 3.7 Electrical performance characteristics. Unless otherwise specified h

39、erein, the electrical performance characteristics are as specified in 1.3, 1.4, tables I, II, and table III. 3.8 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I herein. 3.9 Maximum and primary test ratings. Maximum and primary test ratings f

40、or voltage regulator diodes are specified in table IV herein. 3.10 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and shall be free from other defects that will affect life, serviceability, or appearance. Provided by IHSNot for ResaleNo reproductio

41、n or networking permitted without license from IHS-,-,-MIL-PRF-19500/127W 9 4. VERIFICATION 4.1 Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3). c. Conformance inspection (see 4.4). 4

42、.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified herein. 4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In case qualification was awarded to a prior revision of the specifi

43、cation sheet that did not request the performance of table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on the first inspection lot of this revision to maintain qualification. 4.2.2 JANHC and JANKC devices. JANHC and JANKC devices

44、shall be qualified in accordance with appendix G of MIL-PRF-19500. 4.2.3 Construction verification. Cross sectional photos from three devices shall be submitted in the qualification report. 4.3 Screening (JAN, JANTX, and JANTXV levels only). Screening shall be in accordance with table E-IV of MIL-PR

45、F-19500 and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. Screen (see table E-IV of MIL-PRF-19500) Measurement JANTX and JANTXV levels 3a Temperature cycling (1) 3c Thermal im

46、pedance (see 4.3.2) 7a 7b Not applicable Optional 9 Not applicable 11 IR1and VZ2 12 See 4.3.3 (2) 13 IR1 100 percent of initial reading or 50 nA dc, whichever is greater. VZ2 2 percent initial reading. Subgroup 2 of table I herein. 14a (3) 14b Not applicable Required (1) Thermal impedance shall be p

47、erformed any time after sealing provided temperature cycling is performed in accordance with MIL-PRF-19500, screen 3 prior to this thermal test. (2) PDA = 5 percent for screen 13 applies to IR1and VZ2, and IR1and VZ2. Thermal impedance (ZJX) is not required in screen 13 of 4.3 herein. (3) For clear

48、glass diodes, the hermetic seal (gross leak) may be performed at anytime after temperature cycling. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/127W 10 4.3.1 Screening (JANHC and JANKC). Screening of JANHC and JANKC die shall be in accordance with appendix G of MIL-PRF-19500. 4.3.1.1 JAN product. JAN product will have temperature cycling and thermal impedance testing performed in accordance with MIL-PRF-19500, JANTX level screening requirements. * 4.3.2 Thermal impedance. The thermal imp