DLA MIL-PRF-19500 116 S-2012 SEMICONDUCTOR DEVICE DIODE SILICON SWITCHING TYPES 1N4148-1 1N4148UR-1 1N4148UB 1N4148UBCA 1N4148UBCC 1N4148UBCCC 1N4148UBD 1N4148UBCD 1N4148UB2 1N4148 .pdf

《DLA MIL-PRF-19500 116 S-2012 SEMICONDUCTOR DEVICE DIODE SILICON SWITCHING TYPES 1N4148-1 1N4148UR-1 1N4148UB 1N4148UBCA 1N4148UBCC 1N4148UBCCC 1N4148UBD 1N4148UBCD 1N4148UB2 1N4148 .pdf》由会员分享，可在线阅读，更多相关《DLA MIL-PRF-19500 116 S-2012 SEMICONDUCTOR DEVICE DIODE SILICON SWITCHING TYPES 1N4148-1 1N4148UR-1 1N4148UB 1N4148UBCA 1N4148UBCC 1N4148UBCCC 1N4148UBD 1N4148UBCD 1N4148UB2 1N4148 .pdf（23页珍藏版）》请在麦多课文档分享上搜索。

1、INCH-POUND MIL-PRF-19500/116S 6 July 2012 SUPERSEDING MIL-PRF-19500/116R w/AMENDMENT 2 15 July 2010 PERFORMANCE SPECIFICATION SHEET SEMICONDUCTOR DEVICE, DIODE, SILICON, SWITCHING, TYPES 1N4148-1, 1N4148UR-1, 1N4148UB, 1N4148UBCA, 1N4148UBCC, 1N4148UBCCC, 1N4148UBD, 1N4148UBCD, 1N4148UB2, 1N4148UB2R

2、, 1N914, 1N914UR, 1N4531, AND 1N4531UR, JAN, JANTX, JANTXV, JANHC, AND JANKC This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for acquiring the product described herein shall consist of this specification sheet and MIL-PRF-19500. 1

3、. SCOPE 1.1 Scope. This specification covers the performance requirements for switching diodes. Three levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for each unencapsulated device type. * 1.2 Physical dimensio

4、ns. See figures 1 (DO-35, DO-34), 2 (DO-213AA), 3 (UB), 4 (UB2), 5 (UBC), and 6 and 7 (die). * 1.3 Maximum ratings. Unless otherwise specified TA= +25C. Type VBRVRWMIO(PCB)TA= 75C (1) IFSMtp= 8.3ms TSTGpads for (UR) = .061 inch (1.55 mm) x.105 inch (2.67 mm); pads for axial = .092 inch (2.34 mm) dia

5、meter, strip = .030 inch (0.76 mm) x 1 inch (25.4 mm) long, lead length L 0.187 inch ( 4.75 mm); RJAwith a defined PCB thermal resistance condition included, is measured at IO= 200 mA dc. (4) RJSPrefers to thermal resistance from junction to the solder pads of the UB package. AMSC N/A FSC 5961 * Com

6、ments, suggestions, or questions on this document should be addressed to DLA Land and Maritime, ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductordla.mil. Since contact information can change, you may want to verify the currency of this address information using the ASSIS

7、T Online database at https:/assist.dla.mil . JANS1N4148-1 (see 6.4). Device types 1N914 and 1N4531 are inactive for new design. The documentation and process conversion measures necessary to comply with this document shall be completed by 6 October 2012. Provided by IHSNot for ResaleNo reproduction

8、or networking permitted without license from IHS-,-,-MIL-PRF-19500/116S 2 1.4 Primary electrical characteristics at TA= +25C, unless otherwise indicated. Type (1) VF1VF2IR1at VR= 20 V dc IR2at VR= 75 V dc 1N4148-1 1N914 1N4531 IFmA dc 10 10 10 V dc 0.8 0.8 0.8 IFmA dc 100 50 100 V dc 1.2 1.2 1.2 nA

9、dc 25 25 25 nA dc 500 500 500 Type (1) IR3at VR= 20 V dc TA= 150C IR4at VR= 75 V dc TA= 150C tfrat Vfr= 5.0 V dc (pk) and IF= 50 mA dc trr1N4148-1 1N914 1N4531 A dc 35 35 35 A dc 75 75 75 ns 20 20 20 ns 5 5 5 (1) Primary electrical characteristics for surface mount devices are equivalent to the corr

10、esponding non-surface mount devices unless otherwise noted. 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section does not include documents cited in other sections of this specification or recommended for a

11、dditional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they are listed. 2.2 Government

12、documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFE

13、NSE SPECIFICATIONS MIL-PRF-19500 - Semiconductor Devices, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-750 - Test Methods for Semiconductor Devices. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or https:/assist.dla.mil or from the Standa

14、rdization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes prece

15、dence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/116S 3 Types Dimensions Ltr Inches Millimeters Min Max M

16、in Max 1N4148-1 BD .056 .075 1.42 1.91 1N914 BL .140 .180 3.56 4.57 LD .018 .022 0.46 0.56 (DO-35) LL 1.000 1.500 25.40 38.10 1N4531 BD .050 .075 1.27 1.90 BL .080 .120 2.03 3.05 (DO-34) LD .018 .022 0.46 0.56 LL 1.000 1.500 25.40 38.10 NOTES: 1. Dimensions are in inches. Millimeters are given for g

17、eneral information only. 2. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. TYPES 1N4148-1, 1N914, AND 1N4531. FIGURE 1. Physical dimensions. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/116S 4 Symbol Dimensi

18、ons Inches Millimeters Min Max Min Max BD .063 .067 1.60 1.70 BL .130 .146 3.30 3.71 ECT .016 .022 0.41 0.56 S .001 0.03 NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Dimensions are pre-solder dip. 3. Referencing to dimension S, minimum clearance of glass

19、 body to mounting surface on all orientations. 4. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. TYPES 1N914UR, 1N4148UR-1, AND 1N4531UR. FIGURE 2. Physical dimensions (DO-213AA). DO-213AA Provided by IHSNot for ResaleNo reproduction or networking permitted without license

20、from IHS-,-,-MIL-PRF-19500/116S 5 Symbol Dimensions Symbol Dimensions Inches Millimeters Inches Millimeters Min Max Min Max Min Max Min Max BH .046 .056 1.17 1.42 LS1.035 .039 0.89 0.99 BL .115 .128 2.92 3.25 LS2.071 .079 1.80 2.01 BW .085 .108 2.16 2.74 LW .016 .024 0.41 0.61 CL .128 3.25 R .008 0.

21、20 CW .108 2.74 r1 .012 0.31 LL1 .022 .038 0.56 0.97 r2 .022 0.56 LL2 .017 .035 0.43 0.89 NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Ceramic package only. 3. Hatched areas on package denote metallized areas. Pad 4 = shielding, connected to the lid. 4.

22、In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 3. Physical dimensions, surface mount (UB versions). 1N4148UBCA 1N4148UBD 1N4148UB 1N4148UBCC 2 1 Ceramic Lid UB Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-1

23、9500/116S 6 Symbol Dimensions Symbol Dimensions Inches Millimeters Inches Millimeters Min Max Min Max Min Max Min Max BH .046 .056 1.17 1.42 LS .071 .079 1.80 2.01 BL .115 .128 2.92 3.25 LW .016 .024 0.41 0.61 BW .085 .108 2.16 2.74 r .008 TYP 0.20 TYP CL .128 3.25 r1 .012 TYP 0.31 TYP CW .108 2.74

24、r2 .022 TYP 0.56 TYP LL1 .022 .038 0.56 0.96 r3 .008 TYP 0.20 TYP LL2 .017 .035 0.43 0.89 r4 .012 TYP 0.31 TYP NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Ceramic package only. 3. Hatched areas on package denote metallized areas. Pad 4 = shielding, conn

25、ected to the lid. 4. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. FIGURE 4. Physical dimensions, surface mount (2 pin UB versions). POLARITY 1N4148UB2 1N4148UB2R UB Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-1

26、9500/116S 7 Symbol Dimensions Symbol Dimensions Inches Millimeters Inches Millimeters Min Max Min Max Min Max Min Max BH .046 .071 1.17 1.80 LS1.036 .040 0.91 1.02 BL .115 .128 2.92 3.25 LS2.071 .079 1.81 2.01 BW .085 .108 2.16 2.74 LW .016 .024 0.41 0.61 CL .128 3.25 r .008 .203 CW .108 2.74 r1 .01

27、2 .305 LL1 .022 .038 0.56 0.96 r2 .022 .559 LL2 .017 .035 0.43 0.89 NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Hatched areas on package denote metallized areas. 3. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. 4. Pin 4 is con

28、nected to lid braze ring. FIGURE 5. Physical dimensions, surface mount (UBC version, ceramic lid). Ceramic lid Ceramic 1N4148UBCCC 1N4148UBCD 2 1 3 1 2 3 Lid braze ring UBC Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/116S 8 Ltr Dime

29、nsions Inches Millimeters Min Max Min Max A .0059 .0061 .150 .155 B .0130 .0170 .330 .432 NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Element evaluation accomplished utilizing TO-5 package. 3. The physical characteristics of the die are: Metallization:

30、Top (anode): Al Back (cathode): Au Al thickness: 25,000 minimum. Gold thickness: 4,000 minimum. Chip thickness: .010 inches (0.25 mm) .002 inches (0.05 mm). FIGURE 6. Physical dimensions, JANHCA and JANKCA die. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

31、 IHS-,-,-MIL-PRF-19500/116S 9 Ltr Dimensions Inches Millimeters Min Max Min Max A .014 .018 .360 .460 B .005 .007 .120 .180 C .008 .012 0.20 0.30 NOTES: 1. Dimensions are in inches. Millimeters are given for general information only. 2. Element evaluation accomplished utilizing TO-5 package. 3. The

32、physical characteristics of the die are: Metallization: Top (anode): Al Back (cathode): Au Al thickness: 25,000 minimum. Gold thickness: 4,000 minimum. Chip thickness: .010 inches (0.25 mm) .002 inches (0.05 mm). * FIGURE 7. Physical dimensions, JANHCB and JANKCB die. Provided by IHSNot for ResaleNo

33、 reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/116S 10 3. REQUIREMENTS 3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein. 3.2 Qualification. Devices furnished under this specification shall be products that a

34、re manufactured by a manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list (QML) before contract award (see 4.2 and 6.3). 3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in

35、MIL-PRF-19500 and as follows. SP Solder pad on UB devices. VfrForward recovery voltage. Specified maximum forward voltage used to determine forward recovery time. * 3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in MIL-PRF-19500, and on figures 1 (axia

36、l leads), 2 (DO-213AA), 3 (UB), 4 (UB2), 5 (UBC), and 6 and 7 (die). 3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2). 3.4.2 Diode constr

37、uction. All devices (except UB version) shall be metallurgically bonded, double plug construction in accordance with the requirements of MIL-PRF-19500. All glass diodes shall be designed with sufficient thermal compensation in the axial direction to optimize tensile and compressive stresses. Dimensi

38、onal analysis is required of all materials used to achieve axial thermal compensation. Dimensional tolerances and corresponding coefficient of thermal expansion (CTE) shall be documented on the DSCC Design and construction Form 36D and shall be approved by the qualifying activity to maintain qualifi

39、cation. Dimensional tolerances shall be sufficiently tight enough to prevent excessive stresses due to the inherent CTE mismatch. The UB devices shall be eutectically mounted and wire bonded in a ceramic package. The UR version shall be structurally identical to the axial leaded versions except for

40、end-cap lead attachment. 3.5 Marking. Marking shall be in accordance with MIL-PRF-19500. Manufacturers identification and date code shall be marked on the devices. Initial container package marking shall be in accordance with MIL-PRF-19500. The polarity shall be indicated with a contrasting color ba

41、nd to denote the cathode end. The prefixes JAN, JANTX, and JANTXV can be abbreviated as J, JX, and JV, respectively. The part number may be reduced to J4148, JX4148, or JV4148. No color coding shall be permitted for part numbering. 3.5.1 UR devices. For UR version devices only, all marking, except p

42、olarity, may be omitted from the body, but shall be retained on the initial container. Polarity marking of UR devices shall consist as a minimum, a band or three contrasting dots around the periphery of the cathode. At the option of the manufacturer, UR surface mount devices may include laser markin

43、g on an end-cap, to include part number and lot date code for all levels. The prefixes JAN, JANTX, or JANTXV may be abbreviated as J, JX, or JV, respectively. (Example: The part number may be reduced to JV4148). 3.5.2 UB devices. UB devices do not require polarity marking. 3.6 Electrical performance

44、 characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in 1.3, 1.4, and table I. Electrical characteristics for surface mount versions are identical to the corresponding axial leaded versions unless otherwise specified. 3.7 Electrical test re

45、quirements. The electrical test requirements shall be as specified in table I herein. 3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and shall be free from other defects that will affect life, serviceability, or appearance. Provided by IHSNot f

46、or ResaleNo reproduction or networking permitted without license from IHS-,-,-MIL-PRF-19500/116S 11 4. VERIFICATION 4.1 Classification of inspections. The inspection requirements specified herein are classified as follows: a. Qualification inspection (see 4.2). b. Screening (see 4.3). c. Conformance

47、 inspection (see 4.4). 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified herein. 4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In case qualification was awarded to a prior

48、 revision of the specification sheet that did not require the performance of table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on the first inspection lot of this revision to maintain qualification. 4.3 Screening (JANTXV, JANTX, and JAN levels). Screening shall be in accordance with table E-IV of MIL-PRF-19500 and as specified herein. Specified electrical measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. S